EP2A70F1508C9ES - 3M Gates APEX II FPGA 1508-FCBGA | Altera
부품 번호: EP2A70F1508C9ES ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $248 | $24,800.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $199 | $199,000.00 |
EP2A70F1508C9ES 개요
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that can be configured by the customer after manufacturing to perform a wide range of digital logic functions, sitting in the semiconductor hierarchy between ASICs and CPLDs. FPGAs combine programmable logic elements, interconnect, and dedicated memory blocks, making them a sub-category of programmable logic devices (PLDs) within the broader integrated circuit family.
Key features include MultiCore architecture integrating logic, memory, and DSP building blocks, four Phase-Locked Loops (PLLs) for clock management, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, and GTL, and True-LVDS support for high-speed differential signaling. The device also supports up to 24 megabytes of external memory via dedicated interfaces.
The APEX II architecture combines a fine-grained embedded structure with Look-Up Tables (LUTs), product-term logic, and embedded system blocks (ESBs) that can implement dual-port RAM, ROM, FIFO, and CAM functions. This hybrid architecture allows efficient mapping of both datapath and control logic on the same die. Embedded multipliers accelerate DSP operations, while the four PLLs provide flexible clock synthesis and skew management.
Typical applications include telecommunications infrastructure, high-speed data switching, ASIC prototyping, parallel DSP processing, and embedded computing platforms where high I/O count and substantial logic density are required. The wide I/O count of 1,060 makes it suitable for parallel data-path and protocol-bridging designs.
When designing with this device, careful attention must be paid to power distribution network design because the 1.5 V core and multiple I/O banks each require separate decoupling. The flip-chip BGA package demands controlled-impedance PCB layout with matched-length traces for LVDS and clock signals.
This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering recommendations sourced from the Altera APEX II datasheet and live distributor listings, providing a more comprehensive engineering reference than the manufacturer's datasheet alone.
드롭인 대체품: EP2A70F1508C9ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70F1508C9ES (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70F1508C9
✅ 드롭인✓ 재고 있음
$1310 / 개
데이터시트 보기 →EP2A70F1508C8
✅ 드롭인✓ 재고 있음
$1495 / 개
데이터시트 보기 →EP2A70F1508C7
✅ 드롭인✓ 재고 있음
$645 / 개
데이터시트 보기 →EP2A70F1508C6
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2A70F1508C8N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2A70F1508C7N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A70F1508C9ES 최대 정격 & 전기적 특성
| Family | APEX II |
| Series | EP2A70 |
| Logic Elements | 67,200 |
| System Gates | 3,000,000 (3M) |
| Embedded RAM Bits | 1,146,880 |
| User I/O Pins | 1,060 |
| Logic Array Blocks (LABs) | 6,720 |
| Core Voltage | 1.5 V nominal (1.425 V - 1.575 V) |
| Process Technology | 0.15 µm CMOS |
| Maximum Internal Frequency | 198 MHz |
| Propagation Delay | 2.87 ns |
| Number of PLLs | 4 |
| 패키지 | 1508-ball FC-FBGA (FineLine BGA, flip-chip) |
| 동작 온도 | 0 °C to +85 °C (commercial) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, GTL |
| 실장 유형 | Surface Mount (BGA) |
EP2A70F1508C9ES 1508-ball fc-fbga (fineline bga, flip-chip) 핀 구성 가이드
EP2A70F1508C9ES(1508-ball fc-fbga (fineline bga, flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70F1508C9ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70F1508C9ES 적합 용도: 6 애플리케이션s: Telecommunications Infrastructure, ASIC Prototyping, Parallel DSP Processing, High-Speed Data Switching, Embedded Computing Platforms, Industrial Control Systems.
Telecommunications Infrastructure
The EP2A70F1508C9ES fits telecommunications infrastructure because its 1,060 user I/O count and MultiCore structure address wide parallel buses used in ATM switches, SONET/SDH framers, and protocol-bridge designs. The four integrated PLLs handle multi-clock domain synthesis across backplane interfaces, while True-LVDS support enables high-speed differential signaling for SERDES-like data paths. With 1,146,880 bits of embedded RAM, packet buffers and lookup tables can be placed on-chip for low-latency switching. The 198 MHz maximum internal frequency meets typical telecom datapath throughput needs; LVDS I/O at the boundary matches telecom backplane signal levels. Compared with newer FPGAs, the APEX II remains a viable drop-in for legacy systems where redesign risk is high.
추천
ASIC Prototyping
The EP2A70F1508C9ES is well suited to ASIC prototyping because its 3M system gates and 67,200 logic elements provide sufficient density to map complex ASIC designs at near-1:1 gate utilization. Embedded multipliers accelerate DSP functional blocks, while the four PLLs allow replication of ASIC clock trees for behavioral verification. Embedded system blocks (ESBs) can implement dual-port RAM, ROM, FIFO, and CAM equivalents of ASIC memories, enabling accurate pre-silicon verification. The 1508-ball FC-FBGA package exposes wide buses for ASIC pin mapping. Compared with structured ASICs, FPGAs offer rapid iteration; compared with newer FPGAs, the APEX II has the advantage of well-characterized Quartus II design flow.
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Parallel DSP Processing
The EP2A70F1508C9ES fits parallel DSP processing because the MultiCore architecture integrates embedded multipliers alongside logic elements to sustain high-throughput DSP datapaths. With 67,200 logic elements and 1,146,880 bits of embedded RAM, designers can build multi-channel filter banks, FFT processors, and video processing arrays on a single device. The four PLLs synchronize sample clocks across channels, while 198 MHz internal frequency supports typical DSP clock rates. True-LVDS I/O enables direct connection to high-speed ADCs and DACs. Compared with dedicated DSP processors, FPGAs offer parallel architecture with custom datapaths; compared with newer FPGAs, APEX II has lower performance per watt but lower unit cost for parallel pipelines.
추천
High-Speed Data Switching
The EP2A70F1508C9ES fits high-speed data switching fabrics because the 1,060 user I/O count supports wide parallel switch fabrics at OC-48/OC-192 rates. The four integrated PLLs provide the multiple clock domains required for ingress and egress timing across a switch fabric. Embedded system blocks (ESBs) implement FIFO buffers for cell or frame queuing with minimal external memory. True-LVDS support reduces external PHY count by integrating high-speed differential signaling. With 1,146,880 bits of embedded RAM, packet headers and routing tables can be placed on-chip. Compared with ASSP switches, FPGAs offer custom protocol support; compared with newer FPGAs, APEX II provides the I/O density legacy designs require.
추천
Embedded Computing Platforms
The EP2A70F1508C9ES fits embedded computing platforms because its 67,200 logic elements enable custom processor implementations (soft cores) and tightly-coupled coprocessors. Embedded system blocks (ESBs) provide dual-port RAM for processor/cache interfaces, while embedded multipliers accelerate arithmetic operations in custom instructions. The 1,060 user I/O pins support direct connection to memory buses (DDR, SRAM) and peripheral interfaces without external bridge chips. With 1,146,880 bits of embedded RAM, on-chip scratchpad and cache memories reduce external memory contention. The 198 MHz operation meets embedded CPU performance targets. Compared with SoC FPGAs, APEX II has no hard processor but offers greater I/O flexibility.
추천
Industrial Control Systems
The EP2A70F1508C9ES fits industrial control systems because its 1,060 user I/O count accommodates large numbers of digital I/O channels typical of factory automation and process control. The four PLLs synchronize to multiple motor, encoder, and fieldbus clocks without external PLL chips. Embedded RAM (1,146,880 bits) supports on-chip state machines and lookup tables for control algorithms. The 1.5 V core with commercial 0-85 °C operating temperature suits typical factory environments. Compared with microcontrollers, FPGAs offer deterministic parallel processing; compared with newer FPGAs, APEX II retains pinout continuity for legacy controller upgrades and field-replacement scenarios.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A70F1508C9ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70F1508C9 | EP2A70F1508C8 | EP2A70F1508C7 | EP2A70F1508C6 | EP2A70F1508C8N | EP2A70F1508C7N |
|---|---|---|---|---|---|---|---|
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA | 1508-ball FC-FBGA | 1508-ball FC-FBGA | 1508-ball FC-FBGA | 1508-ball FC-FBGA | 1508-ball FC-FBGA |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| Embedded RAM Bits | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 |
| User I/O Pins | 1,060 | 1,060 | 1,060 | 1,060 | 1,060 | 1,060 | 1,060 |
| Speed Grade | C9 (fastest, ~198 MHz) | C9 (fastest) | C8 (slightly slower) | C7 (slower) | C6 (slowest legacy) | C8 (slightly slower) | C7 (slower) |
| Lead-Free (Pb-Free) | ES grade (engineering sample) | no N suffix (standard) | no N suffix (standard) | no N suffix (standard) | no N suffix (standard) | yes (N suffix = Pb-free) | yes (N suffix = Pb-free) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Grade | ES (engineering sample) | production commercial | production commercial | production commercial | production commercial | production commercial Pb-free | production commercial Pb-free |
주요 차별점
- 3M system gates with 1,060 user I/O in a single FC-FBGA (vs EP2A40F1020C9 (smaller-density 1020-ball APEX II sibling))
- MultiCore architecture integrating logic, memory, and multipliers (vs EP20K600CF672C9 (APEX 20K family predecessor))
- 1,060 user I/O count (vs EP2A70F1020C9 (1020-ball FC-FBGA sibling))
설계 노트
The 1508-ball FC-FBGA package requires controlled-impedance PCB routing with matched-length traces for LVDS and clock signals. Place decoupling capacitors (0.1 µF and 10 µF) within 5 mm of each supply pin. Use a 4-6 layer PCB with dedicated ground and power planes, and follow Altera's flip-chip BGA layout guidelines for via-in-pad or dog-bone fanout. Thermal vias under the package center improve heat dissipation.
The 1.5 V core and multiple I/O banks each require independent decoupling and bulk capacitors. The core supply range is 1.425 V to 1.575 V with tolerance per the APEX II datasheet. Use a low-dropout linear regulator for the core, and separate switching regulators for I/O banks to avoid cross-coupling. Estimated: at full utilization with 67,200 logic elements switching, core current may exceed several amps and require substantial bulk capacitance.
True-LVDS pairs require matched-length traces (within 150 mil of each other) and 100 Ω differential impedance. Use 4-layer stack-up with GND adjacent to signal layers. Avoid routing LVDS signals across plane splits; keep ground returns continuous. Series-termination resistors are typically not required for LVDS but should be used for SSTL/HSTL outputs at higher drive strengths.
Do not exceed the maximum I/O count per bank or mix incompatible voltages in the same bank. Verify pin assignments against the latest Altera pin-out file before PCB layout to avoid bank conflicts. The 'ES' grade designation indicates engineering sample - for production deployments, use the non-ES production variant (EP2A70F1508C9 or speed-grade equivalents) to ensure full qualification.
Estimated: at full logic utilization and 198 MHz operation, the EP2A70F1508C9ES may dissipate several watts and require thermal management. Use thermal vias beneath the package center and consider a heatsink for high-utilization designs. Monitor junction temperature via the on-chip die temperature sensing diode if exposed to the user logic.
규정 준수 정보
EP2A70F1508C9ES is an engineering sample (ES suffix); lead-free/RoHS status is unknown from available data. The N-suffix variants (EP2A70F1508C8N/EP2A70F1508C7N) are explicitly lead-free. AEC-Q100 is not applicable to commercial-grade APEX II FPGAs.
