EP2AGX260EF29C4 - 244K LE Arria II GX FPGA, 780-FBGA | Intel
부품 번호: EP2AGX260EF29C4 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460.75 | $4,607.50 |
| 100 | $412.25 | $41,225.00 |
| 500 | $368.6 | $184,300.00 |
| 1,000 | $339.5 | $339,500.00 |
EP2AGX260EF29C4 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs occupy a unique position in the programmable logic taxonomy: above CPLDs (which are smaller, non-volatile, and lower density) and below structured ASICs in NRE cost, while offering parallel hardware execution of algorithms in DSP, packet processing, and high-speed I/O bridge functions. The Arria II GX family is Intel's mid-range transceiver-equipped line, sitting between the low-cost Cyclone families and the high-end Stratix families.
Key features of the EP2AGX260EF29C4 include 244,188 logic elements distributed across 10,260 LABs (Logic Array Blocks), 1,008 embedded 18x18 multipliers for DSP, and 12 high-speed transceivers operating up to 6.375 Gbps. The device provides 372 user I/O pins plus dedicated transceiver channels, supports a core voltage of 0.9 V, and is offered in the commercial temperature grade (-4 speed grade).
Architecturally, the Arria II GX device combines a logic fabric with hard IP blocks including transceivers, PCIe Gen1 endpoints, external memory controllers (DDR3, DDR2, LPDDR2, QDRII+), and DSP blocks. The 40 nm process and Adaptive Logic Module (ALM) architecture deliver favorable logic utilization, while the transceiver block supports multiple protocols (PCIe, Serial RapidIO, Gigabit Ethernet, XAUI, CPRI) with embedded PCS logic.
Typical applications include high-speed serial interface bridging in communications infrastructure, video broadcast and imaging pipelines, military and aerospace signal processing, medical imaging systems, and ASIC/ASSP prototyping. The combination of high logic density, embedded transceivers, and abundant DSP blocks makes the EP2AGX260EF29C4 well suited to designs that previously required expensive custom ASICs.
When designing with this device, verify power budget and thermal dissipation using the Intel Early Power Estimator (EPE) tool before PCB layout; the 780-ball FC-FBGA requires a multi-layer PCB with controlled-impedance routing for transceiver channels and matched-length DDR3 traces for memory interfaces. The -4 commercial speed grade must be matched against timing closure targets in Quartus II design software.
This page synthesizes distributor pricing across multiple sources, lists drop-in alternative MPNs sharing the same FC-FBGA-780 footprint, and provides practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP2AGX260EF29C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX260EF29C4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX260EF29C4N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2AGX260EF29C5N
✅ 드롭인✓ 재고 있음
$1565 / 개
데이터시트 보기 →EP2AGX260EF29C6N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGX260EF29I5N
✅ 드롭인✓ 재고 있음
$1950 / 개
데이터시트 보기 →EP2AGX260FF35I5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1325 / 개
데이터시트 보기 →EP2AGX190EF29C4G
✅ 드롭인✓ 재고 있음
$2510 / 개
데이터시트 보기 →EP2AGX260EF29C4 최대 정격 & 전기적 특성
| Series | Arria II GX |
| Logic Elements | 244,188 |
| Logic Array Blocks (LABs) | 10,260 |
| Embedded Memory Bits | 12,038,144 |
| Embedded 18x18 Multipliers | 1,008 |
| PLLs | 8 |
| User I/O Pins | 372 |
| Transceivers | Up to 12 |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm CMOS |
| 패키지 | 780-ball FC-FBGA (FBGA-780) |
| Speed Grade | -4 (commercial) |
| 동작 온도 | 0C to +85C (commercial) |
| 실장 유형 | Surface Mount |
EP2AGX260EF29C4 780-ball fc-fbga (fbga-780) 핀 구성 가이드
EP2AGX260EF29C4(780-ball fc-fbga (fbga-780) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX260EF29C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX260EF29C4 적합 용도: 6 애플리케이션s: Communications Infrastructure Backplane Switching, Video Broadcast and Imaging Pipelines, Military and Aerospace Signal Processing, ASIC and ASSP Prototyping, Medical Imaging Systems, Industrial Automation and Machine Vision.
Communications Infrastructure Backplane Switching
The EP2AGX260EF29C4 fits communications backplane designs because its 12 transceivers at up to 6.375 Gbps provide enough serial bandwidth for multi-protocol aggregation including XAUI, Serial RapidIO, and CPRI. The 244K logic elements deliver the packet processing capacity needed for line-card forwarding engines, while hard PCIe Gen1 endpoints simplify host-side interfacing. Placed on a line card between the network processor and backplane SERDES, it bridges protocols with deterministic latency, unlike a software-only NPU that adds jitter under load.
추천
Video Broadcast and Imaging Pipelines
The EP2AGX260EF29C4 is well suited to broadcast video routers and medical imaging pre-processors because its 1,008 18x18 multipliers handle real-time color space conversion, scaling, and filter kernels at full HD and 4K rates. The 12 Mbit embedded memory buffers line delays without external SDRAM contention, while transceiver channels transport SDI, DisplayPort, or proprietary video links. Unlike a GPU, the FPGA delivers deterministic frame latency critical for live broadcast switching.
추천
Military and Aerospace Signal Processing
The EP2AGX260EF29C4 fits defense signal-processing boards where its combination of high logic density, DSP blocks, and transceivers enables radar pulse compression, electronic warfare channelization, and software-defined radio baseband in a single device. The -4 commercial speed grade supports benign environments; for harsh military platforms the I-grade EP2AGX260EF29I5N shares the same FC-FBGA-780 footprint and can be substituted without PCB rework. Board designers must derate transceivers and validate signal integrity over the mission temperature range.
추천
ASIC and ASSP Prototyping
The EP2AGX260EF29C4 serves as a high-capacity prototyping vehicle for ASIC/ASSP pre-silicon validation because its 244K logic elements and abundant DSP blocks can map most mid-complexity ASICs directly. Quartus II supports industry-standard synthesis flows from Synopsys Design Compiler and Mentor Questa, and the FC-FBGA-780 footprint accommodates prototype-to-production adapter boards. Engineers use it to validate RTL, exercise corner-case stimulus, and characterize real-world I/O behavior before committing to mask sets.
추천
Medical Imaging Systems
The EP2AGX260EF29C4 fits ultrasound, CT, and MRI front-end processing because its parallel DSP fabric executes beamforming, FFT, and image reconstruction in real time with deterministic latency. The 12 transceiver channels aggregate data from multiple transducer arrays at multi-gigabit rates, while embedded memory holds scan-line buffers. Designers use the device to consolidate beamformer, detector, and image-processing pipelines that would otherwise require multiple DSP chips, reducing board area and BOM cost.
추천
Industrial Automation and Machine Vision
The EP2AGX260EF29C4 fits factory automation controllers and multi-camera machine vision systems because its transceiver channels aggregate GigE Vision, CoaXPress, or Camera Link streams while DSP blocks run real-time defect detection algorithms. The 244K logic elements support complex protocol stacks, image preprocessing, and PLC-style deterministic control logic in a single chip. Unlike discrete processor-plus-DSP architectures, the FPGA eliminates inter-chip latency and reduces total system power for high-channel-count inspection lines.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX260EF29C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX260EF29C4N | EP2AGX260EF29C5N | EP2AGX260EF29I5N | EP2AGX190EF29C4G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 190,000 |
| Speed Grade | -4 (commercial) | -4 (commercial) | -5 (commercial, faster) | -5 (industrial) | -4 (commercial) |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| Transceivers | Up to 12 | Up to 12 | Up to 12 | Up to 12 | Up to 12 |
| Lead-Free | Yes (Pb-free) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (G suffix) |
주요 차별점
- Top-density Arria II GX in same FC-FBGA-780 footprint (vs EP2AGX190EF29C4G)
- Industrial-grade drop-in option available (vs EP2AGX260EF29I5N)
- Multiple speed grades in same package (vs EP2AGX260EF29C6N)
설계 노트
Estimated: Using the Intel Early Power Estimator with 50% logic utilization, 75% transceiver utilization at 6.375 Gbps, and full DDR3 interface activity, total device power is approximately 12-15 W. Designers should provision at least 18 W headroom in the power budget and use a switching regulator topology with multiple voltage rails (0.9 V core, 1.1 V transceiver analog, 2.5 V/3.0 V I/O) sized for inrush at configuration.
The 780-ball FC-FBGA package requires a minimum 12-layer PCB stack-up with continuous ground and power planes adjacent to signal layers. Transceiver channels demand 100 ohm differential controlled-impedance routing with length matching within 5 mils. Use the Intel Arria II GX pin connection guidelines and reference design PCB stack-up as a starting point; do not improvise the BGA breakout.
Estimated: With 15 W dissipation and theta_JA of approximately 8 C/W for the FC-FBGA-780 package with appropriate thermal via array and heatsink, junction temperature rise is roughly 120C above ambient. Without forced airflow or a heatsink, the device will exceed its 85C commercial rating at typical office ambient. Plan thermal management before PCB layout, not after.
Do not assume -4 and -5 speed grade variants are interchangeable in timing closure: the -5 grade offers approximately 25% faster timing but the -4 design may fail timing when retargeted to -4. Always re-run Quartus II timing analysis after speed grade substitution. Also verify that the I-grade (industrial) variant EP2AGX260EF29I5N maintains identical pinout before substitution; the I-suffix only changes temperature qualification, not ball map.
규정 준수 정보
RoHS compliance indicated by N suffix on lead-free variants. Industrial temperature variants (I suffix) are AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in available web data.
