XC7A100T - Artix-7 FPGA 101K Logic Cells | AMD
부품 번호: XC7A100T ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.47 | $38.47 |
| 10 | $36.55 | $365.50 |
| 100 | $33.6 | $3,360.00 |
| 500 | $30.4 | $15,200.00 |
| 1,000 | $27.9 | $27,900.00 |
XC7A100T 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and reconfigurable interconnects that customers configure after manufacturing, enabling custom digital hardware without ASIC development cost. FPGAs sit above CPLDs in capacity and below ASSPs in specificity; the Artix-7 family is positioned as a low-cost, low-power FPGA for high-volume, cost-sensitive systems.
Key features of the XC7A100T include 101,440 logic cells (15,850 slices with 6-input LUTs), 4,860 Kb of block RAM, 240 DSP48E1 slices supporting 25x18 multipliers with 48-bit accumulators, 6 clock management tiles (CMTs), and up to 210 user I/O in the CSG324 package. The T suffix denotes transceiver-capable devices supporting serial line rates up to 6.6 Gbps (GTP) in select packages. Integrated hard IP includes PCIe blocks, an XADC 12-bit analog-to-digital converter, and hardened DDR3 memory controller support, reducing external component count.
Architecture highlights: CLBs combine two slices with fast carry chains; the block RAM is cascadable as dual-port RAM, ROM, or FIFO; and the DSP48E1 pipeline supports FIR filters and FFTs for software-defined radio and video processing. Mixed-voltage I/O banks support LVCMOS, LVDS, HSTL, and SSTL standards, with 3.3V compatibility for legacy interfaces.
Typical applications include software-defined radio, motor control, industrial networking, medical imaging, video and image processing, aerospace and defense prototyping, and education platforms such as the popular Basys/Nexys boards. Its performance-per-watt also suits edge computing and IoT gateways.
Design consideration: the device requires multiple rails (VCCINT 1.0V, VCCAUX 1.8V, VCCO per bank) with defined power sequencing and thorough decoupling. Use the AMD Vivado design suite for synthesis and refer to DS181 (Artix-7 DC and AC Switching Characteristics) for timing data. Pricing as of 2026-08-29 from DigiKey and LCSC.
드롭인 대체품: XC7A100T — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A100T (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Block RAM, Logic Cells, PCIe Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7A100T-1CSG324C
✅ 드롭인✓ 재고 있음
$59.9 / 개
데이터시트 보기 →XC7A100T-2CSG324C
✅ 드롭인✓ 재고 있음
$59.5 / 개
데이터시트 보기 →XC7A100T-1CSG324I
✅ 드롭인✓ 재고 있음
$59.9 / 개
데이터시트 보기 →XC7A50T-1CSG324C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A100T 최대 정격 & 전기적 특성
| Family | Artix-7 |
| Logic Cells | 101440 |
| Slices | 15850 |
| Block RAM | 4860 Kb |
| DSP48E1 Slices | 240 |
| Clock Management Tiles (CMT) | 6 |
| Maximum User I/O (CSG324) | 210 |
| Process Technology | 28 nm |
| Speed Grades | -1, -2, -3 |
| Temperature Ranges | C: 0C to +85C, I: -40C to +100C |
| Packages | CSG324, FTG256, FGG484, FGG676 |
| I/O Standards | LVCMOS, LVDS, HSTL, SSTL |
| Bank I/O Voltage | 1.2 V to 3.3 V |
| Integrated Hard IP | PCIe, XADC (12-bit), DDR3 memory controller support |
| Transceiver Line Rate | Up to 6.6 Gbps (GTP, select packages) |
| Design Software | AMD Vivado Design Suite |
| Reference Datasheet | DS181 Artix-7 DC and AC Switching Characteristics |
XC7A100T 핀 구성
| 핀 Bank 0 (CSG324) | VCCO_0 — I/O bank 0 supply, configuration bank |
| 핀 C11 (CSG324) | CCLK — Configuration clock output to flash |
| 핀 AA3 (CSG324) | DIN — Configuration data input (slave serial) |
| 핀 T15 (CSG324) | PROGRAM_B — Active-low program/reset control |
| 핀 M13 (CSG324) | DONE — Configuration done status output |
| 핀 K14 (CSG324) | INIT_B — Initialization status / data polling |
| 핀 Various | VCCINT — 1.0V core fabric supply |
| 핀 Various | VCCAUX — 1.8V auxiliary supply (CMT, XADC) |
| 핀 Various | GND — Ground |
| 핀 N12 (CSG324) | TCK/TMS/TDI/TDO — JTAG boundary scan and configuration port |
일반적인 애플리케이션
XC7A100T 적합 용도: 6 애플리케이션s: Software-Defined Radio, Industrial Motor Control, Medical Imaging and Diagnostics, Video and Image Processing, Education and Prototyping, Edge Computing and IoT Gateways.
Software-Defined Radio
The XC7A100T fits SDR baseband processing because its 240 DSP48E1 slices implement multi-channel FIR filters and FFTs while 4,860 Kb of block RAM buffers I/Q streams between the ADC front end and the host interface. In a typical receive chain, ADC samples are clocked into the fabric through an ISERDES or JESD204B link, filtered at 100-250 MHz fabric rates, and packed for Gigabit Ethernet or PCIe transfer. The 6 CMTs generate clean multiple sampling clocks; using the -2 speed grade eases timing closure above 200 MHz.
추천
Industrial Motor Control
The XC7A100T implements multi-axis field-oriented control by running current loops and PWM generators in hardware at microsecond-level latency that CPUs cannot match. Its 210 user I/O (CSG324) interface encoders, Hall sensors, and gate drivers across multiple voltage banks supporting LVCMOS 3.3V legacy signals. The XADC monitors phase currents and temperature without an external controller, and deterministic fabric timing removes software jitter from PWM dead-time control, improving torque linearity in servo and robotics drives.
추천
Medical Imaging and Diagnostics
The XC7A100T is suited to medical imaging front ends - ultrasound beamforming and digital X-ray panel readout - where 240 DSP slices form delay-and-sum beamformers and 4,860 Kb block RAM holds line buffers at 12-14 bit resolution. The XADC provides system health telemetry required by IEC-style safety monitoring, while LVDS I/O banks connect directly to high-speed analog front-end chips. Using the industrial temperature grade adds margin for equipment with demanding thermal budgets inside enclosed imaging heads.
추천
Video and Image Processing
With 101,440 logic cells and abundant BRAM, the XC7A100T implements HDMI/MIPI ingest, scaling, color-space conversion, and ISP pipelines at 1080p60 and beyond. DDR3 controller support via MIG provides external frame buffers, while DSP slices accelerate 2D convolution and gamma correction. Its low 28nm static power keeps thermals manageable in fan-less cameras and displays. Many cost-sensitive video products choose Artix-7 over higher-tier 7-series families precisely because this capacity/performance point covers typical 1080p pipelines.
추천
Education and Prototyping
The XC7A100T is the fabric inside popular academic boards (Basys 3, Nexys Video class) because its 101K logic cells accommodate substantial student designs - RISC-V soft cores, VGA graphics, and lab signal processing - while Vivado ML Standard edition is free, eliminating tooling cost. The 3.3V-tolerant LVCMOS banks connect directly to hobbyist peripherals, and the same skills transfer directly to Zynq and Kintex families, making it the standard on-ramp into AMD FPGA development.
추천
Edge Computing and IoT Gateways
The XC7A100T serves industrial IoT gateways that need protocol offload, inline encryption, and sensor aggregation at low power. 28nm HPL process minimizes static current, important for passively cooled DIN-rail enclosures, while PCIe and GTP links connect to host SoCs and radios. Fabric-implemented EtherCAT/PROFINET masters plus streaming pre-processing reduce host CPU load. The same footprint family from CSG324 to FGG676 lets one layout scale I/O count as gateway density requirements grow.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7A100T — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A100T-1CSG324C | XC7A100T-2CSG324C | XC7A100T-1CSG324I | XC7A50T-1CSG324C | XC7A100T-1FGG676C |
|---|---|---|---|---|---|---|
| Package | CSG324 / FTG256 / FGG484 / FGG676 | CSG324 - same | CSG324 - same | CSG324 - same | CSG324 - same | FGG676 - different footprint |
| Brand | AMD (Xilinx) | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 101440 | 101440 | 101440 | 101440 | 65920 | 101440 |
| DSP48E1 Slices | 240 | 240 | 240 | 240 | 120 | 240 |
| Block RAM | 4860 Kb | 4860 Kb | 4860 Kb | 4860 Kb | 2700 Kb | 4860 Kb |
| Speed Grade | -1 / -2 / -3 depending on order code | -1 | -2 (faster) | -1 | -1 | -1 |
| Temperature Range | C: 0C to +85C / I: -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Max User I/O | 210 (CSG324) | 210 | 210 | 210 | 210 | 300 |
주요 차별점
- 2x logic capacity in identical footprint (vs XC7A50T-1CSG324C)
- Faster timing margin (vs XC7A100T-1CSG324C)
- Industrial temperature capability (vs XC7A100T-1CSG324C)
- More I/O and differential pairs (vs XC7A100T-1CSG324C)
설계 노트
The XC7A100T needs VCCINT 1.0V, VCCAUX 1.8V, and per-bank VCCO (1.2V-3.3V). Follow the 7-series power sequencing guidance: VCCINT should rise before or together with VCCAUX, and configuration bank VCCO must be stable before PROGRAM_B release. Size core regulators for several amps of transient current; Vivado Power Estimator report on the post-implementation netlist gives accurate totals. Use TI power reference designs or the Artix-7 AC-DC/DC-DC vendor reference schematics for proven rail sequencing.
Place 0.1uF decoupling capacitors at every VCCINT/VCCAUX/VCCO pin per the AMD package decoupling spreadsheet, plus bulk capacitance per bank. Keep DDR3 routing length-matched (per UG583 PCB guide) if using MIG. CSG324 BGA requires 0.8mm pitch fanout - plan via-in-pad or dog-bone escape accordingly, and expose sufficient copper under the die for heat spreading.
For LVDS pairs and GTP transceiver lanes, follow the 100-ohm differential impedance rules in UG471/UG482 and keep stubs short on the CSG324 escape routing. Bank VCCO choice fixes I/O standard compatibility - do not mix 3.3V and 1.8V signals in one bank. Use IDELAY/ISERDES primitives for source-synchronous capture above 100 MHz rather than direct fabric sampling.
Configuration flash must match the selected configuration mode (e.g., SPI x4 with master mode); a mismatched DONE/INIT_B pull-up scheme is the most common bring-up failure. Also remember speed grade and temperature suffix must appear on the order code - a bare XC7A100T cannot be purchased, and -1 silicon cannot meet timing closed at -2 requirements.
규정 준수 정보
RoHS-compliant lead-free BGA packaging per AMD product pages and distributor listings. Project-specific REACH and material declarations should be pulled from AMD product compliance documents for the exact full order code.
