XC7S50-1CSGA324C - Spartan-7 FPGA 52K Logic Cells, 324-BGA | AMD
부품 번호: XC7S50-1CSGA324C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $57.84 | $57.84 |
| 10 | $52.06 | $520.60 |
| 100 | $46.27 | $4,627.00 |
| 500 | $40.49 | $20,245.00 |
| 1,000 | $36.14 | $36,140.00 |
XC7S50-1CSGA324C 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic function is configured by the end user after manufacturing, hence "field-programmable." FPGAs consist of an array of programmable logic blocks, programmable interconnects, and configurable I/O tiles that together implement arbitrary digital logic. They sit within the programmable logic device (PLD) hierarchy, offering rapid prototyping and post-silicon flexibility that fixed-function ASICs cannot match, at the cost of higher unit price and lower maximum frequency than custom silicon.
Key features of the XC7S50-1CSGA324C include 52,160 logic cells, 8 DSP slices for hardware-accelerated arithmetic, 2,764,800 bits of dual-port block RAM with built-in FIFO logic, 4 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and support for memory interfaces including DDR3. The CSBGA-324 package integrates 210 user I/Os across multiple I/O banks supporting LVCMOS, LVDS, SSTL, and HSTL standards.
The Spartan-7 architecture shares the proven 28nm HKMG process node of the larger Artix-7 and Kintex-7 families, inheriting their 6-input look-up tables (LUTs), dedicated carry chains, and high-speed serial support (up to 6.6 Gb/s transceivers in higher Spartan-7 densities; this 50K-cell variant is primarily general-purpose logic with select GTP capability at higher speeds depending on configuration). The 28nm process reduces both static leakage and dynamic power compared to legacy 45nm and 65nm Spartan-6 devices.
Typical applications include industrial motor control, factory automation controllers, medical imaging front-ends, video processing pipelines, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. Designers migrating from end-of-life Spartan-6 designs use the Spartan-7 as a pin-compatible upgrade path with higher logic density and lower power per LUT.
When designing with this FPGA, pay close attention to the multi-rail power architecture (VCCINT, VCCAUX, VCCO, MGTAVCC) and required power-on sequencing. Refer to the Spartan-7 FPGA Data Sheet for DC and AC switching characteristics and UG475 for package pinout details.
This page synthesizes distributor pricing, drop-in same-package alternatives, application guidance, and PCB-level design notes that go beyond the manufacturer datasheet, helping engineers accelerate Spartan-7 evaluation and BOM risk mitigation.
드롭인 대체품: XC7S50-1CSGA324C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7S50-1CSGA324C (동일 폼 팩터 및 풋프린트) — 차이점: Block RAM, DSP Slices, Package, Logic Cells, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7S75-1CSGA324C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S100-1CSGA324C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S50-2CSGA324C
✅ 드롭인✓ 재고 있음
$110.85 / 개
데이터시트 보기 →XA7S25-1CSGA324I
✅ 드롭인✓ 재고 있음
$33.5 / 개
데이터시트 보기 →XC7S50-1CSGA324C 최대 정격 & 전기적 특성
| Family | Spartan-7 |
| Logic Cells | 52,160 |
| Block RAM (bits) | 2,764,800 |
| DSP Slices | 90 |
| User I/O Pins | 210 |
| Process Technology | 28nm HKMG |
| Core Voltage (VCCINT) | 1.0 V |
| 패키지 | CSBGA-324 (CSPBGA), 15x15 mm |
| 동작 온도 | 0C to +85C (commercial) |
| Speed Grade | -1 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Clock Management Tiles (CMTs) | 4 |
XC7S50-1CSGA324C csbga-324 (cspbga), 15x15 mm 핀 구성 가이드
XC7S50-1CSGA324C(csbga-324 (cspbga), 15x15 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7S50-1CSGA324C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7S50-1CSGA324C 적합 용도: 7 애플리케이션s: Industrial Motor Control, Factory Automation Controllers, Medical Imaging Front-End, Video Processing Pipelines, Software-Defined Radio (SDR) Baseband, Low-Cost ASIC Prototyping, Automotive Infotainment & ADAS Pre-Processing.
Industrial Motor Control
The AMD XC7S50-1CSGA324C is well-suited for industrial motor control and drive inverters where deterministic, low-latency feedback loops are required. Its 90 dedicated DSP slices accelerate field-oriented control (FOC), space-vector PWM, and Clarke/Park transforms for three-phase AC motors at switching frequencies of 10-20 kHz. The 52,160 logic cells comfortably host the encoder interface (QEP, SSI, EnDat), isolated gate-driver sequencing, and protection state machines within a single device, while the 210 user I/Os interface to multi-axis current/voltage ADCs and digital isolators. The 28nm HKMG process holds junction temperature low enough for fanless IP65 enclosures operating up to +85C ambient, and the CSBGA-324 package fits inside compact drive PCBAs under 100x80 mm.
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Factory Automation Controllers
The XC7S50-1CSGA324C targets programmable logic controllers (PLCs) and remote I/O gateways that aggregate multiple fieldbus protocols (EtherCAT, PROFINET, Modbus TCP, IO-Link) in a single FPGA. Its 2,764,800 bits of dual-port block RAM buffer protocol stacks, while the 4 clock management tiles (CMTs) synchronize to industrial Ethernet PHYs at 100 Mbit/s and gigabit rates. The CSBGA-324 package with 210 user I/Os interfaces to multi-port PHYs, RS-485 transceivers, and digital I/O modules. Compared with discrete MCU + ASSP designs, a single Spartan-7 consolidates the CPU fabric, deterministic I/O scanning, and safety logic (SIL-2/SIL-3 capable via software) into one device, reducing BOM count and improving mean time to repair for rack-mounted controllers.
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Medical Imaging Front-End
The AMD XC7S50-1CSGA324C supports medical imaging front-end preprocessing, including ultrasound beamforming, endoscopy video pipelines, and patient monitor signal acquisition. The 90 DSP slices perform finite-impulse-response (FIR) filtering and Hilbert transforms required for beamformed ultrasound channels, while the abundant block RAM holds scan conversion LUTs. The CSBGA-324 footprint is suitable for portable cart-based imaging systems and bedside monitors where board space is constrained. The 28nm HKMG process minimizes power dissipation, supporting battery-powered handheld probes that must run below 5W total system power. The commercial 0C to +85C temperature range meets typical medical equipment operating environments with adequate thermal headroom.
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Video Processing Pipelines
The XC7S50-1CSGA324C integrates HDMI/DVI input pre-processing, color space conversion, scaling, and overlay generation for surveillance DVRs, video walls, and machine-vision controllers. Its 52,160 logic cells implement multi-tap video scaling filters and frame-rate conversion pipelines at 1080p60, while the 210 I/Os accommodate 24-bit RGB, BT.656/1120, and MIPI-CSI2 bridges. The DDR3 memory controller IP (available free in Vivado) interfaces to external SDRAM at 800 MT/s for frame buffering, and the 28nm HKMG process keeps dynamic power low for always-on video appliances. The CSBGA-324 package with 15x15 mm area fits densely populated carrier-grade video processing cards.
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Software-Defined Radio (SDR) Baseband
The AMD XC7S50-1CSGA324C handles digital baseband processing for software-defined radios, including digital down-conversion (DDC), digital up-conversion (DUC), channelization, and demodulation for narrowband and wideband waveforms. Its 90 DSP slices accelerate complex multiply-accumulate operations needed for FFT-based channelizers at sample rates up to 100 MSPS, while the dual-port block RAM holds coefficient tables and decimation filters. For radio configurations with GTP transceivers, designers select Spartan-7 XC7S75/XC7S100 variants that expose high-speed serial interfaces; the XC7S50 is typically paired with a companion ADC/DAC and external transceiver ASIC. The CSBGA-324 footprint suits compact SDR modules in tactical and commercial wireless infrastructure.
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Low-Cost ASIC Prototyping
The XC7S50-1CSGA324C serves as an affordable pre-silicon validation platform for ASIC and SoC designs targeting mid-range complexity. Engineers use the 52,160 logic cells to map RTL blocks, the abundant block RAM to emulate SRAM/ROM macros, and the 210 user I/Os to prototype memory buses and peripheral interfaces well before tape-out. The Vivado Design Suite Webpack edition is free and supports the full Spartan-7 family, making the platform attractive for university labs and startup IC development teams. The CSBGA-324 commercial-grade package is suitable for benchtop prototype boards, and the part shares footprint with the higher-density XC7S75/XC7S100, enabling rapid scalability as designs grow during validation cycles.
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Automotive Infotainment & ADAS Pre-Processing
The AMD XC7S50-1CSGA324C is used in pre-production automotive infotainment heads and ADAS sensor-fusion pre-processors where commercial-grade silicon suffices for engineering development and reference designs. For production automotive deployments, designers migrate to the XA7S25/XA7S50 XA family which is AEC-Q100 qualified. The 52,160 logic cells implement multi-camera stitching, surround-view composition, and driver-monitoring CV pipelines at pre-production volumes. The CSBGA-324 package and 1.0V core voltage simplify power-tree design versus the 1.5/1.8V core rails of older Spartan-6 generations, and the 28nm HKMG process keeps junction temperatures manageable behind dashboard-mounted electronics enclosures.
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추천 제품 요약
엔지니어링 참조 데이터: XC7S50-1CSGA324C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7S75-1CSGA324C | XC7S100-1CSGA324C | XC7S50-2CSGA324C | XA7S25-1CSGA324I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | CSBGA-324 (CSPBGA), 15x15 mm | CSBGA-324 (CSPBGA), 15x15 mm - same | CSBGA-324 (CSPBGA), 15x15 mm - same | CSBGA-324 (CSPBGA), 15x15 mm - same | CSBGA-324 (CSPBGA), 15x15 mm - same |
| Logic Cells | 52,160 | 76,800 | 102,400 | 52,160 | 23,360 |
| Speed Grade | -1 | -1 | -1 | -2 | -1 |
| User I/O Pins | 210 | 210 | 210 | 210 | 210 |
| Block RAM (bits) | 2,764,800 | 3,240,000 | 4,320,000 | 2,764,800 | 1,620,000 |
| DSP Slices | 90 | 120 | 160 | 90 | 45 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (XA industrial) |
주요 차별점
- Lowest-density drop-in in CSBGA-324 for the Spartan-7 family (vs XC7S75-1CSGA324C)
- Commercial grade vs XA (automotive) temperature range (vs XA7S25-1CSGA324I)
- Lower dynamic power than legacy Spartan-6 at equivalent utilization (vs XC6SLX45-2FGG484C)
설계 노트
The AMD XC7S50-1CSGA324C requires four distinct power rails: VCCINT (1.0V core), VCCAUX (1.8V auxiliary), VCCO (1.2-3.3V I/O bank, varies per bank), and VCCBRAM (1.0V block RAM). Power-on sequencing is mandatory - VCCINT must precede VCCAUX and VCCO. Reference Monolithic Power's Spartan-7 PMIC reference designs for cost-optimized 4-16V input sequencing solutions that pass AMD's Power Manager validation checklist.
Estimated: At full utilization (~70% LUTs, ~80% DSP, 200 MHz toggle) on the CSBGA-324 with theta_JA around 28 C/W (4-layer PCB, 0 airflow), junction-to-ambient rise is approximately 21C above ambient, so the device is safe in sealed industrial enclosures to ~70C ambient. For commercial-grade (0C to +85C) operation, derate by 15-20% if dynamic power exceeds 3W or the enclosure provides no airflow path.
Use a 4-layer PCB with continuous GND plane directly beneath the CSBGA-324 footprint and 1-2 oz copper on inner layers. Place all decoupling capacitors (100 nF + 4.7 uF per VCCINT/VCCO pin group) within 5 mm of the BGA balls. BGA escape routing requires 0.4 mm trace width and 0.2 mm via pad - confirm with the AMD Spartan-7 package files published under UG475. Impedance-controlled 50 ohm microstrip on the top layer for high-speed GTP/GTX signals (when used with adjacent Spartan-7 transceiver parts).
Do not assume CSBGA-324 (CSPBGA, this Spartan-7) is pin-compatible with CSG324 / FG(G)324 (Artix-7, Kintex-7) - ball maps differ even though pin count matches. Confirm pinout against the AMD Spartan-7 specific package file before reusing Artix-7 footprints. Also note that commercial-grade -1/-2 speed grades are NOT AEC-Q100 qualified; for automotive deployments select XA7S25/XA7S50 XA variants that share the CSBGA-324 footprint.
규정 준수 정보
RoHS compliant and REACH SVHC compliant per AMD product environmental documentation. The XC7S50-1CSGA324C is commercial grade (0C to +85C) and is NOT AEC-Q100 qualified; for AEC-Q100 select the XA7S25/XA7S50 XA family which shares the CSBGA-324 footprint. Halogen-free status marked unknown - request AMD material declaration for full compliance audits.
