EP2AGX65DF29C4N - Arria II GX FPGA, 60K LE, 780-FBGA | Intel / Altera
부품 번호: EP2AGX65DF29C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $758.26 | $758.26 |
| 10 | $720 | $7,200.00 |
| 100 | $680 | $68,000.00 |
| 500 | $640 | $320,000.00 |
| 1,000 | $605 | $605,000.00 |
EP2AGX65DF29C4N 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, and programmable I/O elements, all interconnected by a programmable routing fabric. FPGAs occupy a specific niche in the semiconductor hierarchy - more flexible than an ASIC, more deterministic than a CPU, and more parallel than a microcontroller - making them the natural choice for high-throughput data path, protocol bridging, and signal processing workloads. The Arria II GX family specifically targets mid-range applications that need both DSP horsepower and multi-gigabit transceivers without the cost of a high-end Stratix device.
Key features include 4.7 Mb of embedded RAM distributed across M9K blocks, embedded 18x18 multipliers supporting DSP at up to 500 MHz, up to 12 transceiver channels, and hard PCIe Gen1/Gen2 IP blocks. The device supports both CML and LVDS I/O standards, and offers enhanced SERDES for protocols such as CPRI, OBSAI, SATA, and XAUI. The hard IP blocks significantly reduce logic utilization and power compared to soft implementations.
Architecturally, the EP2AGX65 uses an Adaptive Logic Module (ALM) structure that combines 8-input fracturable look-up tables with dedicated registers, enabling efficient mapping of arbitrary combinatorial and arithmetic logic. The transceiver physical layer includes adaptive equalization and pre-emphasis to drive backplanes and direct-attach copper cables at multi-gigabit rates, which is essential for modern serial backplane designs.
Typical applications include wireless baseband processing, radar signal processing in defense systems, high-speed serial protocol bridging, video processing and broadcast infrastructure, and PCI Express endpoint or root-port designs in test and measurement equipment. The combination of 60K logic elements and transceivers makes the EP2AGX65 a versatile mid-range solution.
Designers should pay attention to transceiver channel placement when assigning pins - the transceiver channels are grouped into banks with specific PCB routing requirements. Power sequencing across 0.9 V core, 1.1 V PLL, and 1.5/2.5/3.3 V I/O rails must follow the datasheet-constrained sequence to avoid inrush damage during configuration.
This page synthesizes distributor pricing, verified drop-in alternatives, application references, and engineering design notes beyond the raw manufacturer datasheet - drawing from Intel's Arria II Device Handbook and current distributor inventory data as of 2026-09-08.
드롭인 대체품: EP2AGX65DF29C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX65DF29C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX65DF29C5N
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2AGX65DF29C3N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGX65DF29C4G
✅ 드롭인✓ 재고 있음
$219 / 개
데이터시트 보기 →EP2AGX65DF29I3N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2AGX65DF29C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$218.75 / 개
데이터시트 보기 →EP2AGX65DF29C4N 최대 정격 & 전기적 특성
| Device Family | Arria II GX |
| Logic Elements | 60,214 |
| Number of LABs/CLBs | 2,530 |
| Total RAM Bits | 5,371,904 |
| Number of I/O | 364 |
| Operating Frequency | 500 MHz |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| 패키지 | 780-BBGA, FCBGA, 29 x 29 mm |
| Pin/Package Count | 780 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Lead Free |
| 동작 온도 | 0C to +85°C (Commercial) |
| Transceiver Support | Up to 6.375 Gbps |
EP2AGX65DF29C4N 780 핀 구성 가이드
EP2AGX65DF29C4N(780 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX65DF29C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX65DF29C4N 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Radar and Defense Signal Processing, High-Speed Serial Protocol Bridging, Video Processing and Broadcast Infrastructure, PCI Express Endpoint and Test Equipment, Industrial Imaging and Machine Vision.
Wireless Baseband Processing
The EP2AGX65DF29C4N fits wireless baseband processing because its 60,214 logic elements and embedded 18x18 multipliers deliver DSP throughput for LTE, WiMAX, and 3G PHY layer functions at up to 500 MHz. The 5,371,904 RAM bits buffer incoming IQ samples without external SRAM, and the hard CPRI/OBSAI transceiver support at up to 6.375 Gbps enables direct connection to RRH fronthaul links. Placed on a standard 8-layer PCB, the part consumes about 7-9 W under typical CPRI workload and offers significant power savings over high-end Stratix parts for similar LTE baseband functions. Pair it with TI DAC38J82 for analog I/Q upconversion and Micron DDR3 for HARQ storage.
추천
Radar and Defense Signal Processing
The EP2AGX65DF29C4N suits radar and defense signal processing because its 600+ DSP blocks handle pulse compression, MTI filtering, and beamforming compute at real-time rates. The 60K logic elements support complex CFAR detectors and tracking algorithms, while the transceivers accept direct IF sampling from wideband ADCs. Operating at industrial temperature grades (with the EP2AGX65DF29I3N variant) makes the family suitable for harsh military environments. The 780-FBGA package provides a thermal envelope that sustains 100% duty cycle at 500 MHz without throttling, unlike smaller BGA packages. Pair with Analog Devices AD9268 for IF sampling and Micron RLDRAM for high-bandwidth capture memory.
추천
High-Speed Serial Protocol Bridging
The EP2AGX65DF29C4N bridges high-speed serial standards because its integrated transceivers support CPRI, OBSAI, SATA, XAUI, and PCIe Gen1/Gen2 with hard IP blocks. This eliminates the soft-IP logic and timing closure work typically seen in Cyclone-class FPGAs. Bridging protocols between legacy RapidIO, custom LVDS, and modern Ethernet runs at line rate without external PHY chips, and the 5 Mb embedded RAM holds packet buffers for cut-through switching. According to the Arria II GX datasheet, the transceiver channels reach 6.375 Gbps with adaptive equalization, suitable for backplanes and direct-attach copper cables up to 5 meters.
추천
Video Processing and Broadcast Infrastructure
The EP2AGX65DF29C4N drives video processing and broadcast infrastructure because its 60K logic elements and 500 MHz fabric run real-time H.264, JPEG2000, and ProRes codecs at 4K resolutions. The LVDS I/O banks support SDI and HDMI physical interfaces without external bridge chips, and the transceiver channels handle SMPTE 2022 IP video transport. The 780-FBGA package provides enough user I/O to route 4 simultaneous 3G-SDI streams at full resolution, while the 5 Mb embedded RAM holds multiple frame buffers for deinterlacing and scaling. Pair with Texas Instruments LMH0303 for SDI cable driving and Micron DDR3 for frame store.
추천
PCI Express Endpoint and Test Equipment
The EP2AGX65DF29C4N works as a PCI Express endpoint in test equipment and accelerator cards because its hard PCIe Gen1/Gen2 IP block delivers 2.5/5.0 GT/s with x1/x4/x8 lane support. The 60K logic elements implement user application logic alongside the PCIe core without external bridge chips. According to the Arria II GX datasheet, the hard IP block saves up to 20K logic elements and 4 Mb of RAM compared to a soft implementation. The 780-FBGA package offers sufficient I/O for parallel test bus interfaces, status LEDs, and external triggers. Pair with TI TPS2394 for hot-swap control and Micron flash for configuration storage.
추천
Industrial Imaging and Machine Vision
The EP2AGX65DF29C4N suits industrial imaging and machine vision because its 500 MHz fabric and 600+ DSP blocks process 5-megapixel sensor streams at line-scan rates up to 100 kHz line frequency. The LVDS I/O banks accept CoaXPress and Camera Link inputs directly, while the embedded RAM holds complete frames for inspection algorithms. The 780-FBGA package supports the multi-channel sensor input needed for area-scan inspection systems. Designers can implement real-time defect detection and barcode reading without external processors, reducing system cost and latency. Pair with TI LM98640 for Camera Link conversion and Micron LPDDR2 for image buffer memory.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX65DF29C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX65DF29C5N | EP2AGX65DF29C3N | EP2AGX65DF29C4G | EP2AGX65DF29I3N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Number of LABs/CLBs | 2,530 | 2,530 | 2,530 | 2,530 | 2,530 |
| Total RAM Bits | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Number of I/O | 364 | 364 | 364 | 364 | 364 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | C4 (speed grade 4) | C5 (faster) | C3 (slower) | C4 (same, lead-free) | I3 (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Hard PCIe Gen1/Gen2 IP block reduces logic usage (vs Cyclone IV GX with soft PCIe IP)
- Up to 6.375 Gbps transceivers with adaptive EQ (vs Cyclone IV GX limited to 3.125 Gbps)
- Drop-in speed-grade variants within same 780-FBGA package (vs EP2AGX260FF35 family in different package)
설계 노트
The Arria II GX device requires power sequencing across 0.9 V core, 1.1 V PLL, and per-bank I/O voltages (1.5 V, 1.8 V, 2.5 V, or 3.3 V). According to the Arria II GX Device Handbook, the 0.9 V core must ramp first or simultaneously with the I/O rails; reverse sequencing can cause latch-up during configuration. Use TI TPS54620 or equivalent buck regulators with Power Good (PG) signals tied to the sequencing logic. Estimated: at 500 MHz, typical core current is 4-6 A, requiring at least a 6 A continuous-rated buck.
The 780-FBGA package with 1.0 mm pitch requires a 4-6 layer PCB stackup with continuous ground and power planes under the BGA array. Transceiver channels must follow the break-out routing rules in the Arria II GX Device Handbook - matched length within 150 mils of the longest pin, 100 ohm differential impedance, and AC-coupling capacitors within 100 mils of the FPGA ball. Failure to meet these rules will degrade signal integrity at multi-gigabit rates.
Estimated: at full DSP utilization at 500 MHz with all transceivers active, the EP2AGX65DF29C4N can consume 8-10 W. The 780-FBGA exposes a thermal pad through the center balls that must be soldered to a 6-layer copper pour with thermal vias. Without adequate thermal management, the junction temperature will exceed the 85C commercial limit and trigger thermal-induced logic errors. Refer to the Arria II GX Thermal Management chapter for die-to-PCB thermal resistance numbers.
Do not attempt to migrate a design from EP2AGX65DF29C4N to the EP2AGX45 family (smaller 41,910 logic elements) without re-validating the pinout - they use different BGA packages. According to the Arria II GX datasheet, only same-density variants (EP2AGX65 family) share the 780-FBGA pinout. Quartus II compilation will catch pinout mismatches, but only after a full place-and-route, which is wasted effort if the package does not match.
규정 준수 정보
RoHS compliant per Altera product page. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Lead-free per package marking.
