EP2AGX95DF25I5G - Arria II GX FPGA 89K LE 6.8Mb 572-FCBGA | Intel
부품 번호: EP2AGX95DF25I5G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1010.56 | $1,010.56 |
| 10 | $970 | $9,700.00 |
| 100 | $890 | $89,000.00 |
| 500 | $820 | $410,000.00 |
| 1,000 | $760 | $760,000.00 |
EP2AGX95DF25I5G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital logic hierarchy. Unlike fixed-function ASICs, FPGAs are reconfigured by the designer after manufacture, enabling rapid prototyping, hardware acceleration, and post-deployment updates. The Arria II GX family specifically targets mid-range applications requiring transceivers and DSP blocks alongside general-purpose logic.
Key features of the EP2AGX95DF25I5G include 89,178 logic elements (LEs), 6,839,296 embedded memory bits (approximately 6.83 Mbit), 4 transceiver blocks supporting multi-gigabit serial protocols, and 260 user I/O pins. The part carries an industrial temperature grade designation (suffix I5 indicating -40C to +100C operation) and is built on a 40nm process node. The 572-ball FCBGA package supports high-speed signal integrity required for transceiver-based designs.
Architecturally, the Arria II GX integrates hard IP for PCI Express Gen1/Gen2, multi-gigabit transceivers up to 6.375 Gbps, dedicated DSP blocks for high-throughput signal processing, and on-chip memory controllers. The 6.83 Mbit of embedded RAM is distributed across M9K and M144K blocks, balancing fine-grained and bulk storage allocation. Transceiver capability makes this family particularly suitable for serial connectivity, while the 260 I/Os provide ample parallel interface bandwidth for memory buses and control logic.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, video processing and broadcast equipment, military/aerospace signal processing, medical imaging systems, and ASIC prototyping. The transceiver channels support protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI in wireless base stations.
When designing with this part, ensure the PCB layout accommodates the 1.0 mm or 0.8 mm pitch FCBGA ball array, which requires microvia or HDI PCB technology. Thermal management relies primarily on the package's exposed-die flip-chip construction, so a heatsink with adequate airflow is recommended for sustained high utilization. Quartus II software is required for design entry, synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in a single source, combining verified web data with engineering guidance for engineers evaluating the Arria II GX platform.
드롭인 대체품: EP2AGX95DF25I5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX95DF25I5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Transceiver Data Rate.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX95DF25I3G
✅ 드롭인✓ 재고 있음
$1020 / 개
데이터시트 보기 →EP2AGX95DF25C6N
✅ 드롭인✓ 재고 있음
$1750 / 개
데이터시트 보기 →EP2AGX95DF25C6G
✅ 드롭인✓ 재고 있음
$290 / 개
데이터시트 보기 →EP2AGX95DF25C5G
✅ 드롭인✓ 재고 있음
$768.9 / 개
데이터시트 보기 →EP2AGX95DF25C4G
✅ 드롭인✓ 재고 있음
$360 / 개
데이터시트 보기 →EP2AGX95DF25I5G 최대 정격 & 전기적 특성
| Series | Arria II GX |
| Family | Arria II GX |
| Logic Elements (LE) | 89,178 |
| Embedded Memory Bits | 6,839,296 (6.83 Mbit) |
| User I/O Count | 260 |
| Number of LABs/CLBs | 3747 |
| 패키지 | 572-FCBGA (Flip-Chip BGA) |
| 동작 온도 | -40C to +100C (Industrial) |
| Process Node | 40 nm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2AGX95DF25I5G 572-fcbga (flip-chip bga) 핀 구성 가이드
EP2AGX95DF25I5G(572-fcbga (flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX95DF25I5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX95DF25I5G 적합 용도: 6 애플리케이션s: Telecom Backplane Aggregation, PCIe Gen2 Endpoint Card, Broadcast Video Processing, ASIC Prototyping, Wireless Base Station Fronthaul, Industrial Motor Control and Servo Drive.
Telecom Backplane Aggregation
The EP2AGX95DF25I5G is well suited for telecom backplane aggregation nodes that consolidate multiple lower-rate serial links into a higher-rate uplink. Its integrated multi-gigabit transceivers (up to 6.375 Gbps in the Arria II GX family) support CPRI, OBSAI, and Serial RapidIO commonly used between baseband units and remote radio heads. The 89K logic elements and 3747 CLBs provide sufficient capacity for packet classification, QoS scheduling, and link-bonding logic, while 6.83 Mbit of embedded memory buffers bursts without external SRAM. The 572-FCBGA package preserves signal integrity for high-speed serial lanes. For new CPRI designs, the transceiver PCS blocks implement 8b/10b encoding and rate matching in hard IP, freeing logic resources for the data-plane processing.
추천
PCIe Gen2 Endpoint Card
As a PCIe Gen2 endpoint, the EP2AGX95DF25I5G leverages the Arria II GX hard IP for PCIe Gen1 (2.5 Gbps) and Gen2 (5 Gbps) operation, eliminating soft-logic implementation. The device supports x1, x4, and x8 lane configurations per the hard PCIe block, with the remaining transceivers free for auxiliary interfaces such as SATA or GbE. The 89K logic elements handle DMA engines, MSI-X interrupt controllers, and user application logic. The 260 user I/Os accommodate memory interfaces (DDR3), local control buses, and expansion headers. For high-throughput data acquisition cards, the combination of PCIe Gen2 bandwidth (~4 GB/s for x8) and 6.83 Mbit on-chip memory enables zero-copy DMA pipelines with on-FPGA packet buffering.
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Broadcast Video Processing
The EP2AGX95DF25I5G supports broadcast video processing workloads including SD/HD/3G-SDI embedding, de-embedding, and format conversion. The 89K logic elements and dedicated DSP blocks implement real-time chroma keying, scaling, and overlay engines; 6.83 Mbit of embedded memory serves as line buffers for video pipelines. Multiple integrated transceivers ingest and egress SDI streams (up to 3G-SDI at 2.97 Gbps via SMPTE 424M) while user I/Os handle parallel video buses and control interfaces. The industrial temperature grade makes it suitable for outdoor broadcast equipment. Combined with third-party IP for video codecs, the Arria II GX family has been widely deployed in contribution and distribution encoders.
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ASIC Prototyping
Engineers use the EP2AGX95DF25I5G for ASIC prototyping because its 89K logic elements and abundant block RAM provide enough capacity to map moderate-complexity ASIC RTL (CPU subsystems, peripherals, glue logic) into a real silicon target. The Arria II GX transceiver hard IP lets prototyping boards expose PCIe, SATA, or serial RapidIO interfaces that match the eventual ASIC pins. The 572-FCBGA package supports high pin-count ASIC emulation including wide DDR3 memory interfaces. Quartus II design flow enables fast synthesis and incremental compile flows that accelerate bring-up. Speed grades (C4-C6 commercial, I3-I5 industrial) allow trade-offs between timing margin and cost when targeting a specific ASIC process for design validation.
추천
Wireless Base Station Fronthaul
The EP2AGX95DF25I5G is widely deployed in wireless base station fronthaul applications using the CPRI protocol over fiber. Its integrated multi-gigabit transceivers implement CPRI line rates up to 6.144 Gbps (option 7) with deterministic latency via the hard PCS. The 89K logic elements handle IQ sample packing/unpacking, framing, and link-quality monitoring, while 6.83 Mbit of embedded memory serves as jitter-tolerant elastic buffers. The 260 user I/Os accommodate backhaul Ethernet, JTAG, and clock synchronization interfaces. Industrial temperature grade (-40C to +100C) supports outdoor radio unit deployment. For LTE Advanced carrier aggregation, multiple CPRI links can be aggregated using remaining transceivers.
추천
Industrial Motor Control and Servo Drive
Although FPGAs in motor control are less common, the EP2AGX95DF25I5G is used in high-end multi-axis servo drives where its DSP blocks implement field-oriented control (FOC), space-vector PWM, and encoder interfaces at sub-microsecond loop rates. The 89K logic elements handle multiple axes in parallel; the 6.83 Mbit embedded memory stores reference trajectories and current-loop state. The transceiver hard IP enables real-time EtherCAT, SERCOS III, or POWERLINK communication to industrial controllers via 100 Mbps / 1 Gbps Ethernet. The 260 user I/Os provide ample PWM outputs, encoder inputs (EnDat, BiSS, SSI), and analog monitor channels. Industrial temperature grade supports factory-floor deployment.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX95DF25I5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX95DF25I3G | EP2AGX95DF25C6N | EP2AGX95DF25C6G | EP2AGX95DF25C5G | EP2AGX95DF25C4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 572-FCBGA | 572-FCBGA (same) | 572-FCBGA (same) | 572-FCBGA (same) | 572-FCBGA (same) | 572-FCBGA (same) |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 |
| Embedded Memory | 6.83 Mbit | 6.83 Mbit | 6.83 Mbit | 6.83 Mbit | 6.83 Mbit | 6.83 Mbit |
| User I/O | 260 | 260 | 260 | 260 | 260 | 260 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I5 (faster) | I3 (slower than I5) | C6 (fastest commercial) | C6 (fastest commercial) | C5 | C4 (slowest) |
| Lead-Free / RoHS | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant |
주요 차별점
- Highest-speed industrial-grade variant in the Arria II GX 95K-LE DF25 package (vs EP2AGX95DF25I3G)
- Industrial temperature range with same speed as fastest commercial grade (vs EP2AGX95DF25C6N)
- Lead-free and RoHS compliant across all ball finishes (vs EP2AGX95DF25C6N (lead-free, suffix N))
설계 노트
The 572-FCBGA package uses a fine-pitch (likely 1.0 mm) ball array that requires HDI PCB fabrication with microvias. Per IPC-2222 / IPC-2226 design rules, allow at least 0.4 mm pad-to-pad clearance for escape routing. Use a 1-2-1 or 2-4-2 microvia stack-up to fan out signals; do not attempt dog-bone fan-out with through-hole vias only because the pitch is too tight. Allocate at least 4 inner layers for power planes (core, I/O, GND, and auxiliary) to maintain signal integrity for the multi-gigabit transceivers.
Estimated: at full transceiver utilization and 60-70% logic utilization, the EP2AGX95DF25I5G may dissipate 4-8 W. The 572-FCBGA flip-chip package provides superior thermal performance over wire-bond BGA, but a heatsink with thermal interface material (TIM) is recommended for sustained high-power operation. With theta_JA around 12-15 C/W for a properly-mounted FCBGA, an 8 W load yields ~96-120 C junction rise above ambient. Industrial-grade parts must keep Tj below 100 C; commercial-grade below 85 C. Provide at least 200 LFM airflow if no heatsink is used.
Do not assume that all Arria II GX 572-FCBGA parts share the same pinout - the DF25 suffix specifically indicates the 25 mm body variant. Other 572-FCBGA members with different pin suffix codes (e.g., FF35 or EF29) have different ball maps and are NOT drop-in. Always verify the pinout against the device-specific package drawing in the Arria II GX handbook volume 2 before laying out the PCB. Also note that some early silicon revisions had errata - check Intel's PCN database for the latest revision letter before committing to a board spin.
Multi-gigabit transceiver channels (up to 6.375 Gbps in Arria II GX) require controlled-impedance differential routing with 100 ohm differential impedance. Per the Arria II GX handbook, keep trace length mismatch below 150 mil (3.8 mm) for 5 Gbps signals and below 50 mil (1.3 mm) for 6.375 Gbps. Use AC-coupling capacitors near the receiver pins; do not route DC-coupled. Reference the transceiver-specific IBIS-AMI models for channel simulation, especially when using FR-4 with loss > 0.5 dB/inch at 3 GHz.
The EP2AGX95DF25I5G requires multiple power rails: core (typically 0.9 V), I/O banks (1.2-3.3 V depending on standards), transceiver analog (1.4 V), and transceiver digital (1.1 V). Estimated total supply current at 60% utilization is 6-10 A on the core rail. Use a sequencing controller (e.g., LTC2923 or TPS3808) to enforce proper rail order. Place 0402 or 0201 decoupling capacitors every 5-10 mm along the power rails adjacent to the BGA balls; high-frequency ceramic capacitors (0.1 uF X7R) should be no more than 2-3 mm from each power pin group.
규정 준수 정보
RoHS and lead-free confirmed via distributor listings. Halogen-free status requires consultation of Intel material declaration. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC, although it is widely used in industrial and some automotive applications.
