EP2AGZ350FF35C4N - Arria II GZ FPGA, 350K LE, FC-FBGA-1152 | Intel
부품 번호: EP2AGZ350FF35C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3285.21 | $3,285.21 |
| 10 | $2950 | $29,500.00 |
| 50 | $2680 | $134,000.00 |
| 100 | $2410 | $241,000.00 |
| 250 | $2150 | $537,500.00 |
EP2AGZ350FF35C4N 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader hierarchy of integrated circuits: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. FPGAs combine configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and high-speed serial transceivers on a single die, allowing designers to implement arbitrary digital logic, parallel datapaths, and protocol engines without an ASIC tape-out. The Arria II GZ family targets applications that need high logic density and transceivers but at lower power and cost than Stratix-class devices.
Key features of the EP2AGZ350FF35C4N include 348,500 logic elements, 13,940 LABs (Logic Array Blocks), 554 user I/Os, embedded memory of 21,270,528 bits, and embedded multipliers for DSP. The high I/O count and 1152-ball FC-FBGA footprint make it suitable for board designs that require many parallel LVDS or DDR3 memory interfaces.
Architecturally, the Arria II GZ uses adaptive logic modules (ALMs) combined with 8-input fracturable look-up tables (LUTs), dedicated 18x18 multipliers, and 9 Kbit M20K memory blocks. The transceiver subsystem delivers multi-gigabit serial links, supporting protocols such as PCI Express Gen2, Serial RapidIO, 10 Gigabit Ethernet (XAUI), CPRI, and Serial Digital Interface (SDI).
Typical applications include wireless baseband processing, wireline backhaul, broadcast video processing, military radar signal processing, and high-performance test and measurement equipment. The device is also deployed in medical imaging and ASIC prototyping.
When designing with this part, pay close attention to PCB power distribution - the 0.9 V core and multiple 1.1 V/1.5 V/2.5 V/3.3 V supplies require multi-layer decoupling and a controlled-impedance stack-up. Thermal dissipation at full transceiver utilization also demands a thermal management strategy.
This page synthesizes distributor pricing, lifecycle observations, package-compatible alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: EP2AGZ350FF35C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350FF35C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, RoHS Status, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350FF35C4G
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGZ350FF35C3N
✅ 드롭인✓ 재고 있음
$2250 / 개
데이터시트 보기 →EP2AGZ350FF35C3G
✅ 드롭인✓ 재고 있음
$2680 / 개
데이터시트 보기 →EP2AGZ350FF35C4N 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Logic Elements (LE) | 348,500 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory (bits) | 21,270,528 |
| User I/Os | 554 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Fabric Frequency | 500 MHz |
| 패키지 | 1152-ball FC-FBGA |
| Package Dimensions | 35 x 35 mm |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| 동작 온도 | Commercial (0C to +85C) |
| Speed Grade | C4 |
| Lead-Free / RoHS | Lead Free |
EP2AGZ350FF35C4N 35 x 35 mm 핀 구성 가이드
EP2AGZ350FF35C4N(35 x 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350FF35C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350FF35C4N 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Wireline Backhaul and 10G Ethernet Aggregation, Broadcast Video Processing, Military Radar and Electronic Warfare, High-Performance Test and Measurement Equipment, Medical Imaging Systems.
Wireless Baseband Processing
The EP2AGZ350FF35C4N's 348,500 logic elements and 24 multi-gigabit transceivers make it well suited for wireless baseband signal processing where CPRI and OBSAI fronthaul links must be aggregated alongside fast Fourier transforms and channelization filters. At 0.9 V core on 40 nm, the device consumes less power than Stratix IV while still delivering up to 500 MHz fabric performance for high-rate baseband datapaths. The 21,270,528 bits of embedded memory are ample for storing time-domain samples, channel estimates, and intermediate buffers, while 554 user I/Os support wide parallel buses to RFICs and analog front ends. Designers typically place the FPGA between the radio card and the baseband L1 ASIC, processing IQ data and implementing physical-layer functions such as crest factor reduction and digital predistortion.
추천
Wireline Backhaul and 10G Ethernet Aggregation
Multi-gigabit transceivers on the EP2AGZ350FF35C4N natively support XAUI, 10GBASE-R, and Serial RapidIO, simplifying 10G Ethernet aggregation switches and routers for mobile backhaul. The 348,500 LEs provide headroom for packet classification engines, traffic managers, and MAC tables, while the 21 Mbit of embedded memory is sufficient for store-and-forward buffering at line rate. Hardware designers typically implement four to eight SFP+ ports or a single XFP interface directly to the FPGA, using the device's LVDS I/Os to interface with PHY sidebands. This application benefits from Quartus II IP cores for 10G Ethernet MAC and PCS that are validated against the Arria II GZ transceiver toolkit.
추천
Broadcast Video Processing
With 348,500 LEs and abundant on-chip RAM, the EP2AGZ350FF35C4N supports uncompressed HD/3G-SDI and emerging 4K video processing pipelines, including color space conversion, scaling, de-interlacing, and frame-rate conversion. The transceiver channels accept SDI streams at 270 Mb/s, 1.485 Gb/s, and 2.97 Gb/s directly without an external PHY. The 554 user I/Os connect to DDR2/DDR3 memory for buffering multiple video frames, and to HDMI or DisplayPort transmitters for output. Compared with ASIC-based broadcast designs, the FPGA provides rapid feature updates in response to evolving standards, with upgrade paths that preserve the FC-FBGA-1152 PCB.
추천
Military Radar and Electronic Warfare
The high logic density and DSP throughput of the EP2AGZ350FF35C4N make it a strong candidate for radar pulse compression, beamforming, and electronic countermeasure systems. Each Arria II GZ contains hundreds of 18x18 multipliers for FFT and pulse-Doppler processing, while 21 Mbits of embedded memory can be partitioned for windowed sample storage and CFAR tables. The serial transceivers are used to fan out digitized antenna channels to back-end processors. Designers in this segment value the FPGA's deterministic latency and the FPGA-to-ASIC migration path that the 40 nm process node enables. Thermal management and ruggedized packaging variants are typical considerations.
추천
High-Performance Test and Measurement Equipment
The 348,500 LEs and 24 transceivers in the EP2AGZ350FF35C4N are well matched to high-speed digitizers, protocol analyzers, and arbitrary waveform generators where many parallel DSP channels must be processed in real time. The 554 user I/Os are sufficient for direct connection to multiple ADC/DAC devices, while the transceivers support USB 3.0, SATA, and PCIe Gen2 backhaul to a host controller. On-chip M20K memory blocks provide low-latency waveform lookup tables, and the Quartus II DSP Builder toolkit accelerates FIR, FFT, and DDS IP development. The FC-FBGA-1152 package keeps board complexity manageable in dense test instruments.
추천
Medical Imaging Systems
Ultrasound, CT, and MRI systems benefit from the parallel DSP performance of the EP2AGZ350FF35C4N. Beamforming in ultrasound requires hundreds of multiply-accumulate operations per sample per channel, and the 348,500 LEs of fabric combined with dedicated hardware multipliers can process dozens of channels simultaneously. The 21 Mbits of embedded memory hold beamformed line data, envelope-detected samples, and tissue-harmonic image buffers. The transceivers connect to high-speed analog front ends and to backplane links between processing cards. Medical OEMs value the FPGA's deterministic timing for synchronization with imaging pulse sequences.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350FF35C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350FF35C4G | EP2AGZ350FF35C3N | EP2AGZ350FF35C3G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35 mm) | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same |
| Logic Elements | 348,500 | 348,500 | 348,500 | 348,500 |
| Speed Grade | C4 | C4 | C3 (~10-15% slower fmax) | C3 (~10-15% slower fmax) |
| RoHS / Lead-Free Mark | Lead-free ('N' suffix) | RoHS 'G' suffix (Pb-free mark) | Lead-free 'N' suffix | RoHS 'G' suffix (Pb-free mark) |
| Embedded Memory (bits) | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 |
| LABs | 13,940 | 13,940 | 13,940 | 13,940 |
| User I/Os | 554 | 554 | 554 | 554 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm |
주요 차별점
- Maximum logic density in the Arria II GZ family (vs EP2AGZ300FF35C4N)
- Fastest C4 speed grade for maximum fmax (vs EP2AGZ350FF35C3N)
- Compatible with Quartus II v13.1 and earlier IP ecosystem (vs Arria 10 10AX115N3F40I2SG)
설계 노트
The EP2AGZ350FF35C4N requires a multi-rail power tree: 0.9 V core (high current, low noise), 1.1 V for PLL and transceiver PLLs, 2.5 V for differential I/O banks, and 3.3 V for legacy I/O and configuration. Decoupling requirements per the Arria II GZ device handbook call for hundreds of ceramic capacitors (0402/0201) placed directly under the BGA balls, plus bulk polymer or tantalum capacitors. Use the Quartus II PowerPlay early power estimator during architecture to size each rail before finalizing your DC-DC converters - the 0.9 V core in particular can draw tens of amps under maximum fabric utilization, demanding a multiphase buck controller.
At full transceiver and fabric utilization, the EP2AGZ350FF35C4N can dissipate 10-15 W. The FC-FBGA-1152 package uses an integrated heat spreader (IHS) - design the board with thermal vias under the BGA and consider a forced-air heatsink for industrial or military temperature grades. Use the Arria II GZ thermal model (junction-to-ambient theta_JA from the package datasheet) and your enclosure airflow assumption to compute the steady-state junction temperature. Estimated: typical commercial FC-FBGA-1152 theta_JA is 8-12 C/W with 200 LFM airflow; verify with Intel's thermal model.
The 1152-ball FC-FBGA at 35x35 mm requires a high-density PCB stack-up with 1.0 mm or 0.8 mm BGA pitch escape routing. Use microvia (laser-drilled) stack-ups with at least 6 layers for signal escape, 2 layers for ground, and 2 for power. Maintain 100 ohm differential impedance for LVDS and transceiver pairs, and 50 ohm single-ended for the global clock and high-speed control. Pin swapping through Quartus II helps simplify the PCB routing of large parallel buses to external memory.
Group LVDS pairs on dedicated I/O banks to meet the Arria II GZ I/O bank skew and matching requirements. Place external memory interfaces (DDR3) on the same bank group whenever possible to enable use of the dedicated DQS/DQSn delay lines. Keep high-speed transceiver channels on the dedicated transceiver banks; do not route general-purpose LVDS pairs on transceiver balls. Use the Quartus II Fitter resource utilization summary to verify I/O placement is achievable before PCB fabrication.
Do not attempt to migrate the EP2AGZ350FF35C4N design to a different package family (such as the Arria 10 FBG) without re-doing the entire PCB - the ball maps are NOT pin-compatible across families. Confirm configuration mode (AS, PS, JTAG) and select the correct EPCS or EPCQ configuration memory device with 3.3 V tolerance. Finally, verify that your Quartus II version supports the EP2AGZ350 device: Quartus II v13.1 is the last version with full Arria II GZ support.
규정 준수 정보
Lead-free finish confirmed per ordering code; RoHS compliance explicitly marked on 'G' suffix variant. AEC-Q100 is not applicable for FPGAs (automotive-grade variants are designated by 'A' in the ordering code).