EP2AGZ350FF35I3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Altera
부품 번호: EP2AGZ350FF35I3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4861.76 | $4,861.76 |
| 10 | $4618.67 | $46,186.70 |
| 25 | $4375.58 | $109,389.50 |
| 100 | $3986.84 | $398,684.00 |
| 500 | $3598.1 | $1,799,050.00 |
EP2AGZ350FF35I3N 개요
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can program to implement any digital logic function after manufacturing. FPGAs sit above ASICs and microcontrollers in the design flexibility hierarchy, providing parallel hardware execution with deterministic latency. The Arria II GZ family targets mid-range transceiver-based applications bridging Stratix IV performance with Cyclone IV cost efficiency.
Key features include 13,940 Logic Array Blocks (LABs), 16 global clock networks, 8 PLLs, dedicated DSP blocks for high-speed arithmetic, and hard PCI Express Gen1/Gen2 IP blocks. The device supports DDR3 external memory interfaces up to 800 Mbps and integrates transceivers compliant with CPRI, OBSAI, Serial RapidIO, and 10 Gigabit Ethernet protocols, making it well suited for communication infrastructure.
The EP2AGZ350FF35I3N uses a transceiver-rich architecture with embedded SERDES, hard memory controllers, and a structured ASIC-like logic fabric. The 40nm process and 0.9V core voltage balance switching performance against dynamic power, while the FC-FBGA package exposes the silicon die backside for thermal dissipation through a heatsink.
Typical applications include wireless baseband processing, software defined radio, radar signal processing, high-performance DSP pipelines, and 10G/40G networking line cards. The integrated transceivers eliminate external PHY ICs, reducing BOM cost and PCB area in dense systems.
When designing with this device, plan thermal management carefully — a 1152-ball FC-FBGA typically dissipates 8–15W in transceiver applications and requires a heatsink plus adequate airflow. Use Altera Quartus II for synthesis, place-and-route, and power estimation, and verify all transceiver channels with the Arria II Transceiver Toolkit.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone — giving engineers a single-source decision aid for sourcing, replacement, and layout planning.
드롭인 대체품: EP2AGZ350FF35I3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350FF35I3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Mounting Type, Logic Array Blocks (LABs), Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350FF35I3G
✅ 드롭인✓ 재고 있음
$1850 / 개
데이터시트 보기 →EP2AGZ350FF35C4N
✅ 드롭인✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP2AGZ350FF35C3N
✅ 드롭인✓ 재고 있음
$2250 / 개
데이터시트 보기 →EP2AGZ300FF35I3N
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP2AGZ225FF35I3N
✅ 드롭인✓ 재고 있음
$2655 / 개
데이터시트 보기 →EP2AGZ350FF35I3N 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Logic Elements | 348,500 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory (bits) | 21,270,528 |
| User I/Os | 554 |
| Number of Transceivers | 24 |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| 패키지 | 1152-ball FC-FBGA (Flip-Chip FineLine BGA) |
| 실장 유형 | Surface Mount |
| PLLs | 8 |
| Global Clock Networks | 16 |
| RoHS 상태 | Compliant |
EP2AGZ350FF35I3N 1152-ball fc-fbga (flip-chip fineline bga) 핀 구성 가이드
EP2AGZ350FF35I3N(1152-ball fc-fbga (flip-chip fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350FF35I3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350FF35I3N 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Software Defined Radio, Radar Signal Processing, High-Performance DSP Pipelines, 10G/40G Networking Line Cards, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGZ350FF35I3N is well matched for wireless baseband processing because its 24 transceivers up to 6.375 Gbps aggregate multiple antenna or radio-front-end data streams into the FPGA fabric simultaneously. The 348,500 logic elements implement channelization, rate matching, FFT/iFFT, and Turbo/LDPC decoding in hardware, while the 21,270,528 bits of embedded RAM buffer IQ samples between DSP stages to sustain multi-carrier LTE or 5G NR throughput. The FC-FBGA package exposes the die backside for direct heatsink attachment — important when LTE macro base stations dissipate 10–15W across the FPGA. Designers typically run the Arria II GZ alongside an external RF transceiver and DDR3 memory, leveraging Altera's hard CPRI and OBSAI IP cores for fronthaul connectivity.
추천
Software Defined Radio
The EP2AGZ350FF35I3N fits software defined radio (SDR) platforms where multiple IF/RF channels must be digitized and processed in parallel. Its 24 SERDES channels cover the 6.375 Gbps data rates produced by high-speed ADCs sampling IF bands at hundreds of MSPS, while the 348,500 logic elements implement channelizers, DDC/DUC blocks, and modulation/demodulation pipelines. The industrial temperature grade allows deployment in outdoor military or commercial radio housings. Typical SDR designs combine this FPGA with an analog-front-end daughter card and use Altera's DSP Builder to accelerate the math-intensive channel processing without CPU intervention.
추천
Radar Signal Processing
Radar signal processing requires deterministic latency and high memory bandwidth — two strengths of the EP2AGZ350FF35I3N. The 24 transceivers ingest multi-channel ADC data from phased-array antennas at Gbps line rates, while 21 Mbits of embedded RAM act as range-bin and Doppler-bin buffers for pulse compression. Hard DSP blocks accelerate FFT-based matched filtering, and 16 global clock networks synchronize the radar timing reference across the device. Military and weather-radar systems value the industrial -40C/+100C temperature grade for airborne or outdoor installations, and the FC-FBGA package supports forced-air and heatsink cooling at 12–15W typical dissipation.
추천
High-Performance DSP Pipelines
The EP2AGZ350FF35I3N delivers hundreds of GMACs of DSP throughput via dedicated multiplier blocks distributed across 13,940 LABs, ideal for medical imaging, scientific instrumentation, and industrial inspection pipelines. Each LAB includes hardware multiplier/adder chains that accelerate FIR filters, FFTs, and matrix math at line rate without consuming fabric logic. The 21,270,528-bit embedded memory supports deep line buffers for 2D convolution kernels used in image processing. Designers typically pair this FPGA with external DDR3 memory using the hard memory controller, achieving sustained multi-GB/s memory bandwidth.
추천
10G/40G Networking Line Cards
The EP2AGZ350FF35I3N is suited for 10 Gigabit and 40 Gigabit Ethernet line cards because its 24 transceivers support 10GbE, Serial RapidIO, and Interlaken protocols directly. Hard PCS and PMA blocks handle serialization, clock recovery, and gearbox functions, while the 348,500 logic elements implement packet classification, policing, and forwarding at line rate. The 21 Mbits of embedded memory absorb micro-bursts on ingress queues, and the 1152-ball FC-FBGA keeps the design on a single chip rather than multiple FPGAs. Industrial temperature grade supports outdoor router chassis and industrial switches.
추천
Test and Measurement Instrumentation
Test and measurement instruments such as high-end oscilloscopes, protocol analyzers, and BERT testers use the EP2AGZ350FF35I3N to capture and process multi-Gbps signals in real time. The 24 SERDES channels accept raw ADC outputs from digitizer front-ends, while the 348,500 logic elements implement triggering, eye-diagram analysis, and protocol decoding. Industrial temperature grade and the FC-FBGA thermal envelope support benchtop and rack-mount chassis with forced-air cooling. The 21 Mbits of embedded memory provide deep capture buffers, extending acquisition windows beyond what external memory alone allows.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350FF35I3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350FF35I3G | EP2AGZ350FF35C4N | EP2AGZ350FF35C3N | EP2AGZ300FF35I3N | EP2AGZ225FF35I3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 348,500 | 348,500 (same die) | 348,500 (same die) | 348,500 (same die) | 300,000 (-14%) | 225,000 (-36%) |
| Embedded Memory (bits) | 21,270,528 | 21,270,528 (same) | 21,270,528 (same) | 21,270,528 (same) | 17,977,216 (-15%) | 13,977,216 (-34%) |
| User I/Os | 554 | 554 | 554 | 554 | 554 | 554 |
| Operating Temperature | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | I3 (industrial, 3) | I3 (same) | C4 (faster) | C3 (commercial, 3) | I3 (same) | I3 (same) |
| Transceivers / Speed | 24 ch / 6.375 Gbps | 24 ch / 6.375 Gbps | 24 ch / 6.375 Gbps | 24 ch / 6.375 Gbps | 24 ch / 6.375 Gbps | 24 ch / 6.375 Gbps |
주요 차별점
- Highest logic density in the 1152-ball FF35 footprint (vs EP2AGZ300FF35I3N)
- Industrial temperature grade in the FF35 package (vs EP2AGZ350FF35C4N)
- Tape-and-reel carrier option for high-volume SMT (vs EP2AGZ350FF35I3G)
설계 노트
Estimated: the 1152-ball FC-FBGA package dissipates 8–15W in typical transceiver-mode operation (24 channels at 6.375 Gbps, ~85% transceiver utilization). With theta_JA of approximately 0.6 C/W on a properly designed heatsink-attached PCB (per Arria II GZ thermal guidelines), junction temperature rises 5–9C above heatsink. A forced-air-cooled heatsink with 200 LFM airflow is recommended for industrial-temperature designs; without a heatsink the part will exceed its 100C rating within seconds under full load.
Use a high-layer-count PCB (at least 12 layers) with continuous ground planes beneath the FC-FBGA. Provide 1152 ball pads with non-solder-mask-defined (NSMD) lands per JEDEC JESD-B3S1. Fan-out the inner rows to inner layers through micro vias, and dedicate at least 2 ground planes to the transceiver bank supplies. Maintain 100-ohm differential impedance on all SERDES lanes and follow the Altera Arria II GZ pin-out file for bank supply decoupling — at least one 0.1 uF + one 10 uF ceramic per transceiver power pin.
SERDES channels at 6.375 Gbps require matched-length routing (within 5 mils) and loss-budget analysis through the Arria II Transceiver Toolkit. Use AC-coupled interconnects with 100 nF capacitors on the SERDES TX/RX pairs. Reference-clock jitter must be below 1 ps RMS for CPRI and 10GbE compliance; route the reference clock on an inner stripline layer with ground shielding on both sides.
Do not confuse the I3 (industrial speed grade 3) suffix with a package code — speed grade 3 is the slowest of the family. If your design timing-margin is tight, choose EP2AGZ350FF35C4N (speed grade 4, commercial) instead. Also note the 'FF35' in the part number refers to the FF package family with 1152 balls; the second digit '35' is the die pin-out code and must match the datasheet, not be confused with package size.
Plan a multi-rail power supply: 0.9V core (VCC), 1.1V transceiver PLLs, 1.5V transceiver channels, and 2.5V/3.0V I/O banks. Use a sequencing controller to enforce core-before-I/O ramp per Arria II GZ power-up guidelines. Estimate power using the Quartus PowerPlay Early Power Estimator before committing to PCB layout — the 0.9V core alone can pull 10A under full utilization.
규정 준수 정보
RoHS and lead-free compliance per Altera/Intel product specifications. AEC-Q100 not applicable — FPGAs are not AEC-Q100 qualified automotive components. Halogen-free status not explicitly published in the verified data; set to 'unknown' rather than guessed.
