EP2AGZ350FF35I4G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA
부품 번호: EP2AGZ350FF35I4G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9707.76 | $9,707.76 |
| 10 | $8737 | $87,370.00 |
| 100 | $7766.21 | $776,621.00 |
| 500 | $6795.43 | $3,397,715.00 |
| 1,000 | $5824.66 | $5,824,660.00 |
EP2AGZ350FF35I4G 개요
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, memory controllers, and DSP blocks. FPGAs occupy a distinct position in the programmable logic hierarchy: below ASICs in per-unit cost and power at very high volumes, but above microcontrollers and DSPs in raw parallel processing throughput and reconfigurability. The Arria II GZ family specifically targets mid-range applications that require transceivers, moderate logic density, and cost-effective 40nm process technology.
Key features of the EP2AGZ350FF35I4G include support for DDR3 memory interfaces up to 800 Mbps, integrated PCI Express hard IP blocks (Gen1/Gen2), up to 8 PLLs, and a high-performance DSP block architecture. The 40nm process node balances static and dynamic power while preserving high core performance for signal-processing pipelines. The industrial temperature grade (I4 suffix, -40C to +100C ambient) suits outdoor, automotive, and industrial-control deployments.
The architecture combines dedicated transceiver circuitry with general-purpose FPGA fabric, allowing designers to implement custom high-speed protocols alongside parallel DSP, packet processing, or embedded-processor (Nios II) subsystems. With 18x18 multipliers and dedicated accumulator chains, the device accelerates FFT, FIR, and matrix operations common in wireless baseband and video processing.
Typical applications include wireless LTE/4G baseband cards, high-speed serial backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of 16 transceivers and high logic density makes it well suited for applications bridging multiple high-speed serial interfaces.
When designing with this device, careful attention to power integrity (multiple 0.9V/1.1V/1.5V/2.5V rails), thermal management of the 35mm BGA, and signal-integrity routing for SERDES lanes is essential. Reference Quartus II design examples demonstrate reference implementations for DDR3 controller, PCIe Gen2 endpoint, and CPRI/OBSAI interfaces.
This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes compiled from the Altera/Intel datasheet family and authorized distributor listings as of 2026-09-08.
드롭인 대체품: EP2AGZ350FF35I4G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350FF35I4G (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Transceivers, Speed Grade, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350FF35I4
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGZ350FF35C4G
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2AGZ350FF35C3G
✅ 드롭인✓ 재고 있음
$2680 / 개
데이터시트 보기 →EP2AGZ350FF35I3G
✅ 드롭인✓ 재고 있음
$1850 / 개
데이터시트 보기 →EP2AGZ300FF35I4G
✅ 드롭인✓ 재고 있음
$2610 / 개
데이터시트 보기 →EP2AGZ350FF35I4G 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Logic Elements | 350,000 |
| Embedded Memory (M9K + M144K) | 21,270 Kbits |
| Maximum User I/O | 554 |
| Number of Transceivers | 16 (up to) |
| Maximum Transceiver Data Rate | 6.375 Gbps per channel |
| Number of PLLs | 8 |
| 패키지 | 1152-BGA, FCBGA (FF35), 35mm |
| Process Node | 40 nm |
| Operating Temperature Grade | Industrial (-40C to +100C ambient, I4 suffix) |
| PCI Express Hard IP | Gen1/Gen2 supported |
| Memory Interface Support | DDR3 up to 800 Mbps, DDR2, QDRII+, RLDRAM II |
| Configuration | Serial (AS), Parallel (AP), Fast Passive Parallel (FPP), JTAG |
| RoHS 상태 | Compliant (per Altera/Intel product family) |
| 실장 유형 | Surface Mount (BGA) |
EP2AGZ350FF35I4G 1152-bga, fcbga (ff35), 35mm 핀 구성 가이드
EP2AGZ350FF35I4G(1152-bga, fcbga (ff35), 35mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350FF35I4G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350FF35I4G 적합 용도: 6 애플리케이션s: Wireless LTE / 4G Baseband Processing, High-Speed Serial Backplane Aggregation, Broadcast Video Processing and Routing, ASIC Prototyping and Emulation, PCI Express Endpoint / Root Complex Cards, Industrial Control and Test Instrumentation.
Wireless LTE / 4G Baseband Processing
The EP2AGZ350FF35I4G fits wireless LTE/4G baseband designs because of its 350K logic elements, 16 transceivers running up to 6.375 Gbps for CPRI/OBSAI fronthaul, and DSP blocks optimized for FFT, channel estimation, and Turbo decoding. The industrial temperature grade and 21 Mbit embedded memory allow full baseband datapath plus MAC scheduler on one device. Compared with microcontrollers or DSP-only solutions, the FPGA delivers the parallel throughput required for 20 MHz LTE carrier aggregation. Typical power envelope at 70% utilization is approximately 8-10 W, well within the FF35 thermal budget with proper heatsink.
추천
High-Speed Serial Backplane Aggregation
With 16 transceivers capable of 6.375 Gbps each, EP2AGZ350FF35I4G is well suited for aggregating multiple CPRI, OBSAI, Serial RapidIO, or 10G backplane links. The 554 user I/O provide abundant LVDS / HSTL / SSTL sideband signaling, while 21 Mbit embedded memory buffers packet headers and statistics counters. The dedicated 8 PLLs allow independent baud-rate programming for each link. Compared with ASIC implementations, the FPGA gives NEMs reconfigurable protocol support without mask charges.
추천
Broadcast Video Processing and Routing
The 350K logic elements and high embedded memory bandwidth of EP2AGZ350FF35I4G accommodate uncompressed 3G-SDI / HD-SDI routing matrices, video-over-IP gateway functions, and overlay graphics insertion. The DDR3 controller hard IP supports frame-buffer memory up to 800 Mbps, while the 6.375 Gbps transceivers enable SDI-over-IP and SMPTE 2022 links. Compared with ASSP video processors, the FPGA allows custom routing fabrications with arbitrary crosspoint sizes up to 96x96 in this device class.
추천
ASIC Prototyping and Emulation
The 350K logic elements, 21 Mbit embedded memory, and 1152-BGA FF35 footprint of EP2AGZ350FF35I4G make it an effective ASIC prototyping platform. Quartus II supports time-domain multiplexing of large ASIC designs across multiple FPGAs via the HSSI and LVDS pins, and the high pin count supports partitioned ASIC prototyping boards. Industrial temperature grade supports in-system bring-up on real hardware. Compared with ASIC tape-out, the FPGA iteration loop is minutes vs weeks.
추천
PCI Express Endpoint / Root Complex Cards
The EP2AGZ350FF35I4G's integrated PCIe Gen1 / Gen2 hard IP and 16 transceivers enable PCIe endpoint and root-complex designs in industrial, test, and instrumentation cards. The hard IP block handles transaction layer, link training, and retry buffers, freeing the FPGA fabric for application logic. The 554 user I/O provide expansion buses for ADC/DAC, GPIO, and memory daughter cards. Compared with PCIe-only ASSPs, the FPGA adds reconfigurable DMA engines and custom interrupt controllers.
추천
Industrial Control and Test Instrumentation
The industrial -40C to +100C temperature grade, 6.375 Gbps transceivers, and 350K logic elements suit EP2AGZ350FF35I4G for industrial-control and test-instrumentation platforms. The DSP blocks accelerate FFT-based spectrum analysis, while the embedded memory buffers deep acquisition records. Industrial protocols such as EtherCAT, PROFINET, and serial fieldbus can be implemented in the FPGA fabric with custom logic. Compared with microcontrollers, the FPGA delivers deterministic parallel sampling across hundreds of channels.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350FF35I4G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350FF35I4 | EP2AGZ350FF35C4G | EP2AGZ350FF35C3G | EP2AGZ350FF35I3G | EP2AGZ300FF35I4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BGA, FCBGA (FF35) | 1152-BGA, FCBGA (FF35) - same | 1152-BGA, FCBGA (FF35) - same | 1152-BGA, FCBGA (FF35) - same | 1152-BGA, FCBGA (FF35) - same | 1152-BGA, FCBGA (FF35) - same |
| Logic Elements | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 300,000 (-14%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 4 (I4) | 4 | 4 | 3 (slower) | 3 (slower) | 4 |
| Transceivers (max) | 16 (6.375 Gbps) | 16 (6.375 Gbps) | 16 (6.375 Gbps) | 16 (6.375 Gbps) | 16 (6.375 Gbps) | 16 (6.375 Gbps) |
| Lifecycle Status (2026-09-08) | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Industrial temperature grade with lead-free packaging (vs EP2AGZ350FF35I4)
- Higher speed grade (4) vs speed grade 3 variants (vs EP2AGZ350FF35C3G)
- 350K logic elements for maximum design headroom (vs EP2AGZ300FF35I4G)
설계 노트
Estimated: Arria II GZ devices typically require four core and I/O rails (0.9V core, 1.1V PLL/Transceiver analog, 1.5V/2.5V I/O, 3.3V configuration). Decoupling per Altera's pin connection guidelines requires approximately 100 low-ESL ceramic capacitors near the BGA balls. Designers should use a 6+ layer PCB with dedicated power and ground planes; a quiet analog supply for the transceiver PLLs is mandatory to meet jitter specifications.
Estimated: The 1152-ball FCBGA package typically has theta_JA near 6-8 C/W with a 1 m/s airflow. At a target power dissipation of 12 W, junction temperature rise above ambient is approximately 90C, which can exceed the 100C industrial maximum. A heatsink with 0.5 C/W or higher, plus 200 LFM forced-air cooling, is strongly recommended for industrial-temperature deployments. Reference the Altera thermal model for accurate simulation.
Estimated: The 1152-BGA FF35 has a 1.0 mm ball pitch, requiring microvia (stacked) PCB technology with laser-drilled vias and sequential lamination. Maintain 50-ohm controlled impedance for transceiver differential pairs (typically 100-ohm differential) and 50-ohm single-ended for high-speed LVDS. Use length matching within 150 mils on the eight transceiver channels; skew mismatch directly degrades eye margin at 6.375 Gbps.
Recommended: For 6.375 Gbps transceiver channels, use a 4-layer stack-up with stripline routing, ground stitching vias every 200 mils along the channel, and AC-coupling capacitors (0.1 uF X7R 0402) within 1 cm of the transmitter pads. Reference Altera's AN 580 'Design Guidelines for High-Frequency Signals' for via optimization and return-path continuity. Simulate channel loss with the package model provided by Intel.
Common pitfalls include: (1) using the wrong configuration mode (AS vs JTAG) and bricking the device during a failed update, (2) exceeding the maximum LVDS toggle frequency (typically 1.6 Gbps per pair) when designing DDR3 interfaces, and (3) leaving configuration MSEL pins floating, which causes unpredictable boot behavior. Always strap MSEL pins via 4.7 kohm pull-ups to a defined logic level per the Arria II GZ configuration user guide.
규정 준수 정보
RoHS compliance indicated by 'G' suffix per Altera/Intel product family convention. Industrial temperature grade (I4) and lead-free finish are the primary compliance features; AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC.
