EP2AGX125DF25I5G - Arria II GX FPGA 118K LE, 8.3Mb, 572-FCBGA
부품 번호: EP2AGX125DF25I5G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
EP2AGX125DF25I5G 개요
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded RAM. FPGAs sit within the programmable logic hierarchy as cousins to CPLDs and ASICs, and they are widely used to implement custom digital signal processing, high-speed serial interfaces, and glue logic without the NRE cost of an ASIC. The Arria II GX family targets mid-range applications that need a balance of logic density, transceiver bandwidth, and power efficiency.
Key features of the EP2AGX125DF25I5G include 8.315 Mbits of on-chip memory (about 8.3 Mb), 576 (9-bit) embedded multiplier blocks, and 12 full-duplex transceivers with CMU, PMA, and PCS support up to 3.75 Gbps. The -I5 speed grade and industrial -40C to +100C junction temperature rating make it suitable for harsh environments, while the 572-pin FC-FBGA package supports high signal integrity for dense, multi-gigabit designs.
The architecture combines a fine-grained logic fabric with dedicated hard IP blocks, reducing power versus a soft-only implementation and freeing fabric resources for user logic. Designers use Quartus II to compile, place-and-route, and program the device via JTAG or active serial configuration, allowing rapid design iteration.
Typical applications include wireless baseband processing, high-speed serial protocol bridging (PCIe Gen1/Gen2, CPRI, OBSAI, XAUI, SDI), video and imaging pipelines, and industrial control planes that demand deterministic latency. The transceiver-rich fabric is particularly well matched to telecom fronthaul and backhaul.
When designing with this device, plan the PCB for FC-FBGA fan-out, thermal management (multiple GND balls for the exposed die), and reference-clock distribution, because transceivers require very clean, low-jitter clocks to meet eye-mask compliance.
드롭인 대체품: EP2AGX125DF25I5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX125DF25I5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Mounting Type, DSP Blocks, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX125DF25I3G
✅ 드롭인✓ 재고 있음
$895 / 개
데이터시트 보기 →EP2AGX125DF25C6G
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2AGX125DF25C5G
✅ 드롭인✓ 재고 있음
$399.5 / 개
데이터시트 보기 →EP2AGX125DF25C4G
✅ 드롭인✓ 재고 있음
$399.95 / 개
데이터시트 보기 →EP2AGX125EF29I5G
✅ 드롭인✓ 재고 있음
$861.62 / 개
데이터시트 보기 →EP2AGX125DF25I5G 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements | 118,143 |
| Embedded Memory (Bits) | 8,315,904 |
| User I/O Count | 260 |
| Number of Transceivers | 12 |
| Transceiver Data Rate (max) | 3.75 Gbps |
| Embedded Multipliers (9-bit) | 576 |
| Core Voltage | 0.9 V |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | I5 |
| 패키지 | 572-BGA, FC-FBGA |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2AGX125DF25I5G 572-bga, fc-fbga 핀 구성 가이드
EP2AGX125DF25I5G(572-bga, fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX125DF25I5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX125DF25I5G 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, High-Speed Serial Protocol Bridging, Video and Imaging Pipelines, Industrial Control and Automation, Telecom Fronthaul and Backhaul, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX125DF25I5G fits wireless baseband processing because it combines 118,143 logic elements with 576 9-bit embedded multipliers and 8.3 Mb of block RAM, providing the DSP fabric needed for LTE, WiMAX, and similar OFDM baseband pipelines. The 12 transceivers running up to 3.75 Gbps support CPRI and OBSAI fronthaul links between baseband units and remote radio heads. Industrial -40C to +100C operation enables outdoor base-station and small-cell deployment without derating.
추천
High-Speed Serial Protocol Bridging
For PCIe Gen1/Gen2 endpoint or root-complex bridging, XAUI, SDI, or CPRI aggregation, the EP2AGX125DF25I5G offers 12 integrated transceivers at up to 3.75 Gbps each - enough lanes for x4 PCIe plus auxiliary serial links on a single device. Its dedicated PMA/PCS hard IP simplifies PHY compliance work, and the 8.3 Mb of embedded memory acts as packet buffering between the bridge and host CPU. The 572-ball FC-FBGA preserves signal integrity on multi-gigabit traces.
추천
Video and Imaging Pipelines
The EP2AGX125DF25I5G suits broadcast video and machine-vision pipelines thanks to its 576 DSP multipliers (driving pixel-rate processing) and 260 user I/Os (supporting wide parallel camera buses, HDMI/DVI interfaces, and SDI serializer/deserializer companion chips). The 8.3 Mb block RAM buffers line-scan and frame buffers without external SRAM, simplifying PCB layout and reducing BOM cost. Industrial temperature rating is valuable for outdoor surveillance and factory imaging systems.
추천
Industrial Control and Automation
In PLC, motor-control, and deterministic industrial networks, the EP2AGX125DF25I5G provides reliable programmable logic with industrial temperature operation from -40C to +100C. Designers can integrate multiple EtherCAT, PROFINET, or SERCOS III slaves alongside proprietary deterministic protocols using the FPGA fabric, while the 12 transceivers carry high-speed backplane or inter-module links. The robust FC-FBGA package handles vibration and thermal-cycling environments typical of factory floors.
추천
Telecom Fronthaul and Backhaul
The EP2AGX125DF25I5G is a strong fit for CPRI/OBSAI fronthaul aggregation and small-cell backhaul routers because it pairs 12 transceivers up to 3.75 Gbps with enough logic for layer-1/2 forwarding, encryption, and timing distribution. Its industrial temperature range and 572-ball FC-FBGA signal-integrity package suit outdoor enclosures and high-density line cards. The 8.3 Mb of embedded memory also enables substantial packet queuing without external SSRAM.
추천
Test and Measurement Instrumentation
The EP2AGX125DF25I5G supports high-channel-count T&M instruments by combining 260 user I/Os for parallel ADC/DAC interfaces, 576 DSP multipliers for real-time FFT/channelization, and 12 transceivers for fast data offload to host processors over PCIe or XAUI. The 8.3 Mb of block RAM captures deep time-domain windows without external memory. Industrial temperature operation makes the device usable in lab and field-portable equipment alike.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX125DF25I5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX125DF25I3G | EP2AGX125DF25C6G | EP2AGX125DF25C5G | EP2AGX125DF25C4G |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA | 572-BGA, FC-FBGA |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 |
| Embedded Memory (Bits) | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 |
| Transceivers | 12 | 12 | 12 | 12 | 12 |
| Transceiver Max Data Rate | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps | 3.75 Gbps |
| Speed Grade | I5 (industrial) | I3 (industrial, faster) | C6 (commercial, faster) | C5 (commercial) | C4 (commercial, slower) |
| Operating Temperature | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| User I/O Count | 260 | 260 | 260 | 260 | 260 |
주요 차별점
- Industrial temperature rating in a mid-density Arria II GX device (vs EP2AGX125DF25C6G)
- Balanced speed grade (I5) vs fastest option (vs EP2AGX125DF25I3G)
- 12 transceivers at 3.75 Gbps in mid-power family (vs EP2C50F672I8N (Cyclone II))
설계 노트
Estimated: Arria II GX FPGAs in the 572-ball FC-FBGA package dissipate roughly 6-10 W typical and can reach 12-15 W at high transceiver utilization, based on Altera PowerPlay early estimator assumptions for the EP2AGX125 device. The FC-FBGA exposes the die through the package top, so a heatsink with thermal interface material is recommended, plus generous PCB copper thermal vias under the central GND ball grid to keep junction temperature within the 100C industrial limit.
Lay out the 572-ball FC-FBGA with microvia stack-up (laser-drilled microvias to inner escape layers) and matched-length differential pairs for the 12 transceiver channels. Reference-clock traces must be length-matched within 25 mil and isolated from noisy switching nets; place a clean, low-jitter clock source within 2 inches of the CLK inputs and follow Altera's Arria II GX board design guidelines for via-in-pad and decoupling (place 0.1 uF + 10 uF capacitors within 100 mil of each power pin).
Provide at least three independent supplies - core (0.9 V), PLL analog (VCCA_PLL), and transceiver supplies (VCCA_TX/RX) - each with its own ferrite bead and bulk decoupling per Altera's Arria II GX pin connection guidelines. Sequence supplies per Altera's recommended power-on/-off order to avoid latch-up; failing to sequence can permanently damage the device. Use a multi-rail controller such as the LTM4675 or similar to simplify compliance.
Do not migrate between speed grades (I5 to C6, etc.) without re-running Quartus II timing analysis, because the same design may fail timing closure on a slower grade. Industrial vs commercial temperature grades also affect junction thermal models and may change PowerPlay estimates. Always re-fit the design in Quartus whenever any ordering-code field changes.
규정 준수 정보
RoHS compliance per Altera/Intel Arria II GX product page; AEC-Q100 not applicable (FPGAs are typically not AEC-Q100 qualified at the -I5 industrial level); conflict-minerals compliant per Intel supplier disclosures.
