EP2C70F896C7 - Cyclone II FPGA 68K LE 622 I/O 896-FBGA | Intel
부품 번호: EP2C70F896C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $441.28 | $441.28 |
| 10 | $397.15 | $3,971.50 |
| 100 | $339.8 | $33,980.00 |
| 500 | $305.5 | $152,750.00 |
| 1,000 | $268.75 | $268,750.00 |
EP2C70F896C7 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers and memory. FPGAs sit in the programmable logic hierarchy below ASICs and below their higher-end kin (Stratix, Arria, Cyclone V/10) for cost-optimized designs. Cyclone II devices are SRAM-based, meaning the configuration bitstream is loaded from an external flash at each power-up and can be re-programmed in-system indefinitely.
Key features include 68,416 logic elements distributed across four- and six-input look-up tables (LUTs), 4,608 Kbits of M4K embedded memory blocks supporting true dual-port operation with parity bits, 150 embedded 18 x 18 multipliers for DSP operations, and 16 global clock networks with up to four PLLs per device. Each I/O pin supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, and RSDS. The configuration interface supports JTAG (IEEE Std 1149.1), Passive Serial (PS), Fast Passive Parallel (FPP), and Active Serial (AS) modes via the dedicated configuration pins.
Cyclone II devices internally operate at 1.2 V core supply with separate VCCIO banks for I/O voltage flexibility, supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfacing. The 150 18 x 18 multipliers can be combined into larger multiplier structures such as 36 x 36 signed multipliers, enabling FIR filters, FFT butterflies, and image-processing pipelines without consuming general-purpose logic. PLLs provide clock multiplication, division, phase shifting, and duty-cycle control, simplifying board-level clock tree design.
Typical applications include industrial motor control and servo drives, video surveillance and image processing, automotive infotainment, telecommunications line cards, low-cost prototyping of ASICs, and embedded control with soft processors such as Nios II. The 896-FBGA package with 622 user I/Os suits designs that demand high off-chip bandwidth, such as DDR/DDR2 memory controllers, video frame buffers, and multi-channel data acquisition. Cyclone II is a mature family often chosen for long-life-cycle industrial, medical, and military programs.
When designing with this part, use the Quartus II design software (version 13.0 sp1 or earlier is the last fully-supported release). Plan power sequencing carefully because Cyclone II requires VCCINT (1.2 V) and VCCIO banks to ramp within datasheet-specified monotonicity, and confirm configuration mode and flash device selection before layout. Always use IBIS models for signal-integrity simulation of DDR2/LVDS links.
This page consolidates distributor pricing, drop-in package-equivalent parts, and practical Quartus II design notes that complement the official Altera Cyclone II handbook.
드롭인 대체품: EP2C70F896C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2C70F896C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Configuration Modes, Operating Temperature Grade, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2C70F896C7N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2C70F896C6
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP2C70F896C6N
✅ 드롭인✓ 재고 있음
$274.8 / 개
데이터시트 보기 →EP2C70F896C7 최대 정격 & 전기적 특성
| Family | Cyclone II |
| Logic Elements (LE) | 68,416 |
| Total Memory Bits | 1,152,000 |
| Embedded Multipliers (18 x 18) | 150 |
| User I/O Pins | 622 |
| 패키지 | 896-ball FBGA |
| Speed Grade | C7 (commercial, slowest) |
| Core Voltage | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Global Clock Networks | 16 |
| PLLs | 4 |
| Process Technology | 90 nm low-k CMOS |
| Configuration Modes | AS, PS, FPP, JTAG |
| 동작 온도 | 0C to +85C (commercial) |
| Memory Blocks (M4K) | 250 (4 Kbit each) |
EP2C70F896C7 896-ball fbga 핀 구성 가이드
EP2C70F896C7(896-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2C70F896C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2C70F896C7 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance & Image Processing, Telecom Line Cards & Protocol Bridging, Embedded Soft-Processor Systems (Nios II), ASIC Prototyping & Emulation, Test & Measurement Front-End.
Industrial Motor Control
The EP2C70F896C7 fits industrial motor control and servo-drive applications because its 622 user I/O pins easily accommodate simultaneous encoder feedback, PWM channels, and multi-axis SPI/CAN interfaces. The 150 embedded 18x18 multipliers handle Park/Clark transforms and space-vector modulation in field-oriented control (FOC) loops, while the 1,152 Kbit on-chip M4K memory buffers sine tables and current-loop samples. Cyclone II's deterministic timing, 16 global clock networks, and 4 PLLs ensure tight PWM jitter at switching frequencies up to 50 kHz. Designers place the FPGA between a 3.3 V MCU host and the power stage, with isolated gate drivers driven directly from the LVCMOS 3.3 V outputs.
추천
Video Surveillance & Image Processing
The EP2C70F896C7 suits video surveillance and image processing pipelines because its 1,152 Kbit of on-chip memory and 622 I/O pins support multi-channel D1 or 720p video capture through external decoders. The 150 dedicated 18x18 multipliers run 2D FIR filters, Sobel edge detection, and H.264 motion estimation in real time, while the dedicated DDR/DDR2 memory controller IP offloads frame buffering to external SDRAM. LVDS I/O support enables direct connection to high-speed image sensors without external transceivers, and the 4 PLLs derive pixel clocks from any source. This part is widely used in multi-camera DVR systems and machine-vision inspection rigs.
추천
Telecom Line Cards & Protocol Bridging
The EP2C70F896C7 fits telecom line-card and protocol-bridging applications because its 622 I/Os and 4 PLLs aggregate multiple E1/T1 framers, HDLC channels, or LVDS backplane lanes. Designers implement ATM-to-Ethernet or TDM-to-IP bridging entirely in fabric, using the 250 M4K memory blocks as elastic FIFOs to absorb timing differences. The 150 multipliers accelerate Reed-Solomon or convolutional codecs for forward error correction, while the LVTTL/SSTL I/O standards connect directly to legacy telecom transceivers. Cyclone II is a common choice for low-port-count DSLAMs, remote terminals, and industrial gateway routers.
추천
Embedded Soft-Processor Systems (Nios II)
The EP2C70F896C7 supports embedded soft-processor systems using the Nios II /f core, where the 622 user I/Os handle Ethernet MAC, USB ULPI, SD-card, and LCD interfaces simultaneously. The 1,152 Kbit of on-chip M4K memory holds instruction cache, data cache, and tightly-coupled SRAM for deterministic interrupt latency. With 68,416 logic elements, designers fit a Nios II /f (32-bit) plus custom peripherals such as UART, SPI, and GPIO in fewer than 8,000 LEs, leaving headroom for application logic. The 4 PLLs and 16 global clocks allow precise timing for SDRAM and multi-bus interfaces.
추천
ASIC Prototyping & Emulation
The EP2C70F896C7 serves as a low-cost ASIC prototyping vehicle for designs up to approximately 500,000 ASIC gates. Engineers partition the ASIC into clock domains and map each partition into one Cyclone II, using the 622 I/Os as prototype chip-to-chip interconnect at LVCMOS 2.5 V/3.3 V. The 150 embedded multipliers and 1,152 Kbit memory allow cycle-accurate modeling of DSP and SRAM macros, while JTAG-based configuration permits rapid compile-test-debug cycles. Quartus II 13.0 sp1 with Synopsys Design Compiler back-end flow is the typical prototyping flow for ASIC tape-out validation.
추천
Test & Measurement Front-End
The EP2C70F896C7 suits digital test and measurement front-ends because its 622 I/Os connect directly to multi-channel data-acquisition ADCs, logic-analyzer probes, and protocol-analyzer pods. The 4 PLLs derive multiple clock domains for sample-rate conversion and trigger logic, while 1,152 Kbit of M4K memory implements deep capture buffers with markers. Engineers run pattern-generation and bit-error-rate test (BERT) cores entirely in fabric, with LVDS I/O pairs supporting high-speed serial test patterns up to 805 Mbps. The 150 multipliers support real-time FFT-based spectrum analysis for signal-integrity test equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2C70F896C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2C70F896C7N | EP2C70F896C6 | EP2C70F896C6N |
|---|---|---|---|---|
| Package | 896-FBGA | 896-FBGA - same | 896-FBGA - same | 896-FBGA - same |
| Brand | Intel | Intel | Intel | Intel |
| Speed Grade | C7 (slowest) | C7 | C6 (~15% faster Fmax) | C6 (~15% faster Fmax) |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 |
| User I/O | 622 | 622 | 622 | 622 |
| Embedded RAM | 1,152 Kbit | 1,152 Kbit | 1,152 Kbit | 1,152 Kbit |
| 18 x 18 Multipliers | 150 | 150 | 150 | 150 |
| Lead-Free Terminal Finish | Not specified | Yes (N suffix) | Not specified | Yes (N suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
주요 차별점
- Same silicon die with lead-free finish (vs EP2C70F896C7N)
- ~15% higher Fmax in same package (vs EP2C70F896C6)
- Lead-free finish plus faster speed grade (vs EP2C70F896C6N)
설계 노트
Cyclone II requires four power rails: VCCINT (1.2 V core), VCCIO (eight banks, 1.5/1.8/2.5/3.3 V), VCCPD (2.5 V for configuration I/O), and VCCA_PLL + VCCD_PLL (analog supplies for each PLL). Power sequencing must ramp VCCINT stable before VCCPD per datasheet rules. Estimated: at 100 MHz toggle rate and 70% utilization, the EP2C70 dissipates approximately 2.5-3.5 W through VCCINT alone; budget at least 5 W total including I/O switching.
The 896-FBGA package has a theta_JA of approximately 14 C/W with a JEDEC JESD51 4-layer test board. Estimated: at 5 W total dissipation, junction temperature rise is about 70 C above ambient. Place thermal vias in the FBGA land pattern to a large inner-plane copper pour for a theta_JA reduction toward 8-10 C/W. For industrial applications, derate ambient to 60 C maximum to stay below the 125 C junction limit.
Use at least 6 PCB layers for the EP2C70F896C7 with dedicated ground and 1.2 V power planes beneath the FPGA. Place 0.1 uF decoupling caps every 20-30 I/O balls and bulk 100 uF caps at each power-pin cluster. Route LVDS pairs with 100 ohm differential impedance and length-matching within 50 mils. Reference the Altera Cyclone II handbook chapter on board design for the complete via-in-pad and microvia guidance specific to the 896-FBGA ball pitch.
Do not assume JTAG configuration is the only mode - the EP2C70's MSEL pins (set during PCB layout) choose Active Serial, Passive Serial, Fast Passive Parallel, or JTAG mode. A wrong MSEL strapping leaves the device un-configured at power-up. Use Quartus II 13.0 sp1 (last supported release) and select a configuration flash compatible with the AS mode (EPCS4/EPCS16/EPCS64) before finalizing the BOM. Always verify pull-up/pull-down resistors on nCE, nCONFIG, and nSTATUS.
For DDR2 interfaces, route address/command with 50 ohm controlled impedance and length-match DQ/DQS within +/-25 mils. Cyclone II PLLs can deskew DQS groups, but the FPGA-internal deskew chain has limited granularity. Always run IBIS simulation with the Altera-provided EP2C70 IBIS model and use HyperLynx or SiSoft QCD for SSO analysis on heavily-loaded synchronous buses.
규정 준수 정보
Compliance status not explicitly stated in retrieved web data. Part is NRND. The 'N' suffix variants (EP2C70F896C7N, EP2C70F896C6N) are typically lead-free per Altera's historical nomenclature. Confirm with supplier CoC.
