A3PE3000L-1FGG896M - 3M Gate ProASIC3L Low Power FPGA | Microchip
부품 번호: A3PE3000L-1FGG896M ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $580 | $580.00 |
| 10 | $545 | $5,450.00 |
| 100 | $498 | $49,800.00 |
| 500 | $465 | $232,500.00 |
| 1,000 | $432 | $432,000.00 |
A3PE3000L-1FGG896M 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. The ProASIC3L family sits within the broader hierarchy of flash-based FPGAs -> programmable logic devices -> programmable semiconductors. Unlike SRAM FPGAs, ProASIC3L devices use nonvolatile flash configuration cells, so they power up instantly without an external configuration PROM and offer inherently higher security against design theft.
Key features include 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device, the patented Flash*Freeze technology that freezes state while cutting core power during idle periods, and single-chip operation with no boot PROM. The 620 user I/Os support low-voltage operation down to 1.2 V, and the 130 nm flash process delivers a balance of density, performance, and low total cost of ownership.
Architecturally, the device integrates versatile logic elements (approximately 35,000 LEs per the Mouser listing description), embedded SRAM blocks, and flash-based routing fabric. The Flash*Freeze pin allows the design to enter an ultra-low-power mode in microseconds while retaining SRAM and register state, an advantage over power-gating approaches that lose context.
Typical applications include battery-powered portable instrumentation, industrial automation controllers, military and aerospace secure designs, and communications line cards where static power dominates the power budget.
A key design consideration is power-supply sequencing across the 1.2 V, 1.5 V, and 2.5 V/3.3 V I/O rails, plus careful decoupling of the many BGA power balls; the Flash*Freeze entry/exit timing must also be validated in-system.
This page synthesizes distributor pricing data, same-package drop-in ordering-code alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000L-1FGG896M — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-1FGG896M (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, Configuration Memory, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1FGG896
✅ 드롭인✓ 재고 있음
$255 / 개
데이터시트 보기 →A3PE3000L-FGG896M
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-1FGG896I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG896
✅ 드롭인✓ 재고 있음
$55 / 개
데이터시트 보기 →A3PE3000L-FG896M
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FG896
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-1FGG896M 최대 정격 & 전기적 특성
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35 KLEs (per Mouser listing) |
| Number of I/O | 620 |
| Total Memory Bits (DigiKey listing) | 516096 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm Flash |
| Configuration Technology | Flash (nonvolatile, single-chip) |
| Low Power Feature | Flash*Freeze technology |
| 패키지 | 896-ball FBGA |
| 실장 유형 | Surface Mount |
| Supply Voltage - I/O | as low as 1.2 V (per Microchip product page) |
| Speed Grade | -1 |
A3PE3000L-1FGG896M 896-ball fbga 핀 구성 가이드
A3PE3000L-1FGG896M(896-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-1FGG896M.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-1FGG896M 적합 용도: 6 애플리케이션s: Battery-Powered Portable Instrumentation, Industrial Automation Controllers, Military and Aerospace Secure Designs, Communications Line Cards, Test and Measurement Equipment, Medical Diagnostic Devices.
Battery-Powered Portable Instrumentation
The A3PE3000L-1FGG896M fits portable instruments where battery runtime is the primary constraint. Its flash configuration removes SRAM standby leakage paths, and per the Microchip datasheet the ProASIC3L family cuts dynamic power by 40% and static power by 50% versus the equivalent ProASIC3 device. In use, the FPGA implements glue logic, data acquisition sequencing, and display interfacing, with Flash*Freeze mode asserted whenever the user pauses measurements, dropping core power to microamp-class levels while retaining all register and SRAM state for instant resume. I/O rails can run as low as 1.2 V to interface with modern low-voltage sensors and ADCs. The trade-off is that the 896-ball FBGA is a large, fine-pitch package, so it suits instruments with adequate board area rather than ultra-compact wearables.
추천
Industrial Automation Controllers
In industrial PLCs and motion-control I/O modules, the A3PE3000L-1FGG896M provides deterministic programmable logic with 620 user I/Os, enough to integrate encoder interfaces, fieldbus transceivers glue, and safety interlock logic on one chip. Its single-chip flash configuration means the controller powers up functional immediately, meeting factory uptime expectations without a configuration-boot sequence. The 1.2 V to 1.5 V core operation reduces controller heat dissipation in sealed cabinets, and Flash*Freeze lets standby modules idle at low power while preserving state so production resumes instantly. Designers should validate I/O standards and voltage levels against the ProASIC3L datasheet I/O bank structure, and observe the 130 nm device's timing derating at elevated cabinet temperatures. The 896-FBGA footprint also allows a common PCB to serve multiple density points in the family.
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Military and Aerospace Secure Designs
The ProASIC3L flash fabric is a traditional choice for defense and aerospace programmable logic because nonvolatile flash configuration cells are inherently resistant to bitstream-readout attacks compared to SRAM FPGAs that load configuration from an external device at every power-up. The A3PE3000L-1FGG896M's 3M gates and 620 I/Os accommodate sensor-interface, bus-bridge, and signal-conditioning functions in avionics LRUs and secure communications hardware. Its low static power benefits conduction-cooled or battery-backed platforms, and Flash*Freeze supports duty-cycled operation in unattended sensors. Design teams should apply Microchip's programming-security features and verify the device grade (standard versus I-suffix industrial temperature) against the program's environmental specification. The mature 130 nm process also simplifies radiation and reliability assessments relative to leading-edge nodes.
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Communications Line Cards
Telecom and datacom line cards spend most of their life lightly loaded, making static power the dominant energy cost. The A3PE3000L-1FGG896M addresses this directly: per the Microchip datasheet the ProASIC3L family delivers 50% lower static power than equivalent ProASIC3 devices, and Flash*Freeze mode cuts core power further during quiet periods between traffic bursts. The device implements framers' glue logic, backplane interfacing, and counter/statistics aggregation across its 620 I/Os, with 516,096 bits of embedded memory per the DigiKey listing for FIFOs and buffers. Instant-on flash configuration shortens card bring-up during hot-swap events. Designers must budget the multiple core/I/O rails and validate signal integrity on the fine-pitch 896-ball BGA escape routing at card speeds.
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Test and Measurement Equipment
Bench and modular instruments benefit from the A3PE3000L-1FGG896M's combination of instant-on flash configuration and 620 flexible I/Os for driving multiplexers, relays, ADC front ends, and trigger buses. The 3M-gate capacity hosts channel state machines, calibration engines, and USB/LAN bridge logic in a single chip, reducing the BOM versus discrete glue. Flash*Freeze allows the instrument to keep measurement context in low-power standby between scans, extending battery life in handheld analyzers while enabling sub-microsecond resume when the user restarts acquisition. Embedded memory of 516,096 bits (per DigiKey) supports capture FIFOs. Because the 896-ball FBGA requires controlled-impedance breakout, allocate inner layers for signal escape and follow Microchip's package layout guidelines in the ProASIC3L datasheet.
추천
Medical Diagnostic Devices
Portable and benchtop medical diagnostics, such as blood analyzers and portable imaging front ends, need deterministic logic with very low standby drain between patient measurements. The A3PE3000L-1FGG896M's flash fabric draws roughly half the static power of the equivalent ProASIC3 per Microchip's datasheet, and Flash*Freeze retains acquisition state during idle intervals, so results and calibration context survive power-cycling of analog sections. Its 620 I/Os integrate sensor arrays, motor controls for fluidics, and host communication interfaces, while 1.2 V-capable I/O banks interface with modern low-voltage converters. The single-chip flash configuration also removes an external PROM that would otherwise need cleanliness and reliability qualification. Verify the device temperature grade and apply Microchip's power-sequencing guidance for multi-rail medical designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-1FGG896M — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1FGG896 | A3PE3000L-1FGG896I | A3PE3000L-FGG896M | A3PE3000L-FG896M |
|---|---|---|---|---|---|
| Package | 896-ball FBGA | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | Yes |
| Configuration Type | On-chip flash (single-chip, no boot PROM) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Flash*Freeze ultra-low-power idle mode with state retention (vs A3PE3000-FGG896I (standard ProASIC3))
- Single-chip flash configuration removes external boot device (vs SRAM-based competitor FPGAs (not drop-in))
- Lowest-speed-grade (-1) variants trade performance for the best power figure (vs A3PE3000L-FGG896M / A3PE3000L-FG896M (speed grade unspecified in code))
설계 노트
Plan the power tree early: the A3PE3000L requires 1.2 V to 1.5 V core, separate I/O bank rails down to 1.2 V, and auxiliary rails, with correct sequencing per the ProASIC3L datasheet power-up requirements. Estimated: with 40% lower dynamic and 50% lower static power than the equivalent ProASIC3 (per Microchip datasheet DS50003268), a typical mid-activity design sees substantial rail-current reduction, but verify with Libero SoC power analysis using your actual utilization and toggle rates rather than datasheet typicals. Decouple each power ball cluster with bulk plus high-frequency ceramics close to the BGA via field.
The 896-ball FBGA demands disciplined breakout. Use via-in-pad or dogbone escapes with microvias where stack-up allows, dedicate at least two inner layers to BGA fanout, and keep power/ground plane voids away from high-speed signal escapes. Follow Microchip's package and PCB layout guidelines in the ProASIC3L datasheet for ball-map-specific escape patterns. For rework, confirm your contract manufacturer can handle a 1.0 mm-pitch-class BGA of this ball count, and honor the moisture sensitivity level by baking per the MSL label before reflow.
Do not leave the Flash*Freeze pin floating - drive it from controlled logic and validate entry/exit timing in-system, since peripherals clocked from the fabric stall while frozen. Second, the M suffix in the ordering code relates to Microchip moisture/packing flow control; mixing suffixes across a build can change packing quantity and MSL handling, so qualify the exact code you will buy in volume. Third, confirm the -1 speed grade timing closure in Libero at your worst temperature corner rather than assuming family typical values.
규정 준수 정보
The G in the FGG ordering code conventionally indicates lead-free ball metallurgy per Microchip naming conventions, but explicit RoHS/REACH declarations were not present in the provided web data - obtain the compliance certificate from Microchip or your distributor.
