EP2S130F1508I4TT - 132K LE Stratix II FPGA, 1508-BGA | Intel
부품 번호: EP2S130F1508I4TT ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 100 | $2890 | $289,000.00 |
| 500 | $2750 | $1,375,000.00 |
| 1,000 | $2620 | $2,620,000.00 |
EP2S130F1508I4TT 개요
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, interconnect, and I/O can be reconfigured after manufacture, enabling hardware-level parallelism for compute-intensive tasks. Stratix II sits in the FPGA product hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets mid-to-high logic density applications that benefit from dedicated DSP blocks and embedded memory.
Key features of the EP2S130F1508I4TT include up to 1,126 general-purpose user I/Os, 6,747,840 bits of TriMatrix embedded memory (~6.4 Mbit), dedicated DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards (LVDS, LVTTL, LVPECL, SSTL, HSTL), and clock management via up to 12 PLL blocks. The -I4 speed/temperature grade specifies industrial temperature operation (-40C to +100C ambient) and a -4 core speed grade.
The Stratix II architecture uses 8-input adaptive logic modules (ALMs), each capable of implementing up to two independent combinational or registered functions. Combined with the TriMatrix memory hierarchy (three block RAM sizes per block) and dedicated 36x18 multipliers summed by hardware adders, the EP2S130 supports up to ~3.5 GMACs of DSP throughput at high core speeds, making it suitable for wireless baseband, video processing, and high-speed datapath designs.
Typical applications include wireless base station signal processing, high-end ASIC prototyping, software-defined radio (SDR) datapaths, image and video processing pipelines, and high-speed serial protocol bridging. The large logic count makes the device particularly attractive for designs that require extensive parallel datapaths or large state machines.
When designing with the EP2S130F1508I4TT, plan for multi-layer PCB stack-ups with continuous ground planes for the BGA, dedicated decoupling per power rail group, and signal-integrity-aware fanout for high-speed LVDS pairs. The 1508-ball FCBGA has fine 1.0 mm pitch; verify manufacturer land-pattern and reflow profiles against JEDEC J-STD-020.
This page synthesizes distributor pricing snapshots, drop-in package-compatible Stratix II and Stratix family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: EP2S130F1508I4TT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F1508I4TT (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Mounting Type, Operating Temperature, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F1508I4
✅ 드롭인✓ 재고 있음
$3950 / 개
데이터시트 보기 →EP2S130F1508I4N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S130F1508I4RB
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2S130F1508C5
✅ 드롭인✓ 재고 있음
$345 / 개
데이터시트 보기 →EP2S130F1508C5N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S130F1508C5RB
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP2S130F1508I4TT 최대 정격 & 전기적 특성
| Series | Stratix II |
| Logic Elements (LE) | 132,540 |
| Total RAM Bits | 6,747,840 (~6.4 Mbit) |
| User I/O Count | 1,126 |
| 패키지 | 1508-BBGA, FCBGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial, speed grade -4) |
| Process Node | 90 nm |
| DSP Blocks | Yes (dedicated 36x18 multipliers) |
| Embedded Memory Type | TriMatrix (three block sizes per memory block) |
| I/O Standard Support | LVTTL, LVCMOS, LVDS, LVPECL, SSTL, HSTL (per family datasheet) |
| Speed Grade | -4 (mid-band) |
| Temperature Grade | Industrial |
EP2S130F1508I4TT 1508-bbga, fcbga (fineline bga) 핀 구성 가이드
EP2S130F1508I4TT(1508-bbga, fcbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F1508I4TT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F1508I4TT 적합 용도: 6 애플리케이션s: Wireless Base Station Baseband Processing, High-End ASIC Prototyping, Software-Defined Radio Datapath, Image and Video Processing Pipelines, Industrial Test and Measurement Instrumentation, High-Speed Serial Protocol Bridging.
Wireless Base Station Baseband Processing
The EP2S130F1508I4TT fits wireless base-station baseband processing because its 132,540 logic elements and dedicated 36x18 DSP multipliers deliver the parallel multiply-accumulate throughput needed for LTE and WiMAX datapaths. The 6,747,840 bits of TriMatrix embedded memory buffer OFDM symbols and channel-state buffers close to the DSP fabric, reducing external SRAM latency. Placed on the baseband board between the ADC/DAC front-end and the network processor, the FPGA replaces multiple DSP chips while keeping BOM count low. A real-world trade-off is the 1508-FCBGA's fine 1.0 mm pitch, which requires 6+ layer PCB stack-ups and continuous GND/PWR planes per Stratix II pin-connection guidelines.
추천
High-End ASIC Prototyping
The EP2S130F1508I4TT serves as an ASIC prototype vehicle because its 132K logic elements can map large ASIC RTL blocks (CPUs, peripherals, interconnect) before tape-out. The dedicated TriMatrix memory hierarchy enables designers to instantiate realistic cache and FIFO behavior, while the 1,126 user I/Os permit extensive breakout to test logic analyzers and traffic generators. Quartus II TimeQuest timing closure supports the -I4 industrial speed grade for accurate worst-case timing analysis. Compared to ASIC, engineers accept lower per-unit volume and higher unit cost to validate design correctness, which the EP2S130's high LEs and I/O count make practical.
추천
Software-Defined Radio Datapath
The EP2S130F1508I4TT is well-suited to software-defined radio (SDR) datapaths because the combination of 132,540 logic elements, dedicated DSP blocks, and 6,747,840 embedded memory bits supports parallel channelization, FFT cores, and modulation/demodulation pipelines for multi-band receivers. The 1,126 user I/Os permit wide LVDS interfaces to high-speed ADC/DAC front-ends, while the PLL count supports multiple independent sample-rate domains. Placed between the RF front-end and a host processor, the FPGA delivers real-time baseband processing. Designers should budget for Quartus II compilation time, which scales non-linearly with logic utilization beyond ~70%.
추천
Image and Video Processing Pipelines
The EP2S130F1508I4TT enables real-time image and video processing because its 132,540 logic elements can sustain pixel-rate pipelines for HD-SDI, camera ISP functions, and video scaling/correction. TriMatrix memory provides line buffers and frame buffers without external SRAM, and the 1,126 user I/Os accept multiple parallel camera interfaces. Placed on a video capture or display board, the FPGA can implement histogram-based tone mapping, motion-adaptive deinterlacing, or HDR merging. The trade-off against dedicated ASSPs is design flexibility versus unit cost, justified by medical imaging, broadcast, or machine-vision applications.
추천
Industrial Test and Measurement Instrumentation
The EP2S130F1508I4TT targets industrial test and measurement because the 132,540 logic elements and 1,126 user I/Os permit high-channel-count digitizers, AWG waveform synthesis, and protocol-aware pattern generation. Industrial temperature grade (-40C to +100C ambient) ensures operation in factory-floor enclosures, and the TriMatrix memory holds deep capture buffers for transient analysis. Placed between sensor front-ends and a host PC over PCIe or GbE, the FPGA provides deterministic latency. The 1508-FCBGA package requires reflow profiles compliant with JEDEC J-STD-020 and careful CTE matching to the PCB substrate.
추천
High-Speed Serial Protocol Bridging
The EP2S130F1508I4TT is used in protocol-bridging applications (e.g., Serial RapidIO to PCIe, custom LVDS to Ethernet) because its 132K logic elements and 1,126 user I/Os accommodate multi-protocol MACs and bridge state machines. The FPGA can absorb data-rate mismatches in TriMatrix FIFOs and feed downstream processors at line rate. Placed on a line-card or backplane, the device replaces multiple bridge ASSPs. Designers should verify transceiver availability against the variant selected; some Stratix II packages include dedicated transceivers while others rely on general-purpose I/O for sub-Gbps protocols.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S130F1508I4TT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F1508I4 | EP2S130F1508I4N | EP2S130F1508I4RB | EP2S130F1508C5 | EP2S130F1508C5N | EP2S130F1508C5RB |
|---|---|---|---|---|---|---|---|
| Package | 1508-BBGA, FCBGA | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Total RAM Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| User I/Os | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 |
| Speed Grade | -4 (mid-band) | -4 | -4 | -4 | -5 | -5 | -5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0-85C) | Commercial (0-85C) | Commercial (0-85C) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
주요 차별점
- TT suffix delivers the same die in a verified tray/lead-free packaging option (vs EP2S130F1508I4)
- Industrial temperature grade (-40C to +100C) suitable for factory-floor deployment (vs EP2S130F1508C5)
- Highest-density Stratix II member with 132,540 LEs and 6.4 Mbit embedded memory (vs EP2S90F1508C5)
설계 노트
The 1508-ball FCBGA at 1.0 mm pitch requires a multi-layer PCB stack-up (8+ layers recommended) with continuous ground and power planes directly beneath the BGA. Use laser-drilled or 0.4 mm mechanically drilled micro-vias for inner-layer fanout. Match the PCB coefficient of thermal expansion (CTE) to the package per JEDEC JESD51 to avoid solder-joint fatigue over thermal cycles. Per Intel/Altera pin-connection guidelines, all VCC and GND balls must be connected, including unused balls.
Estimated: at typical Stratix II EP2S130 utilization (60-80% logic, moderate DSP), core current draw is 1-2 A from VCCINT and ~0.5-1 A from VCCIO per bank group. Designers should provision a multi-rail DC-DC converter network with bulk decoupling (220 uF polymer or electrolytic) plus 0.1 uF + 1 uF + 10 uF ceramic per power pin group. Decoupling placement within 100 mils of each ball is required for stable operation. Reference: Stratix II Hardware Design Guidelines.
LVDS and LVPECL interfaces on the EP2S130 require 100 ohm differential trace impedance controlled to within +/-10% per the Stratix II device handbook. Use matched-length routing within a pair and within a bus group to meet setup/hold on the -4 speed grade. For high-speed DDR interfaces (DDR2/DDR3 supported in some banks), follow Altera's external memory interface guidelines for read/write leveling and fly-by topology. Verify signal integrity with IBIS or Quartus II Signal Integrity Analyzer before tape-out.
Estimated: under typical industrial load, the EP2S130 dissipates 5-15 W depending on toggle rate and DSP utilization. The FCBGA package's theta_JA is approximately 10-15 C/W with proper PCB thermal design. Designers should attach a heatsink or thermal interface material (TIM) when sustained junction temperature exceeds 85C, and verify with thermal simulation (FloTHERM or equivalent) against worst-case ambient. Industrial grade silicon is rated for -40C to +100C ambient.
Do not assume all 1508-FCBGA Stratix II packages share the same ball map across speed grades - always re-verify against the device-specific pin-out file. Quartus II version compatibility matters: Stratix II support requires Quartus II 9.1 or older (legacy software). Plan toolchain availability before committing designs. Lastly, due to last-time-buy status, confirm factory inventory before placing non-cancellable orders.
규정 준수 정보
RoHS/REACH status not extracted from verified web data; refer to Intel/Altera material declaration documents for confirmation. AEC-Q100 not applicable for FPGAs (qualification is per-system, not per-component).
