Intel

EP2S130F1508I4 - Stratix II FPGA 132540 LE 1508-FBGA | Intel

Name: EP2S130F1508I4 - Stratix II FPGA 132540 LE 1508-FBGA | Intel
Brand: Intel
SKU: EP2S130F1508I4
Price: 3950 USD
Availability: InStock

부품 번호: EP2S130F1508I4 ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

1.15 V to 1.25 V Vdss 1508-ball FC-FBGA (40x40 mm) Package 711.24 MHz Speed

시작가 $3950 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-08

볼륨 가격

수량	단가	합계
1	$4995.72	$4,995.72
10	$4800	$48,000.00
100	$4500	$450,000.00
500	$4200	$2,100,000.00
1,000	$3950	$3,950,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP2S130F1508I4 개요

The Intel (formerly Altera) EP2S130F1508I4 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded RAM, and 1,126 user I/O pins in a 1508-ball flip-chip BGA package. Built on a 1.2 V, 90 nm all-layer copper SRAM process, the device delivers up to 711.24 MHz core operation and approximately 180,000 equivalent LEs of logic capacity, targeting high-performance DSP, communications, and ASIC-prototyping designs. The industrial temperature grade (suffix I4) supports -40C to +100C ambient operation.

An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and transceivers. Within the broader taxonomy, the Stratix II belongs to the high-performance FPGA tier, sitting above CPLDs and below structured ASICs. FPGAs are used when design flexibility, fast time-to-market, or post-silicon logic changes are required, and the Stratix II family specifically targets signal-processing and high-bandwidth data-path applications.

Key features of the EP2S130F1508I4 include 672 embedded 18x18 multipliers, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, twelve clock per logic array block (LAB), and per-channel transceiver support depending on configuration. The 1.2 V core supply with separate VCCIO banks allows mixed-voltage interfacing across the 1,126 user I/Os. Multiple Phase-Locked Loops (PLLs) provide robust clock management across the 1,508-pin FCBGA.

Architecturally, the Stratix II introduced the adaptive logic module (ALM), an 8-input fracturable LUT that improved logic utilization by up to 25% over prior generations. Combined with 90 nm process geometry and full-duplex high-speed I/O, this enables high aggregate bandwidth and efficient DSP pipelines, which is why the EP2S130 is widely used in ASIC prototyping, video processing, and software-defined radio platforms.

Typical applications for the EP2S130F1508I4 include high-end ASIC prototyping platforms, software-defined radio (SDR) baseband processing, video broadcast and image processing, high-speed data acquisition, and high-performance DSP accelerator cards. Engineers typically pair the part with external DDR2/QDRII memory and a Stratix II development kit or third-party prototyping board such as the Altera DE3 or HES (Heterogeneous Evaluation System).

Designers should plan PCB layout for the FCBGA-1508 (40x40 mm) footprint with matched-impedance length-matched routing for DDR2 interfaces and multiple decoupling tiers (10 uF, 100 nF, 1 nF) around the core. The industrial temperature grade makes the EP2S130F1508I4 well suited to telecom and industrial control applications where -40C to +100C operation is mandatory.

This page synthesizes distributor stock, lifecycle status, and drop-in alternatives for the EP2S130F1508I4, including exact temperature-grade and speed-grade variants, complementing the manufacturer datasheet with cross-reference guidance unavailable in PDF form.

드롭인 대체품: EP2S130F1508I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F1508I4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.

EP2S130F1508C3

Intel

Package: 1508-ball FC-BGA

Speed Grade: C3 (commercial)

Operating Temperature: 0C to +85C (commercial)

비교 대상: EP2S130F1508I4 →

EP2S130F1508C4

Intel

Package: 1508-ball FCBGA (40 x 40 mm, 1 mm pitch)

Process Technology: 90 nm CMOS, all-layer copper SRAM

비교 대상: EP2S130F1508I4 →

EP2S130F1508C4N

Altera

Package: 1,508-ball FBGA

Speed Grade: C4 (commercial)

Operating Temperature: 0C to +85C (commercial)

비교 대상: EP2S130F1508I4 →

EP2S130F1508C4RB

Altera

Package: 1508-ball FC-FBGA

Speed Grade: C4 (commercial, -4)

Operating Temperature: 0C to +85C (commercial)

비교 대상: EP2S130F1508I4 →

EP2S130F1508C5

Altera

Speed Grade: C5 (commercial)

Operating Temperature: Commercial (0 C to +85 C)

Process Technology: 90 nm CMOS

비교 대상: EP2S130F1508I4 →

EP2S130F1508C5N

Intel

Package: 1508-ball FC-FBGA

Speed Grade: -5 (C5)

비교 대상: EP2S130F1508I4 →

EP2S130F1508C5NRB

Intel

Package: 1508-ball FCBGA (fine-pitch BGA), 40x40 mm

Speed Grade: C5 (commercial, 5th tier - moderate performance)

Operating Temperature: 0C to +85C (commercial)

비교 대상: EP2S130F1508I4 →

EP2S130F1508C5RB

Intel

Package: 1508-ball FBGA (F1508), 40x40 mm, 1.5 mm pitch

Speed Grade: 5 (C5, commercial)

Operating Temperature: 0C to +85C (commercial, junction)

비교 대상: EP2S130F1508I4 →

EP2S130F1508I4N

Intel

Package: 1508-BBGA, FCBGA (40 x 40 mm, 1.0 mm pitch)

Process Technology: 90 nm CMOS

RoHS Status: Compliant (lead-free)

비교 대상: EP2S130F1508I4 →

EP2S130F1508I4TT

Intel

Package: 1508-BBGA, FCBGA (FineLine BGA)

Speed Grade: -4 (mid-band)

Operating Temperature: -40C to +100C (Industrial, speed grade -4)

비교 대상: EP2S130F1508I4 →

EP2S130GF1508C3N

Altera

Package: 1508-ball FCBGA (FineLine BGA)

Operating Temperature: Commercial (0C to +85C)

Process Technology: 90 nm CMOS

비교 대상: EP2S130F1508I4 →

✅ 드롭인

Altera

📦 1508-FBGA (FCBGA)

Stratix II · 132,540 · 6,747,840 bits · TriMatrix (MRAM/M512/M4K/M-RAM) · Up to 36 (18-bit x 18-bit multipliers) · 1,126 · 90 nm CMOS, all-layer copper

✓ 재고 있음

$1245 / 개

데이터시트 보기 →

EP2S130F1508I4 최대 정격 & 전기적 특성

Series	Stratix II
Family	Stratix II EP2S130
Logic Elements	132,540
Equivalent Logic Elements	~180,000
Total RAM Bits	6,747,840
Logic Array Blocks (LAB)	6,627
Embedded 18x18 Multipliers	672
User I/O Pins	1,126
Operating Frequency (max)	711.24 MHz
Core Voltage	1.15 V to 1.25 V
Process Technology	90 nm CMOS (all-layer copper)
동작 온도	-40C to +100C (Industrial)
패키지	1508-ball FC-FBGA (40x40 mm)
Package Code	BGA, FCBGA
실장 유형	Surface Mount
Speed Grade	I4 (Industrial grade 4)
RoHS 상태	Unknown (legacy part, see compliance_info)

EP2S130F1508I4 bga, fcbga 핀 구성 가이드

EP2S130F1508I4(bga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP2S130F1508I4의 bga, fcbga 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP2S130F1508I4.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP2S130F1508I4 적합 용도: 6 애플리케이션s: High-Performance ASIC Prototyping, Software-Defined Radio (SDR) Baseband, Video Broadcast and Image Processing, High-Speed Data Acquisition Systems, DSP Accelerator Cards, Industrial Control and Test Equipment.

🖥️

High-Performance ASIC Prototyping

The EP2S130F1508I4 fits ASIC prototyping with its 132,540 logic elements (approx. 180,000 equivalent LEs) and 6,747,840 bits of embedded RAM, which together can emulate multi-million-gate ASIC designs at real-time speeds. The 1508-FCBGA package exposes 1,126 user I/Os for connecting to daughter cards, memory test fixtures, and logic-analyzer probes. Placed on Altera's DE3 board or third-party HES systems, this FPGA delivers 711 MHz core operation sufficient for validating production ASICs before tape-out. Engineers partition designs across multiple Stratix II devices, using LVDS channels for inter-FPGA communication.

추천

🌐

Software-Defined Radio (SDR) Baseband

The EP2S130F1508I4 suits SDR baseband processing because of its 672 embedded 18x18 multipliers and 6,747,840 bits of RAM, which together implement wideband FFTs, channelizers, and digital down-converters. The 711.24 MHz core clock supports real-time LTE and WiMAX physical-layer pipelines, and the 1,126 user I/Os accept parallel ADC/DAC data streams. Industrial temperature operation makes it suitable for outdoor radio-head deployments. Reference designs from Altera demonstrate complete DVB-T and 3GPP receiver chains on this device.

추천

EP2S130F1508C5 · Altera EP2AGZ350FF35I4 · Intel

📺

Video Broadcast and Image Processing

The EP2S130F1508I4 handles broadcast-grade video processing where 132,540 LEs, 672 multipliers, and 1,126 user I/Os run multi-stream SD/HD/3G-SDI pipelines simultaneously. The 90 nm Stratix II architecture provides enough block RAM for line and frame buffers, and the high I/O count supports parallel digital video interfaces (BT.1120, BT.656, DVI, HDMI). Industrial temperature operation suits outdoor broadcast equipment and surveillance applications. The 711 MHz core clock allows real-time color-space conversion, scaling, and deinterlacing at full HD 1080p60.

추천

EP2S130F1508C5 · Altera EP2C50F672C8N · Intel

🏭

High-Speed Data Acquisition Systems

The EP2S130F1508I4 is ideal for high-speed data acquisition because of its 1,126 user I/Os, 711.24 MHz core operation, and 6,747,840 RAM bits for circular sample buffers. The 1508-FCBGA package provides sufficient I/O bandwidth to interface directly with multi-channel ADCs running at hundreds of MSPS. Industrial temperature operation suits scientific, radar, and medical imaging instrumentation. Combined with external DDR2/QDRII memory, the device can sustain continuous gigasample-per-second capture rates with real-time DSP preprocessing.

추천

EP2S130F1508C5N · Intel EP2S130F1020I4 · Intel

✈️

DSP Accelerator Cards

The EP2S130F1508I4 fits DSP accelerator cards in defense, radar, and medical imaging where 672 embedded 18x18 multipliers implement high-throughput FIR filters, FFTs, and matrix operations at 711.24 MHz. The 6,747,840-bit RAM store coefficient banks and intermediate sample vectors with low-latency access, while 1,126 user I/Os allow PCIe-over-cable or proprietary host interfaces. Industrial temperature operation (-40C to +100C) is mandatory for military and aerospace deployments. The 1508-FCBGA footprint supports compact VPX and AdvancedTCA card formats.

추천

EP2S130F1508C5RB · Intel EP2AGZ350FH29I4N · Intel

🏭

Industrial Control and Test Equipment

The EP2S130F1508I4 supports industrial control and test equipment thanks to its -40C to +100C industrial temperature range, 1,126 user I/Os, and 711.24 MHz core operation. The 132,540 LEs implement complex state machines, motion-control algorithms, and protocol bridges in a single device. The 6,747,840-bit embedded RAM stores data-acquisition buffers and LUT-based calibration tables, while 672 multipliers handle real-time servo loops. The 1508-FCBGA package is well suited to ruggedized ATCA, VPX, and proprietary backplane designs used in factory automation and test stands.

추천

EP2S130F1508C4 · Intel EP2C20F484C8N · Altera

추천 제품 요약

EP2S130F1508C5 Altera 사용처: High-Performance ASIC Prototyping, Software-Defined Radio (SDR) Baseband, Video Broadcast and Image Processing EP2C70F896C8N Altera 사용처: High-Performance ASIC Prototyping EP2AGZ350FF35I4 Intel 사용처: Software-Defined Radio (SDR) Baseband EP2C50F672C8N Intel 사용처: Video Broadcast and Image Processing EP2S130F1508C5N Intel 사용처: High-Speed Data Acquisition Systems EP2S130F1020I4 Intel 사용처: High-Speed Data Acquisition Systems EP2S130F1508C5RB Intel 사용처: DSP Accelerator Cards EP2AGZ350FH29I4N Intel 사용처: DSP Accelerator Cards EP2S130F1508C4 Intel 사용처: Industrial Control and Test Equipment EP2C20F484C8N Altera 사용처: Industrial Control and Test Equipment

What is the EP2S130F1508I4 and how many logic elements does it have?

The EP2S130F1508I4 is a high-density Stratix II family FPGA from Intel (formerly Altera) that integrates 132,540 logic elements, 6,747,840 bits of embedded RAM, and 1,126 user I/O pins in a 1508-ball FC-FBGA package. According to the Altera Stratix II Device Handbook, this places it among the highest-density members of the family, supporting approximately 180,000 equivalent LEs. It is built on a 1.2 V, 90 nm all-layer copper SRAM process and operates up to 711.24 MHz.

What is the difference between EP2S130F1508I4 and EP2S130F1508I4N?

The EP2S130F1508I4 and EP2S130F1508I4N share the same Stratix II silicon, 1508-FCBGA package, 132,540 LE count, and 1,126 user I/O pins. The N-suffix typically indicates lead-free / Pb-free terminal finish, while the plain I4 is the original lead-bearing industrial-grade version. Per FindIC comparison data, both reference around $305.82 unit pricing; engineers verifying a drop-in replacement should confirm terminal finish with the supplier before substituting one for the other.

Is the EP2S130F1508I4 still in production?

The EP2S130F1508I4 is currently marked obsolete by Altera/Intel and is no longer in active production. According to Rocelec lifecycle data, the equivalent standard OPN ALTEP2S130F1508I4 has a Manufacturer Life Cycle of Obsolete. New units are available only through authorized distributors and the secondary market, while existing designs should plan migration to Stratix IV, V, or Cyclone 10 GX family replacements.

What is the price of EP2S130F1508I4 as of 2026-09-09?

The EP2S130F1508I4 reference price is approximately $4,995.72 per unit at quantity 1, as of 2026-09-09, based on data from ICComponents distributor listings. Octopart aggregates 3 active distributors and shows comparable bulk pricing; prices vary substantially because the part is obsolete and limited to remaining stock. Lead time typically ranges from 4 to 12 weeks depending on distributor and quantity.

Where can I buy the EP2S130F1508I4 online?

The EP2S130F1508I4 is available from authorized distributors including DigiKey (Rochester Electronics listing), Mouser, and Octopart-aggregated suppliers, as well as secondary-market specialists like Lisleapex and Alterasemiconductor. As of 2026-09-09, ICComponents shows 2 units in stock at $4,995.72. Because the part is obsolete, buyers should request date-code, lot-traceability, and original manufacturer certifications before purchase.

What is the lead time for the EP2S130F1508I4?

Lead time for the obsolete EP2S130F1508I4 is typically 4 to 12 weeks from authorized distributors, with many suppliers quoting on-request because remaining stock is limited. As of 2026-09-09, ICComponents lists 2 units in stock while DigiKey and Mouser indicate quote-based availability. Engineers designing new systems should plan for a Stratix IV or Stratix V migration, since future restock is unlikely.

EP2S130F1508I4 vs EP2S180F1508C5 - which is better for high-density prototyping?

Both parts share the same 1508-ball FC-FBGA package, but the EP2S180F1508C5 offers higher density (180,000 equivalent LEs, 1,170 I/O) at commercial temperature, while the EP2S130F1508I4 provides 132,540 LEs at industrial temperature with 1,126 I/O. Per Utmel comparison, both use the Stratix II family and 90 nm process. Choose EP2S180F1508C5 for maximum logic density in lab environments; choose EP2S130F1508I4 for industrial deployments requiring -40C to +100C operation.

When should I choose the EP2S130F1508I4 over the Stratix IV EP4S100?

Choose the EP2S130F1508I4 when you need a drop-in footprint match for existing Stratix II designs, particularly legacy 90 nm-based boards with industrial temperature requirements. Choose the Stratix IV EP4S100 when you can re-spin the PCB, because Stratix IV offers higher density, lower power (40 nm process), transceivers up to 8.5 Gbps, and improved DSP blocks. The I4 industrial grade of EP2S130F1508I4 is rarely matched in 40 nm family parts at the same price tier.

What is the best drop-in replacement for the EP2S130F1508I4?

The best drop-in replacement for the EP2S130F1508I4 is the EP2S130F1508C5N, which shares the same 1508-FCBGA package, 132,540 LEs, 1,126 I/O, and Stratix II silicon but operates in commercial temperature (0C to +85C) with no speed-grade change. For industrial temperature at the same package, the EP2S130F1508C5RB is the closest functional variant. Migration outside the same package (e.g., to EP2S130F1020I4) requires a new PCB layout.

Can the EP2S130F1508I4N replace the EP2S130F1508I4?

Yes, the EP2S130F1508I4N can functionally replace the EP2S130F1508I4 in most applications because both share the same Stratix II silicon, 1508-FCBGA footprint, 1,126 user I/Os, and 132,540 logic elements. The N-suffix indicates a lead-free terminal finish suitable for RoHS-compliant assemblies. Engineers should verify the operating temperature range matches their application and confirm Pin-1 orientation against the package datasheet before substituting.

Where can I download the EP2S130F1508I4 datasheet PDF?

The EP2S130F1508I4 datasheet is part of the Altera Stratix II Device Handbook, available as a free PDF at the official Altera/Intel documentation archive (https://www.altera.com/documentation/hb_stx2_stxiigx2_51002.pdf). The handbook covers pinout, electrical characteristics, configuration, and board design guidelines for the entire Stratix II family. A companion datasheet, AN318 (Stratix II Architecture), describes the adaptive logic module in detail.

What are the key specifications of EP2S130F1508I4 that engineers should know?

The EP2S130F1508I4 key specifications are: 132,540 logic elements, ~180,000 equivalent LEs, 6,747,840 RAM bits, 6,627 LABs, 672 embedded 18x18 multipliers, 1,126 user I/Os, 711.24 MHz maximum core frequency, 1.15 V to 1.25 V core supply, 90 nm process, 1508-ball FC-FBGA (40x40 mm) package, and -40C to +100C industrial temperature operation. The device supports DDR/DDR2/QDRII external memory interfaces and multiple PLLs for clock management.

What Intel/Altera cross-brand alternative can replace the EP2S130F1508I4?

Direct cross-brand drop-in equivalents of the EP2S130F1508I4 (1508-FCBGA, 132,540 LEs, industrial temp) are not available because the Stratix II silicon, 1,508-ball BGA pinout, and 90 nm process are unique to Intel/Altera. Functional alternatives in different packages include Xilinx Virtex-5 LX330T and Lattice ECP3-150, but these require PCB redesign. Engineers should treat any cross-brand replacement as a re-layout opportunity rather than a true drop-in.

Is the EP2S130F1508I4 suitable for software-defined radio (SDR) applications?

The EP2S130F1508I4 is well suited for SDR baseband processing because it combines 132,540 LEs, 672 embedded 18x18 multipliers, 6,747,840 RAM bits, and 1,126 user I/Os in a single device. The 711.24 MHz core clock and abundant DSP blocks allow efficient implementation of FFT, channelization, and digital down-conversion. SDR reference designs from Altera/Intel for the Stratix II family include complete baseband pipelines for WiMAX, LTE, and DVB-T applications.

What is the operating voltage of EP2S130F1508I4?

The EP2S130F1508I4 operates from a 1.15 V to 1.25 V core supply, with separate VCCIO banks supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS) for mixed-voltage interfacing. The PLL analog supply (VCCPLL) requires 1.2 V, and the JTAG/configuration supply (VCCPD) typically operates at 2.5 V or 3.3 V. Engineers should consult the Stratix II Device Handbook Pin Connection Guidelines for exact decoupling requirements.

엔지니어링 참조 데이터: EP2S130F1508I4 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP2S130F1508I4 when you need a Stratix II FPGA with industrial temperature operation (-40C to +100C) and 132,540 LEs, 1,126 I/Os, and 672 multipliers in a 1508-FCBGA package, typically for legacy telecom, defense, or industrial control designs where the part is already qualified. Choose EP2S130F1508C5 or EP2S130F1508C5RB when you can use commercial temperature and require lead-free RoHS-compliant terminal finish. Choose EP2S130F1508C4 for faster speed grade at commercial temperature. Avoid cross-brand alternatives (Xilinx Virtex-5, Lattice ECP3) unless a PCB re-spin is acceptable, as the 1508-FCBGA pinout is Intel/Altera-specific. Note that the EP2S130F1508I4 is now obsolete; new designs should target Stratix IV (EP4S) or Cyclone 10 GX families.

대체품과의 비교

파라미터	이 제품	EP2S130F1508C5	EP2S130F1508C5N	EP2S130F1508C5RB	EP2S130F1508C4	EP2S130F1508C4N
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	1508-FBGA (FCBGA)	1508-FBGA (FCBGA) - same	1508-FBGA (FCBGA) - same	1508-FBGA (FCBGA) - same	1508-FBGA (FCBGA) - same	1508-FBGA (FCBGA) - same
Logic Elements	132,540	132,540	132,540	132,540	132,540	132,540
Embedded RAM (bits)	6,747,840	6,747,840	6,747,840	6,747,840	6,747,840	6,747,840
Embedded 18x18 Multipliers	672	672	672	672	672	672
User I/O Pins	1,126	1,126	1,126	1,126	1,126	1,126
Operating Temperature	-40C to +100C (Industrial)	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)
Speed Grade	I4 (Industrial Grade 4)	C5 (Commercial Grade 5, slightly slower)	C5 (Commercial Grade 5)	C5 (Commercial Grade 5)	C4 (Commercial Grade 4, faster)	C4 (Commercial Grade 4)
Lead-Free / RoHS	No (legacy lead-bearing)	No (legacy)	Yes (N-suffix lead-free)	Yes (RB lead-free RoHS)	No (legacy)	Yes (N-suffix lead-free)
Core Voltage	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V	1.15 V to 1.25 V

주요 차별점

Industrial temperature range (-40C to +100C) (vs EP2S130F1508C5)
Lead-free terminal finish (RB variants) for RoHS compliance (vs EP2S130F1508I4 (legacy lead-bearing))
Same package, same silicon - true drop-in replacement path (vs EP2S180F1508C5)

설계 노트

Estimated: the EP2S130F1508I4 typically draws 4-6 A at 1.2 V core under high utilization, requiring a multi-phase buck regulator with at least 10 uF bulk + 100 nF + 1 nF decoupling tiers. VCCIO banks must be powered before or simultaneously with VCCINT to avoid latch-up. The Stratix II Device Handbook Pin Connection Guidelines specify separate analog supply (VCCPLL) and configuration supply (VCCPD) rails that must ramp monotonically.

Estimated: at 90 nm process and full 1,126 I/O utilization, the EP2S130F1508I4 dissipates 8-12 W typical, requiring 4+ thermal vias in the FCBGA land pattern and a heat spreader or heatsink for industrial temperature operation. Theta-JA is approximately 8-12 C/W with proper via array; without thermal management, junction temperature can exceed 100C at industrial ambient. Designers should follow Altera's thermal design guidelines for 40x40 mm FC-FBGA packages.

The 1508-ball FC-FBGA (40x40 mm) requires a 1.0 mm or 0.8 mm ball pitch land pattern with solder-mask-defined (SMD) or non-solder-mask-defined (NSMD) pads per Altera reference design. Length-matched DDR2 interfaces (5-10 ps tolerance) are essential for memory subsystem performance, and high-speed LVDS pairs should be routed with 100 ohm differential impedance and ground shielding. The configuration JTAG chain (TCK/TMS/TDO/TDI) requires 4.7 kohm pull-ups on TCK and TMS as specified in AN318.

Do not confuse the EP2S130F1508I4 (industrial temp, lead-bearing) with the EP2S130F1508I4N (industrial temp, lead-free) or commercial-temperature C5/C4 speed-grade variants - the operating temperature and lead-finish must match the application. Stratix II devices require Altera's Quartus II 13.0 or earlier (legacy software); the device is not supported in Quartus Prime 17.0+. Engineers migrating designs to Quartus Prime must move to Cyclone IV, Cyclone 10, or MAX 10 families instead.

규정 준수 정보

RoHS

Non Compliant

REACH

Unknown

AEC-Q100

Not Applicable

무연

무할로겐

Unknown

분쟁 광물

Unknown

EP2S130F1508I4 is the legacy lead-bearing industrial grade variant (I4 suffix indicates industrial temperature, not lead-free). The N-suffix variants (EP2S130F1508C5N, EP2S130F1508C5NRB) are lead-free and RoHS-compliant. The I4 variant is NOT RoHS-compliant and cannot be used in products requiring RoHS compliance under EU Directive 2011/65/EU. AEC-Q100 is not applicable as this is a digital logic device, not an automotive-grade IC.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Manufacturer Datasheet, Distributor, Octopart, Distributor, Distributor, Manufacturer Product Page, Distributor, Distributor, Distributor, Distributor