EP2S130F780C4N - Stratix II FPGA, 132K LE, 780-FBGA | Intel
부품 번호: EP2S130F780C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1480 | $1,480.00 |
| 10 | $1395 | $13,950.00 |
| 100 | $1295 | $129,500.00 |
| 500 | $1195 | $597,500.00 |
| 1,000 | $1095 | $1,095,000.00 |
EP2S130F780C4N 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the wider semiconductor hierarchy of programmable logic -> logic IC -> integrated circuit. FPGAs sit between fixed-function ASICs and software-driven processors: they implement arbitrary digital logic in configurable look-up tables (LUTs), programmable interconnect, and dedicated hard IP such as block RAM, PLLs, transceivers, and DSP blocks, allowing rapid design iteration without the mask costs of an ASIC.
Key features of the EP2S130F780C4N include up to 717 MHz internal clock frequency, embedded TriMatrix memory supporting dual-port and FIFO modes, up to 12 dedicated PLL blocks for clock synthesis and management, and support for external memory interfaces such as DDR, DDR2, QDR, and RLDRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O buffers with on-chip termination.
Architecturally, the Stratix II family introduced an innovative adaptive logic module (ALM) topology that gives roughly 40% higher performance per area than the prior Stratix architecture, and the EP2S130F780C4N integrates up to 16 global clock networks plus regional clock trees. The 780-pin FC-FBGA package uses a 1 mm pitch on a 29x29 mm substrate, enabling dense PCB routing while supporting industrial temperature grades through ordering options.
Typical applications include high-speed digital signal processing in radar and software-defined radio, ASIC prototyping, video processing and broadcast equipment, telecom line cards, industrial control and machine vision, and PCIe-based accelerator cards. The wide DSP block count and ample on-chip memory allow designers to push large FFT/fir pipelines at hundreds of MSPS without external memory round-trips.
When designing with this device, careful attention must be paid to power integrity because Stratix II devices can exceed 25 W dynamic power under heavy utilization. Designers must follow Intel/Altera's power-supply decoupling guidance with bulk, mid-frequency, and high-frequency capacitors placed close to the dedicated VCCINT, VCCIO, and GND balls, and a multi-layer PCB stackup with dedicated power/ground planes is required for signal integrity at LVDS and DDR2 rates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond what is found in the manufacturer datasheet, providing engineers with a single reference for sourcing, replacement planning, and PCB-level design considerations.
드롭인 대체품: EP2S130F780C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F780C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Total RAM Bits, Speed Grade, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F780C5N
✅ 드롭인✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP2S130F780C4
✅ 드롭인✓ 재고 있음
$6500 / 개
데이터시트 보기 →EP2S130F780C3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2S130F780C5
✅ 드롭인✓ 재고 있음
$2295 / 개
데이터시트 보기 →EP2S130F780I4N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP2S130F780C3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2S130F780C4N 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Maximum User I/Os | 534 |
| Embedded DSP Blocks | Up to 384 (18x18 multipliers) |
| PLLs | Up to 12 |
| Internal Clock Frequency (max) | 717 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Commercial (C4 suffix) |
| 패키지 | 780-ball FC-FBGA (F780), 1 mm pitch, 29x29 mm |
| Lead-Free | Yes (Pb-free) |
| RoHS 상태 | Compliant |
| Speed Grade | C4 |
| Product Status | Not Recommended for New Designs (NRND) |
EP2S130F780C4N 780-ball fc-fbga (f780), 1 mm pitch, 29x29 mm 핀 구성 가이드
EP2S130F780C4N(780-ball fc-fbga (f780), 1 mm pitch, 29x29 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F780C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F780C4N 적합 용도: 7 애플리케이션s: High-Speed Digital Signal Processing, ASIC Prototyping and Emulation, Telecom Line Cards and Baseband Processing, Video Processing and Broadcast Equipment, Industrial Machine Vision and Inspection, PCIe-Based Accelerator Cards, Radar Signal Processing.
High-Speed Digital Signal Processing
The EP2S130F780C4N's 384 embedded 18x18 multipliers and approximately 6 Mbit of on-chip TriMatrix memory make it well suited for high-speed DSP workloads such as FFT and FIR pipelines in radar and software-defined radio. The 717 MHz internal clock supports hundreds of MSPS throughput, and the high logic density allows parallel implementation of multiple DSP channels on a single device, eliminating the need for external DSP clusters. Pair with companion parts such as the AD9230 ADC and AD9777 DAC for complete receive/transmit chains.
추천
ASIC Prototyping and Emulation
With 132,540 logic elements and abundant DSP and memory resources, the EP2S130F780C4N is widely used for ASIC prototyping and full-system emulation. The Quartus II software supports rapid design iteration, and the device can host multi-million-gate ASIC RTL after synthesis to LUT mapping. The 780-ball FC-FBGA exposes enough I/O to bring out ASIC pads for in-circuit verification at near-real-time system speeds, while the dedicated PLLs simplify clock-domain mapping.
추천
Telecom Line Cards and Baseband Processing
The EP2S130F780C4N's on-chip termination, DDR/DDR2 controller hard IP, and SerDes-supporting I/O make it a fit for telecom line cards implementing packet processing, encryption, and baseband functions. Its 534 user I/Os allow multiple SFP/SFP+ interfaces and backplane connections without external bus switches, while the 12 PLLs simplify multiple clock-domain generation for SONET/SDH or Ethernet line-rate conversion. Use it to bridge between the network PHY layer and an embedded processor.
추천
Video Processing and Broadcast Equipment
The EP2S130F780C4N supports LVDS and HSTL I/O standards at rates that enable multi-channel SDI and HD-SDI video pipeline implementation directly in the FPGA fabric. The 384 DSP blocks allow real-time motion-adaptive deinterlacing, scaling, and color-space conversion without external DSP chips. The 6 Mbit block RAM acts as line/frame buffers, and the 132,540 logic elements accommodate full HD pipelines plus overlay and graphics blending layers in broadcast equipment.
추천
Industrial Machine Vision and Inspection
For machine vision systems, the EP2S130F780C4N's high logic density and DSP count enable multi-camera image processing pipelines at line-scan rates exceeding 50 kHz. The on-chip PLL and DDR2 controller simplify interfacing with industrial Camera Link or CoaXPress imagers, while the industrial temperature variants of this part support factory-floor operation from -40C to +85C. The 534 user I/Os allow direct connection to multiple parallel image sensors without external logic.
추천
PCIe-Based Accelerator Cards
Stratix II FPGAs including the EP2S130F780C4N can be paired with external PCIe PHY hard IP to build accelerator cards for compute offload, protocol bridging, or high-speed data acquisition. The 132K logic elements accommodate PCIe endpoint logic plus a large on-card compute fabric, while the dedicated PLL supports the 100 MHz PCIe reference clock and multiple derived clock domains. The 780-ball FC-FBGA is a manageable footprint for card-PCIe card layouts with adjacent DDR2 SODIMM or DIMM slots.
추천
Radar Signal Processing
Radar front-end processing benefits from the EP2S130F780C4N's 384 embedded 18x18 multipliers, which support coherent pulse compression, MTI filtering, and FFT-based Doppler processing at high pulse repetition rates. The 717 MHz clock drives real-time pipelined radar datapaths, while the 6 Mbit block RAM serves as a data-acquisition buffer between the ADC and the processor back-end. The 534 I/Os handle multiple channel ADC inputs plus Ethernet/SPI backhaul to the radar processor.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S130F780C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F780C5N | EP2S130F780C4 | EP2S130F780C3N | EP2S130F780C5 | EP2S130F780I4N | EP2S130F780C3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (F780), 1 mm pitch | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | C4 | C5 (1 grade faster) | C4 (same) | C3 (1 grade slower) | C5 (1 grade faster) | I4 (industrial grade) | C3 (1 grade slower) |
| User I/Os | 534 | 534 | 534 | 534 | 534 | 534 | 534 |
| Embedded Multipliers | Up to 384 (18x18) | Up to 384 | Up to 384 | Up to 384 | Up to 384 | Up to 384 | Up to 384 |
| Temperature Grade | Commercial (C suffix) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +85C) | Commercial |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| RoHS / Pb-Free (N suffix) | Yes (Pb-free) | Yes (Pb-free) | No (SnPb finish) | Yes (Pb-free) | No (SnPb finish) | Yes (Pb-free) | No (SnPb finish) |
주요 차별점
- C4 speed grade offers balanced performance and yield (vs EP2S130F780C5N)
- Lead-free (N suffix) for RoHS-compliant assemblies (vs EP2S130F780C4 (non-N))
- Commercial temperature grade sufficient for most applications (vs EP2S130F780I4N)
설계 노트
Estimated: Stratix II devices under heavy utilization can exceed 25 W dynamic power. At full 132K-LE utilization with high toggle rates on the 717 MHz clock tree, designers must provision a 1.2 V regulator delivering at least 30 A on VCCINT and a separate VCCIO regulator per bank voltage. Add bulk decoupling of 220 uF tantalum or ceramic per supply pin group, with 0.1 uF and 1 nF ceramics within 200 mil of each VCCINT ball to suppress high-frequency transients.
Estimated: at 25 W dissipation with the 780-ball FC-FBGA package theta_JA of approximately 14 C/W on a JEDEC 4-layer test board, junction temperature can rise 350 C above ambient. For commercial-grade EP2S130F780C4N parts, this far exceeds the 100C junction limit. Use a 4- to 6-layer PCB with continuous power/ground planes, place thermal vias beneath the BGA thermal pad array, and consider attaching a heat spreader or heatsink with thermal interface material.
The 780-ball FC-FBGA uses 1 mm ball pitch, requiring a PCB stackup with controlled-impedance layers for 50 ohm SE / 100 ohm diff routing. Use Intel's Stratix II Device Handbook ball-map documentation (Pin Planner export) to confirm escape routing before placing components. Keep all 1.2 V and 1.5 V/1.8 V/2.5 V/3.3 V rails on separate planes, and bring out JTAG (TCK, TMS, TDI, TDO) to a debug header for SignalTap II in-system logic analyzer operation.
When routing DDR/DDR2 interfaces from the EP2S130F780C4N, follow length matching rules with +/-50 mil tolerance on the byte lanes and use series-dampening resistors if the controller cannot drive fly-by DIMM topology. Enable OCT (on-chip termination) in the Quartus II pin planner to reduce external resistor count - this is supported on dedicated SSTL/HSTL I/O banks. For LVDS signaling, maintain 100 ohm differential impedance and keep trace length mismatches below 10 mil to avoid duty-cycle distortion.
Estimated: a common pitfall is using Quartus Prime (newer than 13.0) which has dropped Stratix II support - legacy Quartus II versions 7.2 through 13.0 are required. Another common error is mismatched VCCIO bank voltages for mixed-standard interfaces (e.g., 2.5 V VCCIO for SSTL-2 and 3.3 V VCCIO for LVCMOS); each I/O bank must be powered from a single rail. Finally, ensure JTAG chain configuration - the MSEL pins select configuration mode (AS, PS, JTAG) and incorrect settings will prevent bitstream loading.
규정 준수 정보
RoHS-compliant per Pb-free ball finish on the N-suffix variant. AEC-Q100 not applicable for FPGAs (this qualification is for automotive-grade discrete and analog ICs). Halogen-free and conflict-minerals status not stated in verified web data.
