EP2S130F780I4N - 132K LEs Stratix II FPGA, 780-FBGA | Intel
부품 번호: EP2S130F780I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $325 | $325.00 |
| 10 | $298.5 | $2,985.00 |
| 100 | $265 | $26,500.00 |
| 500 | $235 | $117,500.00 |
| 1,000 | $210 | $210,000.00 |
EP2S130F780I4N 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (LABs), routing channels, and hard IP blocks (memory, multipliers, transceivers, PLLs) that engineers program via HDL to implement arbitrary digital logic, DSP pipelines, or bus interfaces. FPGAs sit below ASICs in NRE cost but above MCUs in raw parallel throughput, making them ideal for prototyping and low-to-medium volume production. The Stratix II family pioneered the adaptive logic module (ALM) architecture, doubling logic efficiency versus the original Stratix and enabling densities approaching 180,000 equivalent LEs.
Key features include 6,627 LABs, 534 maximum user I/Os, embedded TriMatrix memory blocks totaling 6,748,160 bits, dedicated 18x18 multipliers for DSP, and up to 12 global clock networks with 16 PLLs per device. The 90 nm CMOS process and 1.2 V core VCC keep dynamic power competitive with previous generations, while the adaptive logic module (ALM) provides finer-grained packing than competing architectures. The FC-FBGA-780 package uses a 29x29 mm body with 1.0 mm ball pitch, supporting dense board layouts.
Typical applications include high-speed DSP for radar and medical imaging, multi-gigabit serial-interface bridging, ASIC prototyping, telecom baseband processing, and high-performance data-acquisition back-ends. Industrial temperature grade (-40C to +100C case) supports factory and outdoor equipment. When designing, ensure multi-rail decoupling (1.2 V VCCINT, 2.5 V/3.3 V VCCIO, VCCPD, VCCA_PLL) follows the Stratix II pin connection guidelines; do not reuse older Stratix I power designs.
This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, drop-in alternatives within the same 780-FBGA footprint, and practical design notes not found in the manufacturer datasheet itself.
드롭인 대체품: EP2S130F780I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F780I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Speed Grade, Total RAM Bits, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F780C4N
✅ 드롭인✓ 재고 있음
$1095 / 개
데이터시트 보기 →EP2S130F780C5
✅ 드롭인✓ 재고 있음
$2295 / 개
데이터시트 보기 →EP2S130F780C5N
✅ 드롭인✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP2S130F780C4
✅ 드롭인✓ 재고 있음
$6500 / 개
데이터시트 보기 →EP2S130F780I4
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2S130F780I4N 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 132,540 |
| Equivalent LEs (max) | Approx. 132,540 (density class up to 180k) |
| LABs/CLBs | 6,627 |
| Embedded Memory (bits) | 6,748,160 |
| Total RAM Bits | 6,748,160 |
| Maximum User I/Os | 534 |
| Number of PLLs | 16 |
| Process Technology | 90 nm CMOS (1.2 V, all-layer copper) |
| Core Voltage VCCINT | 1.2 V |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-rail) |
| Maximum Internal Frequency | 711.24 MHz |
| 패키지 | 780-ball FC-FBGA (FineLine BGA), 29x29 mm, 1.0 mm pitch |
| Operating Temperature (Case) | -40C to +100C (Industrial, I4 suffix) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (lead-free) |
EP2S130F780I4N -40c to +100c (industrial, i4 suffix) 핀 구성 가이드
EP2S130F780I4N(-40c to +100c (industrial, i4 suffix) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F780I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F780I4N 적합 용도: 6 애플리케이션s: High-Performance DSP Signal Processing, Telecom Baseband Processing, ASIC Prototyping, Medical Imaging Back-End, High-Speed Data Acquisition, Aerospace and Defense Signal Processing.
High-Performance DSP Signal Processing
The EP2S130F780I4N's 132,540 logic elements and dedicated 18x18 hardware multipliers make it ideal for high-throughput DSP pipelines such as radar FFT, channelization, and baseband demodulation. The 6,748,160 bits of embedded TriMatrix memory enable wide working-set access without external SRAM bottlenecks, sustaining 711 MHz operation for FIR filters and matrix math. Industrial temperature grade supports outdoor and factory deployments. Compared to a Cyclone IV EP4CE115, the Stratix II provides ~16% more LEs and 70% more on-chip memory, allowing a single EP2S130 to replace multi-FPGA partitions in legacy DSP back-ends. The 780-ball FC-FBGA exposes enough I/O for parallel LVDS ADC/DAC interfaces.
추천
Telecom Baseband Processing
The EP2S130F780I4N was designed for telecom baseband and protocol stack offload, with 16 PLLs providing abundant clock domains for UMTS, LTE early chipsets, and WiMAX PHY. The 534 user I/Os and multi-rail VCCIO support mixed 1.8 V/2.5 V/3.3 V interfacing to analog front-ends and SERDES companion chips. 6.7 Mbits of embedded memory absorb packet buffer bursts at line rate, reducing external SRAM access latency. For modern LTE/5G designs, migrate to a Stratix V or Cyclone 10 GX; the EP2S130 remains relevant only for legacy base-station or repeater systems requiring identical pinout for board refresh.
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ASIC Prototyping
The EP2S130F780I4N is a workhorse for ASIC prototyping because the 132k LEs can map large RTL blocks and the 780-ball FC-FBGA exposes 534 I/Os for connecting to prototype target boards. Up to 711 MHz internal operation allows early performance validation, while 16 PLLs simplify multi-clock domain ASIC replication. Multi-FPGA partitioning software (Synopsys Certify, Mentor Certify) supports the Stratix II device family. For modern ASIC prototyping, the Stratix 10 GX 10M or VU440 are preferred, but the EP2S130 remains in service for legacy 1-2M gate ASIC validation and academic teaching labs.
추천
Medical Imaging Back-End
In ultrasound and CT imaging, the EP2S130F780I4N's high LE count and embedded memory enable beamforming and image reconstruction pipelines. The 534 I/Os interface to multi-channel ADC arrays (8-16 channels), and 6.7 Mbits of on-chip memory buffer scan-line data before DMA to host. Industrial temperature grade (-40C-100C) supports portable cart-based ultrasound systems. Compared to MCUs, the parallel datapath sustains real-time pixel-rate processing; compared to GPUs, the FPGA offers deterministic latency for safety-critical medical applications. Legacy medical OEMs continue specifying EP2S130 for board refresh in regulated designs.
추천
High-Speed Data Acquisition
Data-acquisition systems for oscilloscopes, spectrum analyzers, and PCIe digitizers use the EP2S130F780I4N to perform real-time triggering, decimation, and FFT pre-processing. The 16 PLLs synchronize to external sample clocks up to 1 GHz, and the 6.7 Mbits of memory hold time-domain windows before PCIe transfer. Industrial temperature grade enables factory-floor test equipment. The 780-ball FC-FBGA exposes enough LVDS pairs for 16-channel 250 MSPS ADCs, and the 132k LEs absorb the trigger logic without external state machines. For new designs, consider Cyclone V GT or Stratix 10 with integrated transceivers.
추천
Aerospace and Defense Signal Processing
Long-life-cycle defense programs continue specifying the EP2S130F780I4N for radar, electronic warfare, and secure-communications back-ends due to the extensive qualification history and available long-term inventory. Industrial temperature grade meets ground-mobile and shelterized equipment requirements. The 534 I/Os interface to legacy MIL-STD-1553, ARINC 429, and custom parallel backplanes, while the 132k LEs absorb beam-steering and FFT workloads. Aerospace OEMs leverage the Stratix II's mature Quartus II toolchain and validated IP cores; migration to newer Stratix V is gated by re-qualification costs, so the EP2S130 remains in active service.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S130F780I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F780C4N | EP2S130F780C5 | EP2S130F780C5N | EP2S130F780C4 | EP2S130F780I4 |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 132,540 | 132,540 (same die) | 132,540 (same die) | 132,540 (same die) | 132,540 (same die) | 132,540 (same die) |
| Temperature Grade | Industrial (-40C to +100C case) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | -4 | -4 (same) | -5 (faster) | -5 (faster) | -4 (same) | -4 (same) |
| Lead-Free / RoHS | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | No (SnPb) | No (SnPb) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Embedded Memory (bits) | 6,748,160 | 6,748,160 (same die) | 6,748,160 (same die) | 6,748,160 (same die) | 6,748,160 (same die) | 6,748,160 (same die) |
주요 차별점
- Same-die industrial-temperature drop-in availability (vs EP2S130F780C4N)
- Lead-free / RoHS compliant (vs EP2S130F780C4 (SnPb))
- 132k LEs in single FPGA vs multi-FPGA partition (vs EP2C70F672C8N (Cyclone II 70k LEs))
설계 노트
The EP2S130F780I4N requires four separate power rails: VCCINT (1.2 V core, highest current ~3-5 A depending on utilization), VCCIO (1.2-3.3 V, per bank), VCCPD (pre-driver, typically 2.5 V or 3.3 V), and VCCA_PLL (1.2 V analog, low noise). Estimated total worst-case power at full utilization is approximately 15-25 W; a multi-phase buck regulator with separate LC filters for each rail is recommended. Decoupling: place 0.1 uF X7R and 10 uF bulk capacitors within 100 mils of each power pin pair. Failure to provide proper decoupling is the most common cause of Stratix II board bring-up failures.
Estimated: the FC-FBGA-780 package has a typical theta_JC of 0.2 C/W and theta_JA of approximately 8-12 C/W with a 12-layer PCB and adequate thermal vias. At 20 W dissipation, junction temperature rises 160-240 C above ambient without airflow. A heatsink or 200+ LFM airflow is required for industrial temperature compliance. The FC-FBGA exposes the die directly via the substrate; thermal vias under the package (24+ vias, 0.3 mm drill, 1.0 mm pitch) provide the primary heat path.
The 780-ball FC-FBGA uses 1.0 mm ball pitch on a 29x29 mm body, requiring 0.4 mm via capture pads and 0.15 mm trace/space for fanout escape. Use a minimum 6-layer stackup with 2 dedicated ground planes adjacent to the BGA for return path integrity. All 4 GND balls adjacent to each power pin must connect to a low-impedance ground plane. JTAG chain (TCK/TMS/TDO/TDI) requires 4.7k pull-ups on TCK and TMS per the Stratix II handbook configuration chapter.
Do not reuse Stratix I (EP1Sxx) pin connections - the Stratix II power pin assignment is different even when migrating within the same package. Do not leave MSEL pins floating; tie them per the configuration mode (AS, PS, JTAG, or Fast Passive Parallel). Do not connect VCCIO to 2.5 V without verifying the bank's I/O standard compatibility. The configuration flash interface (for AS mode) requires a specific Altera EPCS device; do not substitute third-party SPI flashes without verifying ASMI compatibility.
규정 준수 정보
RoHS compliant per N suffix designation. Not AEC-Q100 qualified (industrial temp, not automotive Grade 1). Halogen-free status and conflict-mineral compliance not explicitly listed on distributor pages; set to unknown.
