EP2S15F484C5 - Stratix II FPGA, 15.6K LE, 342 I/O, 484-FBGA | Intel
부품 번호: EP2S15F484C5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205 | $102,500.00 |
| 1,000 | $185 | $185,000.00 |
EP2S15F484C5 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs/ALMs), programmable routing channels, and dedicated hardware such as DSP blocks, block RAM (BRAM), and high-speed transceivers. FPGAs occupy a unique tier in the digital semiconductor hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in per-unit cost. They are re-programmed via configuration bitstreams, allowing engineers to implement custom parallel pipelines, soft processors, and interface bridges without the NRE cost of ASIC fabrication.
Key features of the EP2S15F484C5 include Stratix II architecture with ALM-based logic, on-chip TriMatrix memory, embedded DSP blocks for high-speed multiply-accumulate operations, and support for external memory interfaces including DDR/DDR2 SDRAM, QDR II SRAM, and RLDRAM. The device targets design entries requiring up to 342 signal-breakout pins and operates across an industrial-grade temperature range. Built on a 90 nm process, the Stratix II family introduced ALM-based logic that improves packing efficiency over the prior 4-input LUT approach used in Stratix I.
Typical applications include high-speed DSP pipelines (radar, baseband, video processing), telecom line-card datapaths, network protocol bridges, and parallel ASIC prototyping. Stratix II devices ship with Quartus II design software support. When designing with this part, ensure 1.2 V core decoupling is robust (low-ESL ceramic, multiple bulk capacitors), implement multi-voltage sequencing for 1.2 V core / 2.5 V / 3.3 V aux rails, and respect the I/O-bank VCCIO grouping rules per the FBGA pinout map.
드롭인 대체품: EP2S15F484C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S15F484C5 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, Package, Package / Case, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S15F484C4N
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP2S15F484C4
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →EP2S15F484C3N
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →EP2S15F484C3
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP2S130F1020C3
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2S15F484C5 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements (LE) | 15,600 |
| Adaptive Logic Modules (ALMs) | 6240 |
| LABs / CLBs | 780 |
| Embedded Memory | 409 Kbit (TriMatrix) |
| User I/O Count | 342 |
| Number of Logic Cells | 15600 |
| Supply Voltage (Core) | 1.2 V |
| Maximum Operating Frequency | 609.76 MHz |
| 패키지 | 484-ball FBGA (FC-FBGA) |
| 실장 유형 | Surface Mount |
| Process Node | 90 nm |
| Operating Temperature Grade | Commercial (per DigiKey listing) |
| RoHS 상태 | Non-Compliant (Contains Lead) |
| Configuration Method | SRAM-based (volatile, external config device) |
EP2S15F484C5 484-ball fbga (fc-fbga) 핀 구성 가이드
EP2S15F484C5(484-ball fbga (fc-fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S15F484C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S15F484C5 적합 용도: 6 애플리케이션s: High-Speed DSP Pipeline, Telecom Line-Card Datapath, ASIC Prototyping Platform, Video Broadcast Processing, Industrial Motor Control FPGA, Network Protocol Bridge.
High-Speed DSP Pipeline
The EP2S15F484C5's 15,600 LE, 6240 ALMs, and embedded DSP blocks make it well-suited for high-throughput DSP pipelines in radar, baseband signal processing, and video codec implementations. The 609 MHz internal clock and abundant arithmetic-capable ALMs allow parallel multiply-accumulate chains for FFT, FIR, and matrix operations without off-chip DSP chips. Place DSP-intensive paths in dedicated DSP blocks where available; route control and sequencing logic through the ALM fabric. Compared to a discrete DSP + FPGA partition, the integrated approach reduces board area and inter-chip latency by 20-40%, but requires careful floorplanning to meet timing closure on multi-gigahertz datapaths.
추천
Telecom Line-Card Datapath
Telecom line cards require multi-gigabit packet processing, QoS queueing, and fabric-interface bridging - exactly the workload the EP2S15F484C5 handles with its 342 I/O and external memory interface (DDR/DDR2/QDR II/RLDRAM) support. The 484-FBGA's high pin count enables breakout to multi-channel SERDES, SPI/parallel flash for configuration, and parallel dataplane buses. Design consideration: dedicate I/O banks to specific VCCIO levels (3.3 V for legacy bus, 1.8 V for DDR2) and respect bank-to-bank adjacency rules per the Stratix II pinout file. Compared to ASIC line cards, this FPGA reduces NRE cost and enables late-stage feature updates.
추천
ASIC Prototyping Platform
The EP2S15F484C5's high logic density and rich I/O make it a useful ASIC prototyping vehicle for designs in the 1-5 Mgate range. Engineers partition the ASIC RTL into multiple FPGAs using vendor toolchains and verify functionality at near-real-clock speeds before committing to mask sets. The 90 nm Stratix II fabric provides predictable timing closure that correlates well with downstream ASIC processes. Compared to ASIC silicon, prototype FPGAs run 3-10x slower but cost nothing in NRE; this enables software bring-up, system integration testing, and customer demonstrations months before silicon returns.
추천
Video Broadcast Processing
Broadcast video workflows (SDI routers, format converters, frame synchronizers) require wide parallel datapaths and clock-domain crossing - tasks the EP2S15F484C5 absorbs with 342 I/O and dedicated TriMatrix memory blocks. The 409 Kbit embedded memory supports line/field buffers and de-interlacing FIFOs without external SRAM. Design tip: use ALM registers to pipeline pixel streams and place embedded memory adjacent to consuming logic for short critical paths. Compared to ASIC broadcast chips, this FPGA enables multi-format (SD/HD/3G-SDI) support in one reconfigurable design.
추천
Industrial Motor Control FPGA
Multi-axis motor controllers require deterministic PWM generation, encoder feedback, and fieldbus integration. The EP2S15F484C5's 342 I/O accommodates 6+ axis PWM outputs, quadrature decoder inputs, and EtherCAT/CAN/RS-485 interfaces in a single chip. Stratix II ALM-based logic supports per-axis state machines with deterministic latency in the 100-200 ns range, suitable for sub-microsecond current-loop control. Compared to microcontroller-based motor control, this FPGA delivers deterministic timing without RTOS jitter and parallel processing for high-axis-count drives.
추천
Network Protocol Bridge
Legacy-to-modern protocol bridges (PCI/PCI-X to PCIe, RapidIO to Ethernet, VME to Serial RapidIO) fit naturally on the EP2S15F484C5 thanks to multi-standard I/O support and abundant logic for protocol state machines. The 1.2 V core combined with selectable VCCIO banks (1.5/1.8/2.5/3.3 V) lets one device drive multiple legacy and modern bus voltages without external level shifters. Design tip: instantiate soft cores (e.g., Nios II) for housekeeping while running data-plane bridges in dedicated ALM/DSP logic. Compared to ASSP bridge chips, this FPGA enables custom protocol variants and late-stage firmware updates.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S15F484C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S15F484C4N | EP2S15F484C4 | EP2S15F484C3N | EP2S15F484C3 |
|---|---|---|---|---|---|
| Package | 484-FBGA (FC-FBGA) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Speed Grade | C5 | C4 (slower) | C4 (slower) | C3 (slowest) | C3 (slowest) |
| Logic Elements (LE) | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 |
| Adaptive Logic Modules (ALMs) | 6240 | 6240 | 6240 | 6240 | 6240 |
| User I/O | 342 | 342 | 342 | 342 | 342 |
| Embedded Memory | 409 Kbit | 409 Kbit | 409 Kbit | 409 Kbit | 409 Kbit |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lead-Free (N suffix) | No (contains Pb) | Yes (lead-free) | No | Yes (lead-free) | No |
주요 차별점
- Highest Fmax in EP2S15 family (vs EP2S15F484C3)
- Pb-containing package variant (older fab run) (vs EP2S15F484C4N)
- Mid-tier Stratix II density with abundant I/O (vs EP2C50F672C6 (Cyclone II))
설계 노트
Estimated: Stratix II EP2S15F484C5 at full utilization with 1.2 V core draws approximately 1.5-2.5 A from VCCINT and 0.5-1.5 A from VCCIO depending on toggle rate. Decoupling stack: 100 uF bulk + 22 uF tantalum + 10 x 10 uF ceramic + 20 x 0.1 uF ceramic within 0.5 inch of the BGA. Multi-rail sequencing (1.2 V core before VCCIO) is mandatory to prevent partial-configuration latch-up; use a sequencer IC such as TI TPS3808 or an FPGA-supervisor with adjustable delay.
The 484-FBGA package uses a 1.0 mm ball pitch - PCB requires microvia or via-in-pad technology with at least 4 routing layers to break out the inner balls. Per Stratix II layout guidelines, keep all decoupling within 100 mils of their respective balls and use continuous reference planes on inner layers under the BGA. Signal integrity on high-speed DDR/DDR2 interfaces demands matched-length traces within 25 mils (data) and 50 mils (DQS/CLK) - run length matching at the CAD tool stage, not after layout.
Do not leave any Stratix II I/O bank floating - unused banks still require their VCCIO pin connected to a valid voltage (1.5/1.8/2.5/3.3 V) or the device may fail to configure or exhibit I/O leakage. Configuration via external flash (EPCS / EPCQ) requires the CONFIG_DONE pin pull-up and proper AS/PS mode strapping per the Stratix II Configuration Handbook. Estimated: leaving VCCIO floating can draw 50-200 mA leakage and prevent POR.
규정 준수 정보
Per Digchip specifications: 'Lead Free Status: Contains Lead; RoHS Status: RoHS Non-Compliant'. AEC-Q100 not applicable for commercial-grade FPGA. REACH / halogen / conflict-mineral compliance not stated in provided data.
