EP2S130F1020C3 - Stratix II FPGA, 132540 Cells, 1020-FBGA | Intel
부품 번호: EP2S130F1020C3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1545 | $154,500.00 |
| 500 | $1410 | $705,000.00 |
| 1,000 | $1295 | $1,295,000.00 |
EP2S130F1020C3 개요
A Field Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, routing, and I/O can be reconfigured by the designer after manufacture. FPGAs occupy the high-performance tier between fixed-function ASICs and microcontrollers, offering parallel processing, deterministic latency, and rich high-speed serial/parallel I/O. Stratix II belongs to the high-end Altera (now Intel) FPGA hierarchy and is widely deployed in DSP, communications, and ASIC prototyping applications.
Key features of the EP2S130F1020C3 include 6,627 LABs, 742 user I/Os, embedded RAM, embedded multipliers (DSP blocks), and up to 12 transceivers (per the Stratix II family; EP2S130F1020C3 SKU is a logic-rich, non-transceiver variant). The device supports high-speed external memory interfaces including DDR/DDR2/QDRII SRAM, multiple PLLs, and 1.2 V hot-socketing capability for multi-FPGA boards.
Architecture-wise, Stratix II introduces an adaptive logic module (ALM) that improves efficiency over the previous Stratix LE architecture, plus dedicated on-chip termination (OCT) for clean high-speed signaling. Combined with a 1.2 V core, it reduces dynamic power per logic operation compared with prior 1.5 V generations.
Typical applications include ASIC prototyping, high-speed DSP pipelines, telecom baseband processing, network packet inspection, video broadcast, and test-and-measurement instrumentation. The 1020-FBGA footprint is shared across the Stratix II family, allowing pin-compatible migration across density grades.
When designing with the EP2S130F1020C3, observe Stratix II power-on sequencing (1.2 V VCCINT must ramp before or simultaneously with VCCPD) and provide adequate decoupling for the high transient current on logic transitions.
This page synthesizes distributor pricing, same-package drop-in alternatives across the Stratix II family, and Stratix II design considerations not aggregated on any single distributor listing.
드롭인 대체품: EP2S130F1020C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F1020C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, RoHS Status, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F1020C3N
✅ 드롭인✓ 재고 있음
$1095 / 개
데이터시트 보기 →EP2S130F1020C4
✅ 드롭인✓ 재고 있음
$2800 / 개
데이터시트 보기 →EP2S130F1020C5
✅ 드롭인✓ 재고 있음
$4100 / 개
데이터시트 보기 →EP2S130F1020I4
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2S130F1020C3 최대 정격 & 전기적 특성
| Series | Stratix II |
| Family | Stratix II |
| Logic Elements / Cells | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| User I/Os | 742 |
| Transceivers | Logic-rich SKU (no transceiver; transceiver variants use different suffix) |
| Maximum Internal Frequency | 778.82 MHz (per family datasheet) |
| Process Technology | 90 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V |
| 패키지 / 케이스 | 1020-BBGA (FC-FBGA), 33x33 mm |
| Supplier Device Package | 1020-FBGA (33x33) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial, 'C' speed grade) |
| Speed Grade | C3 (commercial, -3 speed) |
EP2S130F1020C3 1020-fbga (33x33) 핀 구성 가이드
EP2S130F1020C3(1020-fbga (33x33) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F1020C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F1020C3 적합 용도: 6 애플리케이션s: ASIC Prototyping, High-Performance DSP Pipelines, Telecom Baseband Processing, Network Packet Inspection, Video Broadcast Processing, Test and Measurement Instrumentation.
ASIC Prototyping
The EP2S130F1020C3's 132,540 logic cells and 6,627 LABs provide the density needed to prototype mid-complexity ASIC designs before tape-out. The Stratix II ALM architecture offers higher logic utilization per cell than previous generations, allowing engineers to fit larger RTL blocks on a single device. The 742 user I/Os and TriMatrix embedded memory simplify bring-up of multi-clock SoC prototypes, and Quartus II synthesis support enables rapid design iteration. Compared with ASIC, the FPGA's parallel fabric delivers real-time verification at near-ASIC clock rates; the trade-off is unit cost, which the Stratix II family accepts in return for programmable flexibility.
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High-Performance DSP Pipelines
Stratix II integrated DSP blocks with dedicated multipliers enable the EP2S130F1020C3 to sustain high-throughput DSP pipelines for radar, software-defined radio, and baseband processing. With up to several hundred DSP blocks and 6.7 Mbits of TriMatrix memory, the device can implement multi-tap FIR filters, FFTs, and matrix math at hundreds of MSPS. The 1.2 V core reduces dynamic power relative to 1.5 V predecessors, easing thermal design in dense DSP arrays. Designers should use Quartus II DSP Builder to map MATLAB models directly to FPGA fabric, then verify timing closure at the 778.82 MHz internal Fmax target.
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Telecom Baseband Processing
Telecom baseband designs demand deterministic latency, abundant multipliers, and high-speed external memory interfaces - exactly what the EP2S130F1020C3 delivers. The 742 user I/Os support DDR/DDR2/QDRII SRAM interfacing for line-card buffering, while the embedded DSP blocks accelerate channelization, FEC, and modulation. The 90 nm process keeps the dynamic power manageable across dense multi-channel receivers. In WCDMA, LTE, and custom OFDM modems, the Stratix II fabric is widely used for both prototyping and production deployment, with Quartus II providing telecom-grade IP cores for CPRI, OBSAI, and Serial RapidIO.
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Network Packet Inspection
Packet inspection at line rate requires wide buses, large rule tables, and high-frequency TCAM-like lookups - all achievable with the EP2S130F1020C3. The 742 I/Os sustain multiple SGMII / SPI-4.2 interfaces, while the 6.7 Mbits of TriMatrix memory accommodate deep packet buffers and hash tables. Designers can implement pattern matching using embedded multipliers plus distributed RAM, achieving multi-Gbps throughput at modest logic cost. Compared with merchant NPUs, the FPGA offers reprogrammable protocols for evolving features such as OpenFlow, VXLAN, and GTP offload, all while staying within the 1.2 V power budget.
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Video Broadcast Processing
Studio-grade video broadcast systems rely on the EP2S130F1020C3 to perform real-time SD/HD/3G-SDI processing, scaling, de-interlacing, and overlay generation. The 742 user I/Os accommodate multiple parallel video buses plus AES/embedded-audio channels, and the Stratix II ALM fabric efficiently maps wide pixel pipelines. Embedded TriMatrix memory doubles as line and frame buffers, while dedicated DSP blocks accelerate 2D FIR scaling and chroma resampling. Designers typically pair the FPGA with external DDR2 memory for frame reordering and achieve deterministic latency required by SMPTE broadcast standards.
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Test and Measurement Instrumentation
Test and measurement gear - logic analyzers, protocol testers, arbitrary waveform generators - benefits from the EP2S130F1020C3's high logic density and 742 I/Os. The Stratix II fabric supports multi-channel waveform capture, deep acquisition memory, and parallel signal conditioning for protocols like PCI Express, USB 3.0, and SATA. The 90 nm process keeps channel counts high without exceeding lab-instrument thermal envelopes. Designers use Quartus II to integrate proprietary IP with vendor-supplied measurement cores, enabling rapid custom-test deployment. Industrial-temperature (-I) variants allow portable and field-deployed instrumentation in -40C to +100C environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S130F1020C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F1020C3N | EP2S130F1020C4 | EP2S130F1020C5 | EP2S130F1020I4 |
|---|---|---|---|---|---|
| Package | 1020-BBGA (FC-FBGA, 33x33 mm) | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Series | Stratix II | Stratix II | Stratix II | Stratix II | Stratix II |
| Logic Cells | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| LABs | 6,627 | 6,627 | 6,627 | 6,627 | 6,627 |
| User I/Os | 742 | 742 | 742 | 742 | 742 |
| Speed Grade | C3 (-3) | C3 (-3) | C4 (-4, slower) | C5 (-5, slowest) | I4 (-4 industrial, slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Process | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
주요 차별점
- Pin-compatible 1020-FBGA package enables seamless migration to higher-density Stratix II FPGAs (vs EP2S180F1020C3)
- Highest speed grade in the family for Stratix II 132k-cell density (vs EP2S130F1020C4)
- Commercial 0C to +85C temperature range suits lab and indoor deployment (vs EP2S130F1020I4)
설계 노트
Stratix II requires a controlled power-on sequence: VCCINT (1.2 V) must ramp before or simultaneously with VCCPD, and VCCIO banks must follow the recommended sequence. Use a multi-rail sequencer such as the LTC3543 or TI TPS74xxx family. Decoupling follows the Stratix II Device Handbook: place 0.1 uF X7R ceramics within 100 mil of every VCCINT pin and bulk decoupling per the reference board stackup. Estimated: at 100% utilization, the EP2S130F1020C3 may draw 3-5 A from VCCINT - budget for at least 6 A continuous per rail with 10 A peak.
Estimate: at 100% resource utilization and typical 50-70% toggle rate, total device power can exceed 15-20 W. The 1020-FBGA package requires a thermal pad with stitched vias to inner copper planes. Attach a heatsink if the chassis allows; otherwise provide 6+ layer PCB with 1 oz copper on top/bottom and dedicated inner solid planes for thermal spreading. Industrial -I4 variants support -40C to +100C operation, useful when commercial-temperature C3 variants are inadequate. (Estimated values based on Stratix II family power estimator defaults; verify in Quartus II PowerPlay for your design.)
The 1020-ball FC-FBGA at 33x33 mm uses a 1.0 mm ball pitch with full-array assignment. Use microvia (laser-drilled) stackups - 4+ mil core, 8+ mil dielectric, sequential lamination is required for reliable BGA breakout. Length-match LVDS/SE pairs to within 25 mil. Route DDR2 interfaces on inner stripline layers with 50 ohm controlled impedance, keeping reference planes intact under every differential pair. The bottom BGA balls are exposed pads - ensure they have thermal relief and adequate copper fill for heat dissipation.
Common pitfalls: (1) Do not power up VCCINT before VCCPD - this can damage I/O buffers; (2) MSL3 - the FC-FBGA package absorbs moisture, so dry-bake per JEDEC J-STD-033 before reflow; (3) Configuration mode (AS / PS / JTAG) must be set correctly with MSEL pins, otherwise the device will not enumerate; (4) Do not leave unused I/O banks floating - tie them to a valid VCCIO or set them as inputs with weak pull-up; (5) Hot-socketing is supported but requires the proper VCCIO ramp profile. Refer to AN 521: Using Altera Configuration Devices for full bring-up guidance.
규정 준수 정보
RoHS / REACH / lead-free status for EP2S130F1020C3 not confirmed from the verified distributor snippets; the EP2S130F1020C3N variant is the lead-free / RoHS variant per Altera part-number convention. AEC-Q100 is not applicable as this is a commercial/industrial FPGA, not an automotive-qualified part.
