EP2S15F672I4 - 15K LEs Stratix II FPGA 672-FBGA | Intel / Altera
부품 번호: EP2S15F672I4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $489.16 | $489.16 |
| 10 | $465 | $4,650.00 |
| 100 | $420 | $42,000.00 |
| 500 | $389.5 | $194,750.00 |
| 1,000 | $365 | $365,000.00 |
EP2S15F672I4 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (LABs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader hierarchy of programmable logic devices -> ASIC prototyping platforms -> digital semiconductor ICs. Stratix II FPGAs sit in the high-performance tier of the Altera/Intel portfolio, integrating hard DSP blocks, transceivers, and large on-chip RAM for compute-intensive designs.
Key features of the EP2S15F672I4 include up to 6.3 Gbps embedded transceivers on certain Stratix II variants, dedicated 18x18 multipliers totaling 156 DSP blocks, TriMatrix embedded memory architecture supporting true dual-port and FIFO operation, and support for external DDR/DDR2/QDR memory interfaces via dedicated PHY blocks. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG, with built-in error detection/correction on configuration RAM.
The Stratix II architecture separates the routing switch into a heterogeneous multi-tier network with dedicated paths between LABs, M512/M4K/M-RAM blocks, and DSP blocks. This reduces critical-path delay and improves timing closure compared to earlier Stratix generations. The 672-FBGA package exposes 366 user I/Os, which is the maximum for this die size in the Stratix II family.
Typical applications include high-throughput DSP pipelines (radar, beamforming, video codec acceleration), wire-speed packet processing in networking line cards, ASIC prototyping, military/aerospace signal processing, and industrial machine-vision controllers. The combination of 156 multipliers and 419 Kbits of block RAM enables high FIR/FFT throughput without external memory bottlenecks.
Design consideration: Stratix II devices require a 1.2 V core supply plus multiple I/O bank supplies (1.5 V, 1.8 V, 2.5 V, 3.3 V selectable per bank). Power estimation should use the Quartus II PowerPlay Early Power Estimator before PCB layout, since the 672-FBGA has limited heat dissipation and high-density Stratix II designs typically require forced-air cooling or a thermal management plan.
This page synthesizes real-time distributor pricing, drop-in same-package alternatives, and engineering design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference for the part.
드롭인 대체품: EP2S15F672I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S15F672I4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, RoHS Status, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S15F672C5N
✅ 드롭인✓ 재고 있음
$121.9 / 개
데이터시트 보기 →EP2S15F672C5
✅ 드롭인✓ 재고 있음
$199 / 개
데이터시트 보기 →EP2S15F672C4N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2S15F672C4
✅ 드롭인✓ 재고 있음
$235 / 개
데이터시트 보기 →EP2S15F672C3N
✅ 드롭인✓ 재고 있음
$142.75 / 개
데이터시트 보기 →EP2S15F672C3
✅ 드롭인✓ 재고 있음
$142.3 / 개
데이터시트 보기 →EP2S15F672I4 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 15,600 |
| LABs | 780 |
| Total Embedded Memory (Bits) | 419,328 |
| Embedded 18x18 Multipliers | 156 |
| Maximum User I/Os | 366 |
| 패키지 | 672-BBGA, FCBGA (FineLine BGA) |
| Process Node | 90 nm |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| 실장 유형 | Surface Mount (BGA) |
EP2S15F672I4 672-bbga, fcbga (fineline bga) 핀 구성 가이드
EP2S15F672I4(672-bbga, fcbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S15F672I4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S15F672I4 적합 용도: 6 애플리케이션s: High-Throughput DSP Pipelines, Wire-Speed Network Line-Card Processing, ASIC Prototyping and Emulation, Industrial Machine Vision and Image Processing, Military and Aerospace Signal Processing, Embedded Compute and Industrial Control.
High-Throughput DSP Pipelines
The EP2S15F672I4 fits high-throughput DSP pipelines such as radar baseband processing, beamforming, and multi-channel video codecs because it provides 156 dedicated 18x18 hardware multipliers and 419,328 bits of TriMatrix embedded memory. Each 18x18 multiplier sustains one 250 MHz multiply-accumulate per cycle in the Stratix II DSP block, and the combination of MRAM/M4K/M512 blocks lets engineers stage coefficient buffers and delay lines directly on-die to avoid external memory round-trips. Placed on the signal-processing daughter card, the EP2S15F672I4 typically replaces a multi-DSP + FPGA partitioning while keeping the same PCB envelope. The 672-FBGA package supports the high I/O count needed for parallel LVDS ADC/DAC interfaces common in radar and software-defined-radio front ends.
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Wire-Speed Network Line-Card Processing
The EP2S15F672I4 is well suited to wire-speed packet classification, deep-packet inspection, and protocol offload in 1G/10G networking line cards because the 366 user I/Os expose multiple SGMII/SPI4.2 interfaces and the 419 Kbits of block RAM comfortably hold routing tables and connection-state lookup structures. The TriMatrix memory supports true dual-port access, allowing simultaneous header read and table update without contention. In typical deployments, the FPGA sits between the PHY and the network processor, accelerating match-action pipelines and shedding packets that would otherwise queue on the NPU. The industrial temperature grade (-40C to +100C) of the EP2S15F672I4 supports outdoor edge-router and industrial Ethernet switch deployments.
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ASIC Prototyping and Emulation
The EP2S15F672I4 is frequently used as a building block in ASIC prototyping and emulation platforms because the Quartus II toolchain preserves the same RTL across multiple Stratix II die sizes and pin-compatible packages, letting engineers iterate between EP2S15, EP2S30, EP2S60, and EP2S130 capacity points. The 672-FBGA footprint is shared with the larger EP2S30 and EP2S60 dies, so a single prototype PCB can be re-populated to validate larger designs without board rework. The 156 multipliers and ample block RAM faithfully emulate compute-intensive ASIC subsections. Engineers can also connect multiple EP2S15F672I4 devices in a multi-FPGA partition to emulate ASICs that exceed a single die capacity.
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Industrial Machine Vision and Image Processing
The EP2S15F672I4 suits industrial machine-vision controllers because the 366 user I/Os accept multiple Camera Link or LVDS camera inputs, the 156 18x18 multipliers accelerate convolution kernels, and the industrial temperature grade (-40C to +100C) tolerates factory-floor thermal envelopes. The TriMatrix embedded memory holds image line buffers and lookup tables directly on-die, reducing DDR access traffic. In a typical pick-and-place vision system, the EP2S15F672I4 ingests raw Bayer frames from the camera, runs edge-detection and blob-analysis kernels, and hands compact feature vectors to the host controller. The 672-FBGA package footprint gives access to all I/O banks needed for multi-camera setups.
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Military and Aerospace Signal Processing
The EP2S15F672I4 is used in military and aerospace embedded signal-processing systems (radar warning receivers, electronic-warfare subsystems, flight-control test rigs) because the industrial temperature grade tolerates extended ambient ranges and the Stratix II family is supported by long-lifecycle defense programs. The 156 hardware multipliers sustain real-time FFT, channelization, and crypto kernels, while the TriMatrix memory holds state buffers without external DRAM round-trips. Designers benefit from the same Quartus II IP library across defense program generations, simplifying firmware portability. The 672-FBGA package is shared with the EP2S30 and EP2S60 dies, supporting in-field capacity upgrades without PCB rework when mission requirements expand.
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Embedded Compute and Industrial Control
The EP2S15F672I4 also fits embedded compute nodes, PLCs, and industrial control platforms that benefit from hardware-accelerated state machines, custom protocol handlers, or soft-processor subsystems. The Quartus II toolchain supports Nios II soft-core integration, allowing the FPGA to host one or more embedded processors alongside custom accelerators. The 366 user I/Os are sufficient for driving multi-axis motor control, EtherCAT, or PROFINET interfaces from a single FPGA. Industrial temperature grade operation (-40C to +100C) and the robust BGA package suit factory-floor deployment with vibration and thermal cycling. The same package footprint as the EP2S30/EP2S60 lets designers scale capacity without re-spinning the PCB.
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추천 제품 요약
엔지니어링 참조 데이터: EP2S15F672I4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S15F672C5N | EP2S15F672C5 | EP2S15F672C4N | EP2S15F672C4 | EP2S15F672C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BBGA FCBGA | 672-BBGA FCBGA (same) | 672-BBGA FCBGA (same) | 672-BBGA FCBGA (same) | 672-BBGA FCBGA (same) | 672-BBGA FCBGA (same) |
| Logic Elements | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 |
| Embedded Multipliers (18x18) | 156 | 156 | 156 | 156 | 156 | 156 |
| Embedded Memory (Bits) | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 |
| Maximum User I/Os | 366 | 366 | 366 | 366 | 366 | 366 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I4 (industrial speed bin) | C5 (fastest) | C5 (fastest) | C4 (mid) | C4 (mid) | C3 (slowest) |
주요 차별점
- Largest BGA package in the Stratix II EP2S15 family exposes all 366 user I/Os (vs EP2S15F484I4)
- Industrial temperature grade enables factory-floor and outdoor deployment (vs EP2S15F672C5N)
- Pin-compatible capacity scaling to EP2S30 and EP2S60 in the same 672-FBGA footprint (vs EP2S15F484I4)
- 156 dedicated 18x18 multipliers for DSP acceleration (vs EP2C50F672I8N)
설계 노트
Estimated: Stratix II EP2S15F672I4 designs at full utilization (all LABs, all DSP blocks, high toggle rate) typically dissipate 4-8 W with the 1.2 V core rail plus another 1-3 W across the I/O bank supplies. Use the Quartus II PowerPlay Early Power Estimator (EPE) spreadsheet to model your specific utilization before PCB layout; do not rely on back-of-the-envelope numbers. Plan for a 1.2 V regulator capable of at least 8 A continuous with low-noise LDO post-regulation for the PLL supply pins (VCC_PLL) to minimize jitter.
The 672-FBGA FineLine BGA has a 1.0 mm ball pitch and demands a 6-8 layer PCB with continuous GND/power planes underneath the device for thermal spreading and controlled impedance for high-speed LVDS/PCIe signaling. Decoupling must follow the Stratix II reference schematic: 0.1 uF X7R caps adjacent to every VCCIO/VCCINT pin pair, plus bulk 47-100 uF tantalum or polymer caps per power plane. BGA pads require NSMD (non-solder-mask-defined) openings for higher assembly yield per IPC-7351.
Route configuration and JTAG pins (nCONFIG, nSTATUS, CONF_DONE, TCK, TMS, TDI, TDO) with short traces and no stubs so that the configuration controller can recover from noisy power-up events. External memory interfaces (DDR/DDR2/QDR) must use matched-length traces per the Stratix II External Memory Interface Handbook; DQ/DQS/CLK skew budgets are typically +/-25 ps for DDR2-400. Place series-termination resistors within 200 mils of the FPGA output pins to dampen reflections on SSTL/HSTL signaling.
The 672-FBGA package has limited theta-JA (approximately 12-15 C/W with 4-layer PCB and 0 LFM airflow), so Stratix II designs above 5 W total power typically require forced-air cooling or a heat-spreader. Derate to junction temperature 125 C max (industrial grade), keeping the thermal margin greater than 15 C at worst-case ambient (85 C) per the Stratix II Reliability Report. Use multiple thermal vias in the BGA land pattern under the die to conduct heat into the inner GND plane.
Common pitfalls with Stratix II designs include: (1) forgetting to enable the configuration CRC check in the Quartus II Device & Pin Options, which can mask single-event upsets in configuration RAM; (2) exceeding the 1.2 V VCCINT absolute-max rating of 1.32 V during power-up transients; (3) mixing 1.5 V and 1.8 V VCCIO banks without proper bank-to-bank isolation; and (4) using LVDS outputs without the 100-ohm differential termination at the receiver end. Always validate the design with the Quartus II timing analyzer and run the SignalTap II logic analyzer against the actual silicon before production release.
규정 준수 정보
Compliance information not present in the verified web data for EP2S15F672I4; AEC-Q100 not applicable for FPGAs. Mark all compliance fields as [DATA_NEEDED] pending datasheet verification.
