EP2S30F672C4N - Stratix II FPGA 33,880 LE 672-FBGA | Intel / Altera
부품 번호: EP2S30F672C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $175 | $175.00 |
| 10 | $162.5 | $1,625.00 |
| 100 | $148 | $14,800.00 |
| 500 | $135 | $67,500.00 |
| 1,000 | $121 | $121,000.00 |
EP2S30F672C4N 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, PLLs, transceivers, and DSP slices. Stratix II belongs to the high-density, performance-oriented segment of the FPGA taxonomy, sitting between mid-range FPGAs (Cyclone) and the highest-end transceivers-rich families (Stratix IV/V/10 series). The 33,880 logic-element count places the EP2S30 in the mid-density tier, and its 1.4 Mbit embedded RAM enables large on-chip buffers for DSP, networking, and high-speed datapath applications.
Key features include 1,694 LABs/CLBs organized for parallel logic implementation, a 711.24 MHz maximum internal frequency per the published datasheet, and support for Stratix II architecture features such as TriMatrix embedded memory blocks, DSP blocks, and source-synchronous I/O. The 672-FBGA package is a wirebond fine-pitch BGA that supports 500 single-ended user I/Os plus high-speed differential pairs, with multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) supported per the Stratix II device handbook.
The EP2S30F672C4N is implemented in a 90 nm CMOS process, with hard multipliers and DSP blocks enabling fixed- and floating-point datapath acceleration. Transceivers and external memory interfaces are provided through dedicated PHY blocks, and the Quartus II design tool supports synthesis, place-and-route, and timing closure for the device family.
Typical applications include telecom baseband processing, video imaging pipelines, industrial control and machine vision, military/aerospace signal processing, and high-speed data acquisition systems. The mid-range logic and memory density make the EP2S30 a fit for designs that exceed Cyclone II capacity but do not require the transceivers or larger logic budget of Stratix IV or Stratix V.
When designing, ensure 1.2 V core and 3.3 V/2.5 V/1.8 V I/O supply decoupling is sized per the Stratix II pin connection guidelines, and that the FBGA land pattern is matched to JEDEC MS-034 for reliable assembly. The C4 speed grade is appropriate for most commercial systems; for industrial temperature range or faster timing closure, consider EP2S30F672I4N or C5 speed grades.
This page synthesizes distributor pricing, lifecycle status, drop-in alternative listings, and practical design notes for the EP2S30F672C4N that are not consolidated on the manufacturer datasheet or single distributor page.
드롭인 대체품: EP2S30F672C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S30F672C4N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Configuration Method, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S30F672C4
✅ 드롭인✓ 재고 있음
$498.43 / 개
데이터시트 보기 →EP2S30F672C3N
✅ 드롭인✓ 재고 있음
$55 / 개
데이터시트 보기 →EP2S30F672C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$450 / 개
데이터시트 보기 →EP2S30F672I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$145 / 개
데이터시트 보기 →EP2S60F672C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$325 / 개
데이터시트 보기 →EP2S30F672C4N 최대 정격 & 전기적 특성
| Series | Stratix II |
| Logic Elements | 33,880 |
| Total RAM Bits | 1,369,728 |
| Number of LABs/CLBs | 1694 |
| Number of I/O | 500 |
| 패키지 | 672-BBGA, FCBGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (Commercial, C4 grade) |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Maximum Internal Frequency | 711.24 MHz |
| Speed Grade | C4 (Commercial, internal performance bin 4) |
| MSL 레벨 | 3 (168 hours) |
| Transceivers | N/A (Stratix II non-GX variant) |
| Configuration Method | Passive serial / Fast passive parallel / JTAG |
EP2S30F672C4N 672-bbga, fcbga (fineline bga) 핀 구성 가이드
EP2S30F672C4N(672-bbga, fcbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S30F672C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S30F672C4N 적합 용도: 6 애플리케이션s: Telecom Baseband Processing, Video Imaging and Machine Vision Pipelines, Industrial Control and Factory Automation, Military and Aerospace Signal Processing, High-Speed Data Acquisition Systems, Networking and Protocol Bridging.
Telecom Baseband Processing
The EP2S30F672C4N's 33,880 logic elements and 1.4 Mbit of TriMatrix embedded RAM make it well suited for telecom baseband signal processing such as channel coding/decoding, symbol-rate processing, and protocol framing. The 500 user I/Os in the 672-FBGA package provide ample LVDS and LVTTL interfaces for connection to ADC/DAC front ends and backplane SERDES links, while the 711.24 MHz internal fabric frequency supports symbol rates up to several hundred megasymbols/s. The commercial C4 speed grade is sufficient for most fixed-line and wireless backhaul designs, and the Quartus II toolchain supports VHDL/Verilog synthesis and incremental place-and-route.
추천
Video Imaging and Machine Vision Pipelines
The 1.4 Mbit TriMatrix memory pool on the EP2S30F672C4N is large enough to buffer several video lines in real time, supporting video format conversion, scaling, and edge-enhancement pipelines in industrial cameras and machine vision systems. The 500 I/Os include LVDS channels that can be paired for sub-LVDS or SLVS sensor interfaces, and dedicated PLL blocks can synthesize the pixel clocks required by CMOS image sensors. Designers typically route raw Bayer data through on-chip gamma correction and color-space conversion before DMA-ing to external DDR memory. The C4 speed grade meets real-time 1080p60 timing budgets at moderate clock rates.
추천
Industrial Control and Factory Automation
In factory automation, the EP2S30F672C4N can consolidate multiple motor-control, encoder, and fieldbus interfaces into a single programmable device. Its 33,880 logic elements handle multiple PID loops at sub-microsecond update rates, while the 500 I/Os support ENC/CW-CCW encoder inputs, isolated 24 V GPIO, and EtherCAT/EtherNet/IP MAC implementations. The commercial 0C to +85C temperature range suits most cabinet environments; for harsher sites, the EP2S30F672I4N industrial variant is preferred. The Quartus II SOPC Builder toolchain simplifies integration of Nios II soft-core processors for sequencer and HMI logic.
추천
Military and Aerospace Signal Processing
Legacy defense platforms continue to use the EP2S30F672C4N for radar, EW, and signal-intelligence signal processing where the design is mature and re-qualification is impractical. Its 33,880 LE support beamforming weights, FFT pipelines, and pulse-compression correlators for narrowband radar front-ends. Although the commercial C4 grade has limited temperature range, the EP2S30F672I4N industrial variant meets many defense environmental specs. Designers should evaluate the EP4Sxxx Stratix IV for new programs, but the EP2S30 remains approved on numerous legacy security and sustainment programs.
추천
High-Speed Data Acquisition Systems
The EP2S30F672C4N's 500 I/Os and rich PLL resources make it well suited to multi-channel high-speed DAQ systems. The TriMatrix memory buffers incoming ADC samples while on-chip DSP blocks perform FIR filtering, decimation, and FFT analysis at the system clock. The 672-FBGA package supports source-synchronous LVDS pairs for interfacing to multi-channel pipelined ADCs at 100-200 MSPS. The C4 speed grade closes timing at the moderate clock rates typical of industrial and scientific DAQ, and the Quartus II platform includes IP cores for JESD204B and LVDS receivers.
추천
Networking and Protocol Bridging
In network equipment, the EP2S30F672C4N serves as a flexible protocol-bridging device: it can terminate 1G/10G Ethernet MACs, frame packets into OTN or SDH containers, or implement custom proprietary links. The 1.4 Mbit on-chip RAM is sufficient for line-rate buffering at gigabit speeds, while the 500 I/Os include many LVDS pairs for SFP+ cage interfaces. The C4 speed grade is well-matched to backplane traffic at 100-200 MHz, and the Stratix II transceivers (in the GX variants) support multi-gigabit serial links when required. Nios II soft-core integration enables management-plane processing on the same die.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S30F672C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S30F672C4 | EP2S30F672C3N | EP2S30F672C5N | EP2S30F672I4N | EP2S60F672C4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-BBGA, FCBGA | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same |
| Logic Elements | 33,880 | 33,880 (identical) | 33,880 (identical) | 33,880 (identical) | 33,880 (identical) | 60,440 (~78% more) |
| Embedded RAM (bits) | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 2,544,192 |
| Speed Grade | C4 (commercial) | C4 (identical) | C3 (slower) | C5 (faster) | I4 (industrial temp) | C4 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C |
| User I/Os | 500 | 500 | 500 | 500 | 500 | 500 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Mid-density Stratix II with 500 user I/Os (vs EP2C50F484C6N (Cyclone II))
- TriMatrix embedded memory with 1.4 Mbit (vs EP2C8F256C8N (Cyclone II 8,598 LE))
- Pin-compatible speed-grade variants (vs EP2S30F672C3N (C3 speed grade))
- Industrial temperature variant available (vs EP2S30F672C4N (commercial only))
설계 노트
The EP2S30F672C4N requires at least three power rails: a 1.2V core supply (VCCINT), a 2.5V or 3.3V analog PLL supply (VCCA_PLL) for each PLL, and a per-bank I/O supply (VCCIO) that can be 1.2V/1.5V/1.8V/2.5V/3.3V depending on the I/O standard. Decoupling should follow the Stratix II pin connection guidelines: 0.1 uF X7R ceramic plus 10 uF tantalum or polymer on each rail within 100 mils of the supply ball. Bulk decoupling of 220-470 uF per rail is recommended.
The 672-FBGA package is a 1.0 mm pitch FineLine BGA. PCB layout should use 0.5 mm (20 mil) via-in-pad or dog-bone fanout with a 0.4 mm (16 mil) finished via. Stack-up should place the BGA signal layers on the top six signal layers, with continuous ground planes on layers 2 and 7 for return-path integrity. For high-speed LVDS, maintain 100 ohm differential impedance and length-match pairs to within 25 mil.
The 672-FBGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 12 C/W with a 4-layer JEDEC test board. At 1.2V core and full Quartus II utilization, the part dissipates 1.5-3W. Forced airflow is recommended for industrial enclosures, and the EP2S30F672I4N industrial variant is preferred when ambient exceeds 60C. Estimated junction temperature: T_J = T_A + P_DISSIPATED * 12 C/W. For T_A = 70C and 2W, T_J = 70 + 24 = 94C, within the commercial spec.
Three common Stratix II design pitfalls: (1) The VCCPD pin (1.0V pre-driver supply for I/O) MUST be connected and powered before VCCINT ramps, or the device will not configure. (2) Configuration mode (MSEL[3..0]) must be set to the correct mode for the chosen boot source (PASSIVE_SERIAL, FAST_ASP, or JTAG). (3) The nCONFIG and nSTATUS pins are open-drain and require an external 10 kohm pull-up to VCCIO, otherwise initialization will fail intermittently.
For multi-gigabit LVDS pairs, keep the P and N traces within 5 mil of each other over the entire routed length, maintain 100 ohm differential impedance, and avoid right-angle bends. Use a continuous ground reference plane on the layer immediately below the LVDS signals. For SSRAM or external memory interfaces, group clock and address/command signals together and length-match to within 50 mil of the clock.
규정 준수 정보
RoHS, REACH, and lead-free status were not explicitly stated in the verified web data. Stratix II devices shipped after 2006 are typically RoHS compliant with Pb-free BGA balls, but engineers should request a RoHS/REACH compliance certificate from the supplier before volume production. AEC-Q100 not applicable as this is a programmable logic IC, not an automotive analog/digital standard part.
