EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
부품 번호: EP2S180F1508C4TT ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2S180F1508C4TT 개요
A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic blocks, configurable interconnects, and programmable input/output resources. Designers configure these resources after PCB assembly to implement digital circuits, processors, interfaces, control logic, and data-processing pipelines. Within the semiconductor hierarchy, an FPGA belongs to programmable logic and is related to CPLDs while generally offering higher logic capacity. Stratix II is Altera's high-density FPGA family for high-performance applications.
The defining features of EP2S180F1508C4TT are its approximately 180,000 logic elements, 1,170 user I/O pins, and 1,508-ball FBGA package. The high logic-element count supports broad datapaths, protocol bridges, embedded control, and multiple parallel processing functions on one device. Its large user-I/O count is valuable when a system must connect many buses, transceivers, memory interfaces, converters, or peripheral controllers. The fine-pitch BGA package provides dense interconnects but requires advanced PCB fabrication, assembly, inspection, and signal-integrity planning.
Technically, Stratix II devices combine configurable logic fabric with routing resources, memory blocks, clocking resources, DSP-oriented blocks, and programmable I/O. Firmware determines the implemented digital architecture, so power, timing, thermal behavior, and pin assignment remain design-dependent. A large BGA also creates extensive simultaneous-switching-current, decoupling, plane-integrity, and escape-routing challenges. Engineers should use the official family documentation and supported Intel FPGA development tools when compiling, configuring, and validating a design.
Typical applications include telecommunications and networking equipment, industrial automation and test systems, high-density interface bridging, video or imaging processing infrastructure, digital signal-processing controllers, and defense or aerospace electronics. The 1,170-I/O capability is especially useful where several external buses must terminate on one processing device. Engineers should choose this component when logic capacity, I/O density, and high-end programmable performance outweigh package complexity, power demands, and legacy-device availability.
A primary design consideration is the 1,508-ball FBGA land pattern: it cannot be treated as a simple, low-pin-count FPGA. Follow the official BGA pin assignment, bank rules, voltage sequencing, decoupling guidance, and thermal recommendations, then verify all timing, power integrity, and signal-integrity constraints in the selected speed grade. This page synthesizes verified identity, package, I/O, and logic-capacity data with package-aware comparison guidance; missing electrical and thermal limits remain explicitly identified rather than estimated.
드롭인 대체품: EP2S180F1508C4TT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S180F1508C4TT (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Family, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S180F1508C4
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2S180F1508C4N
✅ 드롭인✓ 재고 있음
$985 / 개
데이터시트 보기 →EP2S180F1508C3
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2S180F1508C3N
✅ 드롭인✓ 재고 있음
$1200 / 개
데이터시트 보기 →EP2S180F1508C3NAA
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2S180F1508C4TT 최대 정격 & 전기적 특성
| Product Type | Field-Programmable Gate Array (FPGA) |
| Device Family | Stratix II |
| Logic Elements | approximately 180,000 |
| User I/O | 1,170 pins |
| Logic Array Blocks | 8,970 LABs |
| 패키지 | 1,508-ball FBGA |
| 실장 유형 | Surface Mount |
| Temperature Grade | -T |
| RoHS 상태 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
EP2S180F1508C4TT 1,508-ball fbga 핀 구성 가이드
EP2S180F1508C4TT(1,508-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S180F1508C4TT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S180F1508C4TT 적합 용도: 6 애플리케이션s: Telecommunications Infrastructure, Industrial Automation Controllers, High-Density Interface Bridging, Digital Signal Processing Systems, Test and Measurement Equipment, Imaging and Video Processing.
Telecommunications Infrastructure
EP2S180F1508C4TT is well aligned to telecommunications infrastructure requiring high logic capacity and a large number of external connections. Its approximately 180,000 logic elements can support packet classification, protocol termination, traffic management, timing functions, and multiple parallel processing paths, while the 1,170 user I/O pins can aggregate buses and interface devices. The device is configured between PCB interconnect and downstream processing logic, where deterministic routing and broad connectivity are essential. The 1,508-ball FBGA offers dense integration but demands controlled impedance, solid reference planes, and close decoupling according to the EP2S180 family design rules. Legacy status requires lifecycle review, but the FPGA remains a candidate for installed-system support and exact-footprint revisions.
추천
Industrial Automation Controllers
EP2S180F1508C4TT fits industrial automation controllers that combine deterministic control logic with numerous sensors, actuators, motion interfaces, and communication links. Approximately 180,000 logic elements can accommodate state machines, real-time protocol bridges, data acquisition, supervisory control, and redundant processing partitions. The 1,170 user I/O pins are particularly valuable for aggregating field buses and parallel interfaces without immediately adding bridge devices. In a controller, the FPGA can sit between industrial I/O and a host processor, preprocessing data and implementing timing-critical functions. The -T temperature-grade designation is relevant to equipment environments, but exact operating limits remain data-needed. Engineers must validate the ordering-code temperature specification, toolchain support, thermal design, and supply longevity for each production platform.
추천
High-Density Interface Bridging
EP2S180F1508C4TT is a strong candidate for high-density interface bridging because it combines approximately 180,000 logic elements with 1,170 user I/O pins. It can translate bus widths, clock domains, packet formats, legacy protocols, and streaming interfaces while consolidating functions that might otherwise require several smaller devices. The FPGA can connect incompatible controllers, memories, converters, or backplane subsystems and perform buffering, framing, error detection, and protocol conversion. Using one large device reduces board-level component count but increases BGA-routing and power-integrity complexity. The 1,508-ball package requires exact I/O-bank and pin assignment. Designers should verify I/O standards, voltage levels, timing, simultaneous-switching limits, and configuration constraints from the official EP2S180 documentation before committing the PCB.
추천
Digital Signal Processing Systems
EP2S180F1508C4TT can support digital signal-processing systems that need parallel arithmetic, high data throughput, and extensive external connectivity. Its approximately 180,000 logic elements provide capacity for filters, transforms, encoders, demodulators, beamforming control, or multi-channel datapaths, subject to available DSP blocks and design-dependent resource use. The 1,170 user I/O pins allow the FPGA to interface with analog-to-digital converters, digital-to-analog converters, memory, radio-frequency front ends, or high-speed packet processors. In this role, the FPGA performs real-time processing between converters and system control. Clock planning, timing closure, thermal management, and power integrity are critical. Verified voltage, current, clock, memory, and DSP-block quantities are not supplied, so the official family data must be used before resource estimates are accepted.
추천
Test and Measurement Equipment
EP2S180F1508C4TT suits test and measurement equipment that must acquire, generate, analyze, and route many digital signals in real time. The approximately 180,000 logic elements can implement protocol engines, waveform sequencing, capture buffers, trigger logic, correlation, and instrument control, while 1,170 user I/O pins support dense fixture or backplane connectivity. A measurement platform can use the FPGA as a timing-critical processing layer between acquisition hardware, memory, processors, and user interfaces. Its programmable architecture allows instrument functions to evolve without replacing the complete hardware platform. The 1,508-ball FBGA provides extensive connectivity but requires careful signal integrity, controlled impedance, and thermal design. Exact operating voltages, I/O standards, clock limits, and thermal values are not in the verified snippets and must be confirmed from the EP2S180 family documentation.
추천
Imaging and Video Processing
EP2S180F1508C4TT is applicable to imaging and video-processing systems that require parallel pixel manipulation, frame buffering control, and connection to multiple high-throughput peripherals. Approximately 180,000 logic elements can support scaling, filtering, color conversion, compression preprocessing, feature extraction, and multi-stream control. The 1,170 user I/O pins are useful for connecting image sensors, display links, external memory, and host processors. The FPGA can operate as a real-time data-plane device between sensor interfaces and application processing, reducing host overhead. Successful implementation depends on clock-domain planning, memory bandwidth, pin assignment, and power integrity around the 1,508-ball FBGA. Because the supplied data does not verify transceiver count, memory capacity, clock frequency, or I/O performance, engineers must consult the official EP2S180 family datasheet for system-level feasibility.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S180F1508C4TT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S180F1508C4 | EP2S180F1508C4N | EP2S180F1508C3 | EP2S180F1508C3N | EP2S180F1508C3NAA |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1,508-ball FBGA | 1,508-ball FBGA | 1,508-ball FBGA | 1,508-ball FBGA | 1,508-ball FBGA | 1,508-ball FBGA |
| Family | Stratix II | Stratix II | Stratix II | Stratix II | Stratix II | Stratix II |
주요 차별점
- High verified logic capacity (vs EP2S180F1508C3)
- Large user-I/O count (vs EP2S180F1508C4N)
- Dense 1,508-ball integration (vs EP2S180F1508C3NAA)
- Exact -T temperature designation (vs EP2S180F1508C4)
설계 노트
Treat the 1,508-ball FBGA as a high-density system-in-package integration challenge, not as a conventional perimeter-lead FPGA. Start with the exact manufacturer land pattern and then coordinate the escape geometry, via type, trace width, layer stack, antipad dimensions, and BGA assembly process with the PCB fabricator and assembly house. Ball pitch and package dimensions are not in the verified data, so they must be obtained from the EP2S180 family package drawing. Preserve solid power and reference planes, minimize return-path discontinuities, and analyze critical high-speed routes. Prototype coupon structures and X-ray inspection plans before releasing a complex production board.
Use the official EP2S180 power-supply design and sequencing guidance because verified operating voltage, current, and thermal values are unavailable. Assign each required rail to the specified BGA power balls, follow the allowed ramp and sequencing order, and connect decoupling capacitors with short, wide paths to the relevant plane. The approximately 180,000 logic elements and 1,170 user I/O pins can support a highly utilized design, but actual current depends on clock rate, toggling rate, configuration, I/O activity, and resource use. Do not substitute generic FPGA decoupling values. Validate rail ripple, transient response, and simultaneous-switching behavior on prototypes before approving the layout.
The biggest engineering risk is assuming that similar EP2S180 ordering codes are automatically drop-in compatible. This record lists same-package candidates, but the supplied evidence does not define the complete C3, C4, N, TT, or AA suffix meanings. Before substitution, compare the manufacturer ordering table, package drawing, pin assignment, speed grade, temperature grade, environmental status, and configuration documentation. Also confirm that the older FPGA toolchain supports the target project and configuration memory. A package match alone does not prove timing, power, firmware, or lifecycle equivalence. Treat unverified alternatives as procurement leads, not approved replacements.
Design thermal management from the worst-case compiled configuration rather than nominal FPGA capacity. The verified sources do not provide junction-to-ambient or junction-to-case thermal resistance, maximum junction temperature, or power-consumption curves, so no estimated temperature rise is reported. Place thermal sensors near board hotspots, model board and enclosure airflow, and follow the package thermal-land and heat-spreader guidance in the family documentation. The 1,508-ball package and 1,170 possible user I/O connections can create concentrated power and heat. Validate the design across ambient temperature, process variation, clock rate, utilization, and output switching so that the selected cooling approach is based on measured or officially modeled data.
규정 준수 정보
The verified web data did not provide explicit environmental, automotive, lead-free, halogen-free, or conflict-minerals declarations for the exact MPN. N-suffixed candidates may differ environmentally, but no such status was supplied and none is assumed.
