EP2S90F780I4N - Stratix II FPGA 90K LE 780-BGA | Intel
부품 번호: EP2S90F780I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188 | $188,000.00 |
EP2S90F780I4N 개요
A Stratix II FPGA is a programmable logic device that lets engineers implement arbitrary digital logic, memory structures, DSP arithmetic, and soft processor cores on a single silicon die. Within the broader taxonomy, FPGAs sit below Application-Specific Standard Products (ASSPs) but above general-purpose microcontrollers in flexibility - they are reconfigured via HDL bitstreams rather than fixed at fabrication, which makes them the preferred platform for low-volume ASIC replacement, prototyping, and designs that need late-stage logic revision. Stratix II is Intel's mid-density family between Cyclone II (low-cost) and Stratix III/IV (high-end with transceivers).
Key features include up to 717 MHz internal operation per the family datasheet, embedded multiplier blocks for DSP pipelines, TriMatrix memory (MLAB, M512, M4K, M-RAM blocks) for distributed and buffered storage, dedicated clock management PLLs, and 534 user I/Os on the F780 package. Compared with Cyclone II FPGAs, Stratix II offers roughly 4x more logic capacity per device, embedded high-speed memory hierarchies, and lower core voltage operation. The 'I4' industrial grade and lead-free 'N' suffix make the part appropriate for industrial, telecom, and test-equipment markets that require halogen-free assembly.
Typical applications include high-speed digital signal processing (radar, software-defined radio), ASIC prototyping, telecom baseband processing, video and image processing pipelines, and protocol-bridging glue logic. The high embedded-memory count supports packet buffering, image line buffering, and FFT working-storage without external SRAM.
When designing with this part, observe that the Stratix II family has reached end-of-life from Intel - new designs should evaluate Stratix IV/V or Cyclone V/10 families unless second-source or long-term support agreements are in place. Power sequencing, JTAG configuration, and I/O standard termination follow the Stratix II handbook.
드롭인 대체품: EP2S90F780I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S90F780I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Mounting Type, Speed Grade, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S90F780I4
✅ 드롭인✓ 재고 있음
$142.5 / 개
데이터시트 보기 →EP2S90F780C5N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2S90F780C4N
✅ 드롭인✓ 재고 있음
$365 / 개
데이터시트 보기 →EP2S90F780I4N 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 90,960 LE |
| Logic Array Blocks (LABs) | 4,548 |
| Embedded Memory Bits | 4,520,488 bits |
| Total User I/Os | 534 |
| Maximum Internal Frequency | 717 MHz |
| Process Technology | 90 nm CMOS |
| 패키지 | 780-BBGA (FineLine BGA, 29 x 29 mm, 1 mm pitch) |
| Package Code | F780 |
| Operating Temperature Grade | Industrial (-40C to +100C case) |
| Lead-Free (RoHS) | Yes (N suffix) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel |
EP2S90F780I4N f780 핀 구성 가이드
EP2S90F780I4N(f780 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S90F780I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S90F780I4N 적합 용도: 7 애플리케이션s: ASIC Prototyping, Telecom Baseband Processing, Software-Defined Radio (SDR), Video and Image Processing, Radar Signal Processing, Industrial Protocol Bridging, Test and Measurement Instrumentation.
ASIC Prototyping
The EP2S90F780I4N's 90,960 logic elements and 4,520,488 bits of embedded TriMatrix memory make it well-suited for ASIC prototyping where engineers need to validate multi-million-gate ASIC designs before mask commit. The device's high logic density accommodates complete SoC subsystems including CPU cores, peripherals, and memory controllers in a single chip. With 534 user I/Os and abundant internal routing, designers can map large ASIC partitions onto the Stratix II fabric and run at near-ASIC clock frequencies. The 90 nm CMOS process and 717 MHz internal Fmax allow timing-accurate prototyping for ASIC designs targeting 250-400 MHz. The industrial temperature grade supports prototyping for automotive and industrial ASICs in development labs.
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Telecom Baseband Processing
Telecommunications baseband processing benefits from the EP2S90F780I4N's embedded DSP blocks and high logic capacity for implementing channel coding (Viterbi, Turbo, LDPC), modulation/demodulation, and FFT/iFFT engines. The 4.5 Mbit of TriMatrix on-chip memory provides ample working storage for symbol buffers and coefficient tables without requiring external SRAM for many algorithms. The 534 user I/Os support multiple parallel ADC/DAC interfaces and external PHY connections to base station fronthaul or backhaul networks. Stratix II's low core voltage reduces power consumption in always-on baseband units. Industrial temperature grade supports outdoor base station cabinets and central office deployments where ambient temperatures vary widely.
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Software-Defined Radio (SDR)
Software-defined radio platforms leverage the EP2S90F780I4N's combination of embedded DSP blocks, fast on-chip memory, and abundant logic to implement digital downconversion, channelization, and demodulation across wide bandwidths. The 90,960 LE accommodates multiple parallel receiver chains and reconfigurable waveform modems in a single device. With 4,520,488 bits of embedded memory, designers can implement sample-rate converters, FFT engines, and pulse-shaping filters without external memory bottlenecks. The Stratix II's TriMatrix architecture (MLAB/M512/M4K/M-RAM blocks) is ideal for distributed FIR filtering and distributed-arithmetic implementations. Industrial temperature operation and the 780-FBGA package make the EP2S90F780I4N suitable for tactical and commercial SDR modules deployed in field equipment.
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Video and Image Processing
Video processing pipelines - including broadcast format conversion, image stabilization, and machine vision preprocessing - are well-served by the EP2S90F780I4N's logic density and 4.5 Mbit embedded memory. The device can implement multiple parallel pixel-processing pipelines at 1080p60 resolutions, with the TriMatrix memory providing line buffers and frame storage for intermediate processing stages. The 534 user I/Os accommodate multiple camera/display interfaces (Camera Link, DVI, BT.1120) plus control and overlay buses. Embedded DSP blocks enable real-time color-space conversion, scaling, and deinterlacing without external multipliers. The industrial temperature grade supports video wall controllers and broadcast equipment operating in uncontrolled environments.
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Radar Signal Processing
Radar and sonar signal processing systems use the EP2S90F780I4N's embedded DSP blocks and high-speed memory to implement pulse compression, MTI filtering, and beamforming in real-time. The 4,520,488-bit TriMatrix memory can hold multiple range-Doppler maps, beam weights, and calibration tables directly on-chip. With 90,960 LE, designers can implement multiple parallel beamformer channels and adaptive nulling algorithms. The 717 MHz internal frequency supports coherent integration and FFT processing at sample rates up to several hundred MHz. Industrial temperature operation meets military and aerospace deployment requirements. The 780-BBGA package supports the multilayer PCBs typical in phased-array and synthetic-aperture radar designs.
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Industrial Protocol Bridging
Industrial automation and process control systems use the EP2S90F780I4N as a flexible protocol-bridging and gateway IC between Ethernet, serial fieldbuses (Profibus, Modbus, CAN), and legacy parallel interfaces. The 534 user I/Os support multiple fieldbus ports simultaneously, while the 90,960 LE accommodate protocol state machines, message buffering, and conversion logic. The 4.5 Mbit embedded memory holds protocol stack tables, message queues, and configuration data without external SRAM. Industrial temperature operation (-40C to +100C) suits factory floor and outdoor installation requirements. The lead-free, RoHS-compliant package meets modern environmental directives for industrial equipment sold into the EU and similar regulated markets.
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Test and Measurement Instrumentation
Test and measurement instruments (logic analyzers, protocol analyzers, bit-error-rate testers) leverage the EP2S90F780I4N's high logic capacity and abundant memory to implement deep trace buffers, pattern generators, and protocol-decoder cores. The 4,520,488 bits of embedded memory can hold multi-million-sample trace records without external DRAM in many applications, reducing BOM cost. With 534 user I/Os, the device supports multi-channel acquisition and stimulus boards. The 90 nm process and 717 MHz Fmax enable real-time correlation and triggering at gigabit data rates. Industrial temperature grade supports bench-top, portable, and rack-mounted instrumentation deployed across laboratory and field environments.
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추천 제품 요약
엔지니어링 참조 데이터: EP2S90F780I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S90F780I4 | EP2S90F780C5N | EP2S90F780C4N | EP2S90F1508I4N |
|---|---|---|---|---|---|
| Package | 780-BBGA (F780, 29x29 mm) | 780-BBGA (F780, 29x29 mm) - same | 780-BBGA (F780, 29x29 mm) - same | 780-BBGA (F780, 29x29 mm) - same | 1508-BBGA (F1508) - different package |
| Brand | Altera (now Intel) | Altera (now Intel) - same | Altera (now Intel) - same | Altera (now Intel) - same | Altera (now Intel) - same |
| Logic Elements | 90,960 LE | 90,960 LE | 90,960 LE | 90,960 LE | 90,960 LE |
| Embedded Memory Bits | 4,520,488 bits | 4,520,488 bits | 4,520,488 bits | 4,520,488 bits | 4,520,488 bits |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 4 | 4 | 5 (faster) | 4 | 4 |
| Lead-Free (RoHS) | Yes (N suffix) | No (SnPb finish) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest-density Stratix II in 780-BGA package (vs EP2S130F780I4N)
- Lead-free RoHS compliant terminations (vs EP2S90F780I4)
- Industrial temperature grade (vs EP2S90F780C4N)
설계 노트
Estimated: The Stratix II EP2S90F780I4N core voltage is typically 1.2V with separate VCC_PLL rails (1.2V or 2.5V depending on PLL configuration) and I/O banks that can operate from 1.2V to 3.3V. Power sequencing per the Stratix II handbook requires VCCINT to ramp before VCCPD, and VCCPD must precede VCCIO. A multi-rail sequencing controller such as Altera's EPCS-class sequencer or discrete MOSFET-based sequencers is required. In-rush current on a fully populated EP2S90 can exceed 5A on the 1.2V rail during configuration - use bulk capacitors and verify the regulator's current limit is not triggered.
Estimated: The 780-BGA package's typical theta_JA is in the 10-15 C/W range with adequate PCB thermal vias, but rises above 25 C/W without proper thermal management. At full resource utilization (~90k LE toggling at 50% activity), the EP2S90F780I4N can dissipate 5-10 W. Industrial-grade operation requires the case temperature stay below 100C; at 25 C ambient with proper thermal vias, a 4-layer PCB with copper ground plane typically keeps the junction below 90 C under typical loading. Use the Stratix II PowerPlay early power estimator before layout commitment.
The 780-BGA with 1 mm ball pitch requires microvia (laser-drilled or stacked-via) PCB technology. Inner-row balls (rows B through AH) connect to inner signal layers through microvias - a 4-layer 1-2-3-4 stack-up with 0.5 oz copper on outer layers and 1 oz on inner layers is typical. All BGA balls should have a thermal-via array on the opposite side of the PCB tied to a ground or power plane for heat spreading. Signal-integrity simulation is recommended for DDR/ DDR2 memory interfaces because the F780 package introduces approximately 1-2 nH of package inductance on each signal.
Do not confuse the EP2S90F780I4N (Stratix II, 780-BGA, 90k LE) with the EP2S90F1020I4N (1020-BGA, same die) - different packages cannot be drop-in swapped. Similarly, the EP2S130F780I4N (130k LE) has the same F780 package and is pin-compatible, but uses ~44% more logic resources. Configuration bitstream file (.sof or .pof) generated for EP2S90 will not load on EP2S130; conversely the EP2S130 bitstream will fit and configure EP2S90 silicon but operation will fail at runtime because the device ID does not match. Use the Quartus II programmer with proper device selection.
Place decoupling capacitors on the bottom side of the PCB directly beneath the BGA's outer row of balls. Use 0.1 uF X7R ceramics for every power pin pair and 10 uF X5R bulk capacitors every 10-15 power pins. Clock input pins (CLK0-CLK15) should be routed with controlled impedance (50 ohm single-ended or 100 ohm differential) and length-matched within 25 mils for pairs used in source-synchronous interfaces. JTAG chain integrity requires TCK series-termination of 33-49 ohms near the FPGA driver end.
규정 준수 정보
RoHS compliant per N suffix in part number. Halogen-free per package datasheet. AEC-Q100 not applicable (FPGA industrial-grade only, not automotive-qualified). Conflict minerals compliance per Altera/Intel CMRT filings.
