EP2S180F1508C5N - 179400-Cell Stratix II FPGA, 1508-FBGA | Intel / Altera
부품 번호: EP2S180F1508C5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5413.21 | $5,413.21 |
| 5 | $5350 | $26,750.00 |
| 10 | $5275 | $52,750.00 |
| 25 | $5199.5 | $129,987.50 |
| 100 | $5050 | $505,000.00 |
EP2S180F1508C5N 개요
What is a Stratix II FPGA? The Stratix II is Intel's (formerly Altera's) second-generation high-performance FPGA family built on a 90 nm CMOS process with an adaptive logic module (ALM) architecture that replaces the traditional 4-input LUT, providing higher logic density and shorter critical paths. FPGAs in general sit in the programmable-logic hierarchy as: programmable logic device (PLD) -> field-programmable gate array (FPGA) -> high-end SRAM-based FPGA -> Stratix II class. They are used as logic accelerators, signal-processing engines, and high-bandwidth glue logic where ASIC NRE is not justified.
Key parametric highlights include 9383040 total RAM bits (roughly 9.4 Mbit distributed + block), 96 dedicated DSP blocks (18x18 multipliers) for high-throughput DSP, 12 PLLs for multi-clock-domain synthesis, and 1170 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL and PCI/PCI-X signalling. The C5 speed grade places the device in the mid-fast bin of the Stratix II line, suitable for designs targeting internal frequencies in the 350-450 MHz fabric range.
Architecture-wise, the EP2S180F1508 uses a row/column-based routing fabric driven by ALMs (8-input fracturable LUT equivalents), 12 PLLs with on-chip termination and dynamic phase shift, 4 DLLs, and dedicated high-speed I/O serials that are shared across banks. Embedded TriMatrix memory blocks provide true dual-port, simple dual-port, and single-port RAM plus FIFO buffers without consuming user logic.
Typical applications include high-end telecom line-card ASIC prototyping, military signal-intelligence baseband processing, ASIC emulation, high-definition video processing pipelines, and high-channel-count software-defined radio (SDR) baseband. Its combination of 9.4 Mbit RAM and 1170 I/O is well matched to memory- and I/O-intensive designs such as H.264 encoders, multi-channel radar front-ends and routing-table lookups.
When designing, pay close attention to the 1.15 V to 1.25 V core supply tolerance and the multi-rail I/O bank VCCIO requirements (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V); proper decoupling and PCB stack-up are critical at 1508 balls. Use the Quartus II (legacy) or Quartus Prime design software for synthesis and timing closure, and verify pin assignments against the Stratix II Device Handbook pin tables.
This page synthesizes distributor pricing, same-package drop-in alternatives, and PCB-layout design notes that are not present in the manufacturer's datasheet alone.
드롭인 대체품: EP2S180F1508C5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S180F1508C5N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Process Technology, Family, Total RAM Bits, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S180F1508C5
✅ 드롭인✓ 재고 있음
$4880 / 개
데이터시트 보기 →EP2S180F1508C4N
✅ 드롭인✓ 재고 있음
$985 / 개
데이터시트 보기 →EP2S180F1508C3N
✅ 드롭인✓ 재고 있음
$1200 / 개
데이터시트 보기 →EP2S180F1508C4
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2S180F1508C3NAA
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2S130F1508C5N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S180F1508C5N 최대 정격 & 전기적 특성
| Series | Stratix II |
| Logic Elements / Cells | 179400 |
| Number of LABs / CLBs | 8970 |
| Total RAM Bits | 9383040 |
| Number of I/O | 1170 |
| Voltage - Supply | 1.15 V to 1.25 V |
| Supplier Device Package | 1508-FBGA, FC (40x40 mm) |
| 패키지 / 케이스 | 1508-BBGA, FCBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to 85C (TJ) |
| Speed Grade | C5 |
| Embedded Multipliers | 96 (18x18) |
| Number of PLLs | 12 |
| Lead-Free / Pb-Free Designator | Yes (-N suffix) |
| Product Status | Obsolete (last-time-buy exhausted at most distributors) |
EP2S180F1508C5N 1508-bbga, fcbga 핀 구성 가이드
EP2S180F1508C5N(1508-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S180F1508C5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S180F1508C5N 적합 용도: 6 애플리케이션s: High-End ASIC Prototyping and Emulation, Software Defined Radio (SDR) Baseband, High-Definition Video Processing Pipelines, Telecom Line-Card and Packet Processing, Military Signal-Intelligence and Radar Front-End, Medical Imaging and Diagnostic Equipment.
High-End ASIC Prototyping and Emulation
The EP2S180F1508C5N is well suited to ASIC prototyping and in-circuit emulation thanks to its 179400 logic elements, 9383040 bits of TriMatrix embedded memory, and 96 18x18 hardware multipliers. Combined with 1170 user I/O it can map multi-million-gate ASICs partition by partition with high utilisation. Designers place the device in the same 1508-FBGA footprint they would use for production silicon, so the prototype board validates both logic and IO at full speed. The C5 speed grade provides the fmax headroom needed to run emulation at near-real-time ASIC clock rates.
추천
Software Defined Radio (SDR) Baseband
SDR baseband processing requires wide datapaths, abundant block-RAM for FIR filters and FFT working buffers, and high I/O bandwidth to ADCs/DACs. The EP2S180F1508C5N's 9383040 bits of true dual-port memory directly absorb 1024- to 4096-point FFT bins without external SRAM, and its 96 dedicated 18x18 multipliers deliver the GMACs needed for multi-channel QAM demodulation. 1170 user I/O support multi-lane LVDS to ADC/DAC interfaces and DDR2 external memory. The C5 speed grade keeps the fabric above 350 MHz for parallel filter chains.
추천
High-Definition Video Processing Pipelines
Broadcast-grade video processing (H.264/AVC and HEVC encoder front-ends, multi-stream transcoders, video wall controllers) needs both massive parallel datapaths and large line/frame buffers. The EP2S180F1508C5N provides 9.4 Mbit of embedded RAM that holds several full HD video lines plus motion-estimation windows, while its 96 18x18 multipliers accelerate DCT/IDCT and integer-pixel ME kernels at 4K/60p rates. 1170 user I/O expose multiple HDMI/SDI/DisplayPort receive and transmit channels simultaneously. The 1508-FBGA package provides the signal integrity required for LVDS at hundreds of MHz.
추천
Telecom Line-Card and Packet Processing
Carrier-grade line cards (OC-768/STM-256 framers, 10G/40G packet processors, DPI engines) require large routing tables, deep packet buffers, and high I/O counts. The EP2S180F1508C5N's 9383040 bits of block RAM hold 64K+ IPv4 routing entries and 8K-deep packet headers, while its 1170 I/O drive SFI-4.1 / XAUI / Interlaken interfaces to network PHYs. The 12 PLLs synthesize the multiple clock domains typical in telecom designs (line, fabric, memory, fabric-to-backplane). The C5 speed grade is required to close timing on 312 MHz Interlaken LAIs.
추천
Military Signal-Intelligence and Radar Front-End
Electronic-warfare and radar front-end pre-processors must handle gigasample-per-second ADC streams with deterministic latency. The EP2S180F1508C5N's 1170 LVDS-capable user I/O can sink multi-channel 16-bit ADCs at hundreds of MHz, while the 96 18x18 multipliers implement pulse-compression and FFT kernels at real-time rates. The 9.4 Mbit of block RAM holds windowed sample buffers and FFT bins. The industrial-grade 0C-85C temperature range fits most mil/aero ground and shipboard environments; for harsh-environment screening, the EP2S180F1508C3NAA (AA screened) variant is the drop-in.
추천
Medical Imaging and Diagnostic Equipment
CT, MRI, ultrasound, and digital X-ray imagers rely on real-time beamforming, FIR filtering, and image reconstruction. The EP2S180F1508C5N's 179400 logic elements and 96 dedicated 18x18 multipliers handle 64-channel ultrasound beamforming with sufficient headroom for harmonic imaging, while the 9.4 Mbit of embedded RAM stores per-channel delay-and-sum line buffers. The 1170 user I/O accept raw LVDS data from multi-element transducer arrays. Industrial 0C-85C operation and Pb-free RoHS compliance suit medical-grade safety and reliability standards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S180F1508C5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S180F1508C5 | EP2S180F1508C4N | EP2S180F1508C3N | EP2S180F1508C3NAA | EP2S130F1508C5N |
|---|---|---|---|---|---|---|
| Package | 1508-FBGA, FC (40x40) | 1508-FBGA, FC (40x40) - same | 1508-FBGA, FC (40x40) - same | 1508-FBGA, FC (40x40) - same | 1508-FBGA, FC (40x40) - same | 1508-FBGA, FC (40x40) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 179400 | 179400 | 179400 | 179400 | 179400 | 130000 |
| Speed Grade | C5 | C5 | C4 | C3 | C3 + AA screening | C5 |
| Lead-Free (Pb-free) | Yes (-N suffix) | No (SnPb) | Yes | Yes | Yes | Yes |
주요 차별점
- Pb-free / RoHS compliant for modern assembly lines (vs EP2S180F1508C5 (SnPb))
- C5 speed grade for highest Stratix II fmax (vs EP2S180F1508C4N (C4 speed))
- Highest-density Stratix II device (179400 LE) (vs EP2S130F1508C5N (130000 LE))
설계 노트
Estimated: at quiescent (typical configuration, 25% toggle, 25C) the EP2S180F1508C5N draws approximately 1.5-2.5 A from its 1.15-1.25 V core rail, plus per-bank VCCIO and VCCPD currents. Provide a 4-layer PCB with a solid power plane for VCCINT and at least 22 uF of bulk ceramic plus 0.1 uF high-frequency bypass per quadrant of the 1508-FBGA. Strap decoupling caps on the package's underside if possible, and add tantalum or polymer bulk caps near the supply pins to absorb di/dt transients during configuration and PLL lock.
The 1508-FBGA in 40x40 mm body has a fine ball pitch (typically 1.0 mm). Use a stack-up with 0.2-0.3 mm dielectric between top signal and inner power planes for 50 ohm single-ended controlled impedance. Match the breakout length within each I/O bank to within 200 mil to avoid skew on DDR/DDR2 interfaces. Use microvia-in-pad if board thickness permits to escape the inner rows of the BGA; otherwise dog-bone fan-out is acceptable but signal integrity will degrade above 500 MHz.
Estimated: at 5 W dissipation the junction temperature rises roughly 12-18 C above ambient on a 4-layer PCB with 1 oz copper. Above 10 W, forced airflow (>=200 LFM) or a heat spreader bonded to the package lid is required. For >20 W designs, attach a finned heatsink with thermal-interface material (TIM) to the FCBGA lid, and consider redesigning the PCB stack-up to improve theta_JA. The EP2S180F1508 family has no exposed thermal pad - heat is conducted through the lid and PCB copper.
Do not hot-swap the EP2S180F1508C5N on a powered board; the absence of power-on-reset sequencing on each rail can cause latch-up. Power VCCINT first, then VCCPD, then VCCIO in strict monotonic order with slew-rate limited by the regulator. Failure to provide a monotonic VCCINT ramp can leave the device in an undefined configuration state, requiring a reconfiguration via nCONFIG. Always strap MSEL pins with 4.7k pull-ups or pull-downs before power-up; floating MSEL pins cause configuration failures.
Place decoupling capacitors on the BGA's underside if using microvia-in-pad, otherwise place them on the opposite side directly under the ball with 6-10 mil via stubs. Keep LVDS and DDR traces on inner stripline layers; route high-speed serial links on the top microstrip layer with reference to a continuous ground pour. Add ground stitching vias every lambda/10 around signal vias to suppress parallel-plate resonances between power and ground planes.
규정 준수 정보
RoHS-compliant per the -N suffix convention of Altera/Intel part numbering (Pb-free ball finish). Reach, halogen-free and conflict-minerals declarations were not present in the verified web data and are marked unknown. AEC-Q100 is not applicable - the device is an FPGA with operating temperature 0C to 85C (TJ), not an automotive-qualified part.