EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel
부품 번호: EP2SGX30CF780C5 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $310.2 | $310.20 |
| 10 | $295 | $2,950.00 |
| 50 | $280 | $14,000.00 |
| 100 | $268 | $26,800.00 |
| 500 | $248 | $124,000.00 |
EP2SGX30CF780C5 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that implements arbitrary digital logic through programmable logic blocks (LEs/ALMs), interconnect, and I/O cells, occupying the same role as a custom ASIC but with field-reprogrammable flexibility. Stratix II GX FPGAs specifically embed multi-gigabit transceivers alongside the general-purpose fabric, making them part of the programmable logic family hierarchy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> high-speed-transceiver-enabled FPGA -> embedded DSP + transceiver FPGA.
Key features include 33880 logic elements, 1694 LABs, embedded multiplier blocks and M512/M4K/M-RAM memory tiers, four phase-locked loops for clock management, and high-speed transceivers with embedded CDR supporting common serial standards. The device operates at a core voltage of 1.2 V and supports extended industrial temperature grades, with the "C5" suffix indicating the -5 speed grade and "C" indicating commercial temperature.
Stratix II GX uses an adaptive logic module (ALM) architecture that combines LUT-based and register-rich operation, allowing a single ALM to implement wider functions than 4-input LUT predecessors, improving logic efficiency. The device integrates hard IP for PCI Express, Gigabit Ethernet, Serial RapidIO, and other serial protocols, plus dedicated DSP blocks for fixed- and floating-point arithmetic.
Typical applications include high-end communication backplanes, test and measurement instrumentation, broadcast video processing, medical imaging accelerators, and military/aerospace signal processing. The combination of high logic density and integrated transceivers makes this part well-suited for protocol bridging, channelized DSP, and OTU/SONET framer designs.
When designing with this part, designers should follow Altera/Intel Stratix II GX board design recommendations: maintain matched-length differential pairs for the high-speed serial links, allocate sufficient decoupling near every VCC/VCCA/VCCP rail, and validate signal-integrity through IBIS-AMI simulation before committing to layout.
This page synthesizes distributor pricing, drop-in same-family alternatives, and Stratix II GX design notes that are not duplicated in the manufacturer datasheet handbook.
드롭인 대체품: EP2SGX30CF780C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX30CF780C5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Transceivers, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX30CF780C4N
✅ 드롭인✓ 재고 있음
$379 / 개
데이터시트 보기 →EP2SGX30CF780C4
✅ 드롭인✓ 재고 있음
$138 / 개
데이터시트 보기 →EP2SGX30CF780C3N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2SGX30CF780C3NGB
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →EP2S30F672C5N
✅ 드롭인✓ 재고 있음
$450 / 개
데이터시트 보기 →EP2SGX30CF780C5 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements | 33880 |
| Logic Array Blocks (LABs) | 1694 |
| Maximum User I/O Pins | 361 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | -5 |
| 패키지 | 780-ball FBGA |
| 실장 유형 | Surface Mount |
| Transceivers | Multi-gigabit transceivers with embedded CDR |
| PLLs | 4 |
| Embedded Memory | M512 / M4K / M-RAM blocks (totals per datasheet) |
| DSP Blocks | Embedded multiplier/DSP blocks |
EP2SGX30CF780C5 780-ball fbga 핀 구성 가이드
EP2SGX30CF780C5(780-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX30CF780C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX30CF780C5 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Backplane Bridging, Channelized DSP for Telecom Framers, Test and Measurement Instrumentation, Broadcast Video Processing, Medical Imaging Acceleration, Aerospace and Defense Signal Processing.
Multi-Gigabit Serial Backplane Bridging
The EP2SGX30CF780C5 integrates hard multi-gigabit transceivers with embedded CDR and 33880 logic elements, making it well-suited for protocol bridging across multi-gigabit serial backplanes. Placed between line-card SERDES and a switch ASIC, the FPGA can map XAUI/SXAUI/Serial RapidIO/PCI Express links, isolate clock domains with the four on-chip PLLs, and absorb channel-bonding state machines in dedicated logic. The 1.2 V core, 361 user I/Os, and 780-ball FBGA package provide the routing density needed for 8-12 lane serial links with matched-length fan-out. Estimated aggregate transceiver throughput exceeds 20 Gbps full duplex on the high-speed serial pins.
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Channelized DSP for Telecom Framers
The 1694 LABs and embedded DSP blocks of the EP2SGX30CF780C5 support channelized DSP for OTU/SONET framers and base-station backhaul. Designers typically instantiate hundreds of 18x18 multipliers and dual-clock FIFOs to demap STS/VC containers, while the transceivers receive OC-192/10G tributaries. With 1.2 V core operation, dynamic power scales cleanly with utilization, and the 780-ball FBGA exposes enough pins for 32-bit external memory buses. Quartus Prime DSP Builder IP blocks integrate directly, and the part can host multiple instances of the Framer/MAC IP for sub-rate mapping.
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Test and Measurement Instrumentation
The combination of high logic density, 361 user I/Os, and embedded transceivers makes the EP2SGX30CF780C5 a strong fit for protocol-aware test instruments such as logic analyzers, BERT platforms, and oscilloscope acquisition front-ends. The FPGA aggregates high-speed serial samples, runs pattern-detect and eye-monitoring DSP in the LAB fabric, and exposes trigger/result pins over the abundant user I/O. Designers typically pair it with external DDR2 memories via soft memory controllers. The -5 speed grade supports the highest internal Fmax in the commercial range, easing timing closure for 250-300 MHz datapaths.
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Broadcast Video Processing
The EP2SGX30CF780C5 is used in broadcast video routing, format conversion, and overlay processing engines where SDI/HDMI/DVI ingest feeds are processed through large line buffers and color-space converters. The 1694 LABs and on-chip RAM blocks (M512/M4K/M-RAM) hold multi-line video frames at full raster, while the abundant user I/Os carry parallel video buses and control GPIOs. Stratix II GX transceivers accept 3G-SDI/HD-SDI directly, simplifying board layout. The commercial temperature grade suits studio and outside-broadcast enclosures.
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Medical Imaging Acceleration
CT, MRI, ultrasound, and digital X-ray front-ends use FPGAs like the EP2SGX30CF780C5 to run beamformers, back-projectors, and FFT pipelines at line-rate. The 33880 logic elements and embedded DSP blocks implement parallel multiply-accumulate trees for beamforming channels, while the transceivers shuttle raw A/D samples at multi-Gbps rates from the front-end ASICs. The 780-ball FBGA offers sufficient I/O for 16-32 lane LVDS fan-in from the A/D bank. Medical-grade design houses typically run extended temperature and reliability screening on top of the standard commercial grade.
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Aerospace and Defense Signal Processing
The EP2SGX30CF780C5 serves in aerospace and defense systems as a software-defined radio (SDR) baseband processor, electronic-warfare channelizer, or radar pre-processor. With 33880 logic elements, the part can host several DDC/DUC channels plus crypto accelerators, while the transceivers deliver digitized IF/RF to the FPGA from wideband A/D converters. Designers use the four PLLs to derive multiple sample-rate clocks, and the abundant user I/Os to interface to legacy parallel MIL-STD-1553/ARINC buses. The commercial temperature grade supports many airborne and ground-mobile platforms; -40C to +100C variants exist as separate order codes.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX30CF780C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX30CF780C4N | EP2SGX30CF780C4 | EP2SGX30CF780C3N | EP2SGX30CF780C3NGB | EP2S30F672C5N |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 672-pin FBGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -5 (C5) | -4 (C4N) | -4 (C4) | -3 (C3N) | -3 (C3NGB) | -5 (C5N) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
주요 차별점
- Pin-compatible same-die across speed grades (vs EP2SGX30CF780C4N)
- Highest density at FBGA-780 footprint (vs EP2S30F672C5N)
- Integrated multi-gigabit transceivers (vs EP2C8F256C8)
설계 노트
Estimated: core current at full utilization (33880 LEs, all transceivers active, ~70% toggle rate) typically draws 1.5 to 2.5 A from VCCINT. Use a switching regulator with at least 25% current headroom for transients, followed by a ferrite + bulk + 0.1 uF + 0.01 uF decoupling stack near every VCC/VCCA/VCCP/VCCPD ball cluster. Reference the Stratix II GX handbook power distribution chapter for the recommended PCB stackup.
The high-speed serial transceiver pins require matched-length differential routing within 150 mil delta for lanes under 6 Gbps and tighter (under 50 mil) for 10 Gbps. Maintain 100 ohm differential impedance with ground-reference stitching vias every 200 mil. Ac-coupling capacitors sit within 250 mil of the FPGA ball. Keep SERDES routes clear of parallel noisy buses; use guard traces or shielding where buses cross.
Estimated: worst-case Stratix II GX power for this density with all transceivers active reaches 10-15 W, requiring thermal relief on the FBGA. Use thermal vias in the BGA land pattern and at least four thermal vias directly under the die-up package center. Pair with a heatsink or airflow above 200 LFM for production deployment; the 780-ball FBGA has no integrated heat spreader.
Configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) must be pulled according to the chosen configuration scheme (AS, PS, JTAG, or FPP) - misconfigured MSEL will keep the device in reset. Power sequencing requires VCCINT, then VCCA, then VCCIO in a strict order, or the device may latch up. Always re-run Quartus Prime fitter and timing analysis after swapping between -5 and -4/-3 speed grades even on the same die.
규정 준수 정보
Compliance data not present in the provided web search results. Refer to the Intel/Intel-Altera material declaration for the EP2SGX30 family for authoritative RoHS, REACH, and lead-free status. AEC-Q100 is not applicable to FPGAs in the automotive discrete-component sense; refer to Intel AEC-Q100 qualification records separately.