EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
부품 번호: EP2SGX90EF1152C3ES ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2410 | $241,000.00 |
| 250 | $2210 | $552,500.00 |
| 500 | $2050 | $1,025,000.00 |
EP2SGX90EF1152C3ES 개요
An FPGA is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM, in contrast to ASICs whose function is fixed at tape-out. Stratix II GX sits in the hierarchy: programmable logic device -> FPGA -> high-speed-transceiver-equipped FPGA -> Altera Stratix II GX family, designed for prototyping, low-volume production, and designs that benefit from hardware-level parallelism combined with 6.375 Gbps class serial links.
Key features include 4,520,448 bits of embedded RAM (approximately 4.5 Mbit, distributed + block), dedicated DSP blocks for fixed/floating-point arithmetic, 12 high-speed transceivers with embedded CDR, support for PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet hard IP, and a robust clock management network with PLLs covering the device edge and core. The 1152-BBGA package exposes 558 user I/O across 24 user-I/O banks, providing flexible single-ended and differential signaling for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards.
Typical applications include 10 Gbps-class data aggregation switches, broadcast video format converters, radar and software-defined radio digital front-ends, ASIC prototyping for communications SoCs, and PCIe Gen1 endpoint cards. The transceiver-rich architecture also suits test-and-measurement chassis that aggregate many Gbps lanes into a single FPGA for real-time DSP.
드롭인 대체품: EP2SGX90EF1152C3ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90EF1152C3ES (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, Total RAM Bits, Core Voltage, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90EF1152C3
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP2SGX90EF1152I3ES
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2SGX60EF1152C5N
✅ 드롭인✓ 재고 있음
$3300 / 개
데이터시트 보기 →EP2SGX60EF1152C4
✅ 드롭인✓ 재고 있음
$1067.86 / 개
데이터시트 보기 →EP2AGX125EF1152I5
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2SGX90EF1152C3ES 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Process Node | 90 nm |
| Logic Elements | 90,960 |
| Embedded Memory | 4,520,448 bits (approx. 4.5 Mbit) |
| User I/O Pins | 558 |
| 패키지 | 1152-BBGA (FineLine BGA, 35x35 mm) |
| Speed Grade | C3 |
| Temperature Grade | Commercial Extended (-40 C to +100 C) |
| Core Voltage | 1.5 V (Enhanced, 'E' suffix) |
| High-Speed Transceivers | Up to 12 channels (per Stratix II GX family) |
| Transceiver Data Rate | Up to 6.375 Gbps per channel (family spec) |
| DSP Blocks | Yes, dedicated 18x18 multipliers and accumulators |
| User I/O Banks | 24 (per package datasheet) |
| Configuration | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2SGX90EF1152C3ES 1152-bbga (fineline bga, 35x35 mm) 핀 구성 가이드
EP2SGX90EF1152C3ES(1152-bbga (fineline bga, 35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90EF1152C3ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90EF1152C3ES 적합 용도: 6 애플리케이션s: 10 Gbps Data Aggregation Switch, Broadcast Video Format Converter, Software-Defined Radio Digital Front-End, ASIC Prototyping Platform, PCIe Endpoint Card, Test & Measurement Chassis Backplane.
10 Gbps Data Aggregation Switch
The EP2SGX90EF1152C3ES fits 10 Gbps-class aggregation switch line cards because its 12 multi-gigabit transceivers each deliver up to 6.375 Gbps, enabling XAUI, KR, and Serial RapidIO port aggregation. With 90,960 logic elements the FPGA can implement a non-blocking 12-port switch fabric plus management plane, while 4.5 Mbit of embedded RAM provides deep packet buffering. The 558 user I/O expose ample LVDS/LVCMOS lanes for backplane SERDES coordination and board-level PHY glue. Power budget: estimate ~10 W typical at full transceiver utilization, which requires the 35x35 mm FBGA thermal pad to be soldered to a multi-layer PCB with thermal vias for sustained operation. Compared with newer Stratix IV/V parts the EP2SGX90 is preferred when firmware and IP have already been validated against the Stratix II GX transceiver hard IP block.
추천
Broadcast Video Format Converter
Broadcast video routers and format converters benefit from the EP2SGX90EF1152C3ES because the 90,960 logic elements provide the parallel DSP throughput needed for real-time SDI-to-HDMI or HD-SDI cross-point switching at 3 Gbps rates. The 4.5 Mbit embedded memory holds line buffers for de-interlacing and frame-rate conversion without external SRAM. The 12 multi-gigabit transceivers enable SMPTE 424M/425M coaxial or fiber I/O, while the 558 user I/O support multiple parallel video buses and control planes. Commercial-extended -40 C to +100 C temperature grade is essential for outdoor broadcast cabinets and mobile production trucks. Latency: typically <1 ms end-to-end for a 1080p60 path, well within broadcast tolerance. Alternative FPGAs without transceiver hard IP would force external PHYs and add 200+ ms latency.
추천
Software-Defined Radio Digital Front-End
The EP2SGX90EF1152C3ES is well matched to software-defined radio (SDR) digital front-end cards used in radar and wireless base stations. The 12 transceivers can digitize multiple antenna streams up to 6.375 Gbps each, while the dedicated DSP blocks perform digital down-conversion, channelization, and beamforming on 18x18 multiplications per clock. The 4.5 Mbit embedded RAM supports windowing and overlap-save FFT buffers. The 558 user I/O provide parallel LVDS connections to ADC/DAC mezzanines like the ADC08D1520 or DAC5682z. Power dissipation is dominated by the transceiver block and can reach 8-12 W, requiring a thermal pad soldered to the 1152-BBGA bottom-side and a heat spreader for sustained operation. Compared with ASIC-based SDR, the FPGA enables rapid protocol retargeting across LTE, WiMAX, or proprietary waveforms.
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ASIC Prototyping Platform
ASIC prototyping platforms often adopt the EP2SGX90EF1152C3ES because its 90,960 logic elements approximate the gate count of mid-range communication SoCs and its multi-gigabit transceivers emulate PHY interfaces. Multiple devices can be wired together using LVDS or SERDES for large SoC prototypes. The 1152-BBGA package exposes 558 user I/O, allowing each FPGA to map thousands of prototype signals to external logic analyzers or memory cards. Quartus II software provides time-driven synthesis for repeatable prototype timing. The commercial-extended temperature grade suits benchtop validation in climate-controlled labs. Compared with array-based prototyping (e.g. structured ASICs), the FPGA provides instant turnaround at the cost of higher per-unit price and 5-10x lower clock rates than the final ASIC.
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PCIe Endpoint Card
The EP2SGX90EF1152C3ES integrates PCIe Gen1 x1/x4/x8 hard IP, eliminating the need for an external bridge chip on endpoint cards. The 12 transceivers also support SATA, Serial RapidIO, and XAUI alongside PCIe, enabling multi-protocol endpoint designs. The 558 user I/O provide ample DMA channels, interrupt lines, and parallel side-band interfaces. 4.5 Mbit of embedded memory buffers PCIe transactions before downstream processing. The 1152-BBGA package requires a high-layer-count PCB (8+ layers) with controlled-impedance routing for the PCIe lanes and a robust ground plane for BGA thermal relief. Compared with discrete PCIe bridge + ASSP solutions, the integrated hard IP reduces BOM, board area, and BOM risk. Designers targeting PCIe Gen2 should migrate to Arria II GX (e.g. EP2AGX125EF1152).
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Test & Measurement Chassis Backplane
Test-and-measurement chassis (logic analyzers, protocol testers, digitizer cards) leverage the EP2SGX90EF1152C3ES to aggregate many high-speed channels into a single processing FPGA. The 12 transceivers at 6.375 Gbps each support protocols like USB 3.0, SATA II, and PCIe Gen1 for instrument backhaul, while the 90k logic elements perform real-time pattern matching, eye diagram analysis, or DSP-based signal integrity processing. The 4.5 Mbit embedded RAM holds deep acquisition buffers before DMA to host. The commercial-extended temperature grade is suitable for laboratory and field-portable test gear. Power consumption scales linearly with active transceivers and can hit 12 W in full-load bench testing. Compared with purpose-built T&M ASICs, the FPGA enables reusable firmware across product generations.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90EF1152C3ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90EF1152C3 | EP2SGX90EF1152I3ES | EP2SGX60EF1152C5N | EP2SGX60EF1152C4 | EP2AGX125EF1152I5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same | 1152-FBGA - similar |
| Family | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX | Arria II GX |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 40 nm |
| Logic Elements | 90,960 | 90,960 | 90,960 | 60,000 approx (-34%) | 60,000 approx (-34%) | 125,000 (+37%) |
| Embedded Memory | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | Lower per family spec | Lower per family spec | Higher (Arria II GX spec) |
| User I/O | 558 | 558 | 558 | 558 | 558 | Comparable (per Arria II GX spec) |
| Speed Grade | C3 | C3 | I3 (slower) | C5 (fastest) | C4 | I5 (Arria II GX grade) |
| Temperature Grade | Commercial Extended (-40 to +100 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Commercial | Commercial | Industrial |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Discontinued (Arria II GX end-of-life) |
주요 차별점
- 12 multi-gigabit transceivers at 6.375 Gbps integrated with PCI Express hard IP (vs EP2S90F1508C4 (Stratix II without GX))
- Commercial-extended temperature range (-40 to +100 C) for outdoor and industrial chassis (vs EP2SGX90EF1152C3 (commercial 0 to +85 C))
- 90,960 logic elements with 4.5 Mbit embedded memory for high-density DSP and buffering (vs EP2SGX60EF1152C5N (60k LE variant))
설계 노트
Estimated: at full transceiver utilization (12 channels active) plus 50% logic utilization, the EP2SGX90EF1152C3ES dissipates approximately 10-12 W. The 1152-BBGA package has a large central thermal pad that MUST be soldered to the PCB with an array of thermal vias to a back-side copper pour. Without proper thermal relief, junction temperature can exceed 100 C in still air, triggering thermal throttling or device damage. For chassis designs exceeding 8 W dissipation, attach a low-profile heat spreader over the package top.
The 1152-BBGA package uses 1.0 mm ball pitch and a 35x35 mm body, requiring a 4+4 or higher PCB layer stack-up to fan out signals. Inner layers must be solid ground/power planes to provide controlled-impedance references for the multi-gigabit transceiver channels (100 ohm differential). Use 50 ohm single-ended impedance for general-purpose user I/O and 90 ohm differential for LVDS pairs. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors on every power pin within 200 mil trace length. BGA breakout routing requires microvia-in-pad or sub-1-mil trace/space for the inner rows; standard 4-mil design rules will not fit.
Common pitfalls when designing with the EP2SGX90EF1152C3ES include: (1) mis-identifying the C3 vs I3 vs C4 vs C5 speed grade in the Quartus II device selection - this affects timing closure and fMAX; (2) assuming 1.5 V VCC can be supplied from a generic LDO - the Enhanced (E suffix) core requires tight 1.5 V regulation with <50 mV ripple; (3) forgetting to configure the MSEL pins for the correct configuration scheme (Fast Passive Parallel vs Fast Active Serial); (4) leaving the nCONFIG or nSTATUS pins floating - they require external 4.7 kohm pull-up resistors. Always read the Stratix II GX Device Handbook chapter on configuration before PCB bring-up.
Transceiver channel placement: assign the highest-rate channels to the FPGA's column I/O nearest the package edge to minimize PCB trace length and crosstalk. Maintain 100 ohm differential impedance with length matching within 5 mils for each channel pair. Keep SERDES traces away from noisy power switching nodes by at least 5x the trace-to-trace spacing. Reference plane must be continuous beneath all SERDES traces - splits cause severe signal-integrity degradation. The 24 user-I/O banks each have independent VCCIO rails; isolate banks with different I/O standards to prevent supply-noise coupling.
규정 준수 정보
RoHS compliant per Intel product page. AEC-Q100 not applicable for commercial-extended grade FPGA. Halogen-free status not explicitly stated in available data.
