EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
부품 번호: EP2SGX60EF1152C3 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 25 | $2480 | $62,000.00 |
| 50 | $2350 | $117,500.00 |
| 100 | $2210 | $221,000.00 |
EP2SGX60EF1152C3 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits through a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. In the system hierarchy, FPGAs sit above general-purpose microcontrollers and below ASICs in terms of design flexibility, offering hardware-level parallelism and reconfigurability for applications requiring custom high-speed data paths, signal processing, or protocol bridging. Stratix II GX specifically targets communications infrastructure where multi-gigabit serial transceivers eliminate the need for external PHY chips.
Key differentiators of the EP2SGX60EF1152C3 include 36 embedded transceivers supporting PCI Express, Serial RapidIO, XAUI, CEI-6G, and Custom (GIGE) standards; 252 (18x18) multipliers for high-throughput DSP; an 8-input adaptive logic module (ALM) architecture that improves logic utilization by ~25% versus the prior Stratix generation; and dynamic phase alignment on transceivers to simplify PCB layout for high-speed serial channels. The 35x35 mm FC-FBGA-1152 footprint exposes a wide 534 I/O count plus 20 dedicated transceiver channels plus 16 additional high-speed differential pairs, ideal for systems requiring both high I/O density and multi-gigabit serial connectivity.
Typical applications include high-end telecommunications line cards with multi-protocol backplane aggregation, broadcast video routers using SDI/HD-SDI/3G-SDI, military radar and signal processing, and PCI Express Gen1 endpoint designs. The 6.375 Gbps transceiver ceiling and 36-channel aggregation make this device well-suited for systems previously built with multiple FPGAs plus external transceivers. Designers can implement line-side SERDES, crossbar switching, and protocol bridging within a single chip, reducing board area and BOM cost.
Design considerations for the EP2SGX60EF1152C3 include careful PCB stackup planning for the 1152-ball BGA, dedicated transceiver power filtering, Quartus II software support, and the need for configuration memory (EPCS) for non-volatile bitstream storage. The device requires multiple supply rails (1.2 V core, 2.5 V/3.3 V I/O, and dedicated transceiver analog supplies VCCA, VCCP, VCCR). Thermal management via heatsink or forced airflow is recommended because Stratix II GX can dissipate 15-25 W in typical operating conditions.
This page synthesizes distributor pricing, package dimensions, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for the EP2SGX60EF1152C3.
드롭인 대체품: EP2SGX60EF1152C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX60EF1152C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, Package Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX60EF1152C3N
✅ 드롭인✓ 재고 있음
$2195 / 개
데이터시트 보기 →EP2SGX60EF1152I3N
✅ 드롭인✓ 재고 있음
$1195 / 개
데이터시트 보기 →EP2SGX60EF1152C4N
✅ 드롭인✓ 재고 있음
$1350 / 개
데이터시트 보기 →EP2SGX60EF1152C5N
✅ 드롭인✓ 재고 있음
$3300 / 개
데이터시트 보기 →EP2SGX60E1152C
✅ 드롭인✓ 재고 있음
$1218 / 개
데이터시트 보기 →EP2SGX60EF1152C3 최대 정격 & 전기적 특성
| Device Family | Stratix II GX |
| Logic Elements | 60,440 |
| LABs / CLBs | 3,022 |
| User I/Os | 534 |
| Total Memory Bits | 2,544,192 |
| Number of Transceivers | 36 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Internal Frequency | 717 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Multipliers (18x18) | 252 |
| 패키지 | 1152-ball FC-FBGA (35 x 35 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (Commercial, C3 suffix) |
| Configuration Memory Interface | EPCS serial configuration devices |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP2SGX60EF1152C3 1152-ball fc-fbga (35 x 35 mm) 핀 구성 가이드
EP2SGX60EF1152C3(1152-ball fc-fbga (35 x 35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX60EF1152C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX60EF1152C3 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Broadcast Video Routing, Military Radar and Signal Processing, PCI Express Endpoint Designs, Test and Measurement Instrumentation, Industrial Control and High-Speed Data Acquisition.
Telecommunications Line Cards
The EP2SGX60EF1152C3 fits telecom line-card designs because its 36 transceivers at 6.375 Gbps natively support multi-protocol aggregation including XAUI, Serial RapidIO, and PCI Express Gen1 on a single die. The 60,440 LEs and 252 (18x18) hardware multipliers enable ingress/egress packet processing, traffic shaping, and FEC encoding without external DSP chips. Placed on the line card with its 534 user I/Os, the FPGA bridges 36 optical SFP+ or backplane SERDES lanes to the fabric ASIC, while the 2,544,192 bits of embedded memory buffer bursts and queue traffic. The 1.2 V core and dedicated analog transceiver supplies (VCCA, VCCR, VCCP) require isolated LDO rails, and designers must follow the Intel reference design for channel loss compensation using the dynamic phase-alignment block on each transceiver.
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Broadcast Video Routing
The EP2SGX60EF1152C3 is well-suited for SDI/HD-SDI/3G-SDI video routers because its 36 transceivers handle the 270 Mbps to 2.97 Gbps serial video rates natively, replacing external SDI equalizers and cable drivers. The 60K logic elements support 100x100 or larger non-blocking crosspoint matrices, while 2.5 Mbits of embedded memory provide frame buffering for multiviewer and video-wall applications. Placed between the SDI inputs and HDMI output up-converter, the FPGA performs clock recovery, reclocker functions, and embedded audio demux in a single chip. Designers can implement ANC data extraction and HDR metadata insertion without external processors. The 1152-ball FC-BGA requires a 10-layer PCB with 1 mm BGA pitch microvia fan-out, but the high I/O count enables 36 SDI ports plus 8 HDMI outputs in a single device.
추천
Military Radar and Signal Processing
The EP2SGX60EF1152C3 supports military radar DSP applications because its 252 (18x18) hardware multipliers deliver 2-4 TMACS performance for FFT-based pulse compression and beamforming. The 36 transceivers at 6.375 Gbps aggregate digital receiver channels from multiple ADC front-ends, eliminating external SERDES chips. With 2.5 Mbits of embedded block RAM, designers can implement systolic FIR filters and complex mixers that operate on real-time radar data streams. The FPGA sits between the ADC array and the DSP processor cluster, performing first-stage digital downconversion and matched filtering. The industrial temperature variant (EP2SGX60EF1152I3N) extends operating range to -40C to +100C, which is critical for mil/aero deployment in unpressurized enclosures.
추천
PCI Express Endpoint Designs
The EP2SGX60EF1152C3 accelerates PCIe Gen1 endpoint designs because the integrated transceivers include a hard IP block for PCI Express, eliminating the need for soft IP and saving up to 15K LEs. The device supports x1, x2, x4, and x8 lane configurations up to Gen1 (2.5 Gbps) rates. Designers place the FPGA as a bridge between a host CPU's PCIe slot and a custom data acquisition or storage subsystem, using the remaining 60K LEs for protocol conversion, DMA engines, and high-speed data path logic. The 534 user I/Os handle auxiliary control signals and external memory bus connections, while the 2.5 Mbits of block RAM serve as buffer space for DMA transactions.
추천
Test and Measurement Instrumentation
The EP2SGX60EF1152C3 is ideal for high-end test equipment because its 36 transceivers at 6.375 Gbps and 60K LEs support arbitrary waveform generation, pattern triggering, and protocol-aware BERT (bit error rate tester) functions. The 252 hardware multipliers and 2.5 Mbits of block RAM enable real-time DSP for signal conditioning, FFT-based spectrum analysis, and adaptive equalization on received data streams. The FPGA sits between the front-end analog ASIC and the host processing CPU, performing sample-rate conversion and trigger logic at wire speed. Designers can use the 534 I/Os to fan out to multiple DUT (device under test) channels, and the commercial temperature grade (C3 suffix, 0C to +85C) is sufficient for laboratory environments.
추천
Industrial Control and High-Speed Data Acquisition
The EP2SGX60EF1152C3 fits industrial data acquisition systems because its 36 transceivers and 60K LEs support multi-channel ADC aggregation at rates up to 6.375 Gbps per channel. The 252 hardware multipliers perform real-time digital filtering, decimation, and FFT analysis on the incoming sample stream. Placed between high-speed ADCs and an industrial PC or embedded processor, the FPGA functions as a front-end digital signal conditioner and protocol bridge (e.g., XAUI to PCIe or Serial RapidIO). The 534 user I/Os support parallel ADC interfaces, GPIO control, and external memory bus connections. The industrial temperature variant extends deployment to factory-floor and outdoor enclosures where commercial-grade FPGAs would fail.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX60EF1152C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX60EF1152C3N | EP2SGX60EF1152I3N | EP2SGX60EF1152C4N | EP2SGX60EF1152C5N | EP2SGX60E1152C |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Transceivers | 36 channels @ 6.375 Gbps | 36 channels @ 6.375 Gbps | 36 channels @ 6.375 Gbps | 36 channels @ 6.375 Gbps | 36 channels @ 6.375 Gbps | 36 channels @ 6.375 Gbps |
| Speed Grade | C3 | C3N | I3N (industrial temp) | C4N | C5N | C (commercial, lead-finish variant) |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| User I/Os | 534 | 534 | 534 | 534 | 534 | 534 |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
주요 차별점
- Pin-compatible speed grade variants (vs EP2SGX60EF1152C4N / C5N)
- Industrial temperature grade in same package (vs EP2SGX60EF1152I3N)
- Cross-package modernization paths (vs Arria 10 GX / Stratix 10 GX)
설계 노트
The EP2SGX60EF1152C3 requires multiple supply rails per the manufacturer datasheet: VCCINT = 1.2 V (core), VCCIO = 1.2/1.5/1.8/2.5/3.3 V (I/O banks), VCCA/VCCR/VCCP dedicated analog transceiver supplies, and VCCPD for I/O pre-drivers. Power sequencing must follow the datasheet order to prevent latch-up damage. Each transceiver channel draws up to 90 mA from the analog rails; use isolated LDOs (e.g., separate PTH08T240W modules) for VCCA/VCCP/VCCR rather than tying them together with a single regulator. Decoupling requires 0.1 uF + 10 uF ceramic within 5 mm of every supply pin, plus 220 uF bulk near the regulator outputs.
Estimated: at 100% logic utilization with 36 transceivers at 6.375 Gbps, the EP2SGX60EF1152C3 dissipates 18-25 W. The FC-BGA-1152 package has theta_JA of approximately 8-12 C/W on a 12-layer PCB with thermal vias. Without a heatsink or 200 LFM airflow, the junction temperature could exceed the 125 C limit at 85 C ambient. Add a copper heat spreader or clip-on heatsink and ensure at least 50 thermal vias (0.3 mm diameter, 1.0 mm pitch) under the central die region. Monitor VCCINT current in production via the in-design SenseReg block to detect thermal runaway early.
The 1152-ball FC-FBGA at 1 mm pitch requires an 8-12 layer PCB with HDI microvia stack-up. Use a 1+6+1 or 2+10+2 microvia construction with sequential lamination. Trace escape between balls is challenging; allow 4 mil trace/space for the first layer breakout. Matched-length tuning of transceiver traces is mandatory: use Agilent ADS or Mentor HyperLynx to simulate insertion loss and skew. Reference the Intel Stratix II GX PCB Design Guidelines application note (AN-389) for stackup and trace geometry. Pinout is set in software via the Quartus II Pin Planner, but check the BSDL file for boundary-scan assignments.
Do not connect VCCA/VCCR/VCCP together with a single regulator; each must have separate decoupling. Do not exceed 1.2 V + 5% on VCCINT or latch-up will permanently damage the part. Configuration mode (AS, PS, JTAG, Fast Passive Parallel) must be selected via MSEL pins before power-up; a floating MSEL pin puts the device in an undefined state. Always use an external configuration memory (EPCS4/EPCS16/EPCS64) for production designs; JTAG-only configuration is for development only. Do not hot-plug the FC-BGA; the device requires a controlled power-up sequence. Programming files must be generated with the exact speed grade and temperature grade matching the silicon revision.
규정 준수 정보
RoHS and lead-free confirmed via Intel product environmental compliance. The C3 commercial variant is not AEC-Q100 qualified; the I3N industrial variant is the appropriate choice for automotive-grade applications requiring the AEC-Q100 standard.
