EP2SGX90FF1508C4N - 90k LE Stratix II GX FPGA 1508-FCBGA | Intel
부품 번호: EP2SGX90FF1508C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1680 | $42,000.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1500 | $750,000.00 |
EP2SGX90FF1508C4N 개요
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells. FPGAs occupy the position of ASIC-class parallel processing engines in the broader digital IC hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are defined by a hardware description language (HDL) bitstream that configures on-chip SRAM at every power-up, making them ideal for design iteration, low-volume production, and time-to-market-critical applications.
Key features include 4,548 LABs/CLBs, 4,520,448 bits of embedded RAM, dedicated DSP blocks for fixed- and floating-point math, embedded high-speed serial transceivers, and 650 general-purpose I/O pins. The device operates across industrial temperature grades and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL for mixed-voltage board integration.
Architecture-wise, the Stratix II GX fabric uses adaptive logic modules (ALMs) that pack combinational and registered logic into 8-input fracturable look-up tables, achieving higher logic density than the preceding Stratix family. Transceivers support multi-gigabit serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom serial links up to 6.375 Gbps, making the part well-suited to wired communications infrastructure.
Typical applications include wired communications line cards (multi-gigabit transceivers for backplanes and SFP+ interfaces), high-end test and measurement instrumentation, radar and signal-processing front ends, ASIC prototyping, and DSP accelerator cards. The 1508-FCBGA package supplies the pin density required for the 650 I/Os plus dedicated transceiver and supply balls.
When designing with this device, follow the Stratix II GX pin connection guidelines for unused transceiver channels (tie to defined reference voltages) and provide sufficient decoupling on every VCC rail. Bitstream security should be enabled via the AES-128 programming file option for production systems to prevent unauthorized configuration readback.
드롭인 대체품: EP2SGX90FF1508C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90FF1508C4N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Total RAM Bits, Package Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90FF1508C4ES
✅ 드롭인✓ 재고 있음
$1095 / 개
데이터시트 보기 →EP2SGX90FF1508C4
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2SGX90FF1508C3N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2SGX90FF1508
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2SGX130GF1508C4N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP2SGX90FF1508C4N 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements (LE) | 90960 |
| LABs/CLBs | 4548 |
| Total RAM Bits | 4520448 |
| Number of I/O | 650 |
| 동작 온도 | 0C to +85C (commercial grade per 'C' suffix) |
| 패키지 / 케이스 | 1508-BBGA, FCBGA (PBGA1508, 40 x 40 mm, 1 mm pitch) |
| 실장 유형 | Surface Mount |
| Process Node | 90 nm |
| Transceivers | Embedded multi-gigabit transceivers (Stratix II GX feature) |
| DSP Blocks | Yes (dedicated variable-precision DSP blocks) |
| RoHS 상태 | Lead-free per 'N' suffix; RoHS status to be confirmed |
| Lead Free | Yes (lead-free finish per datasheet summary) |
EP2SGX90FF1508C4N 핀 구성
| 핀 1 | I/O Bank 1 (sample) — User I/O ball in Bank 1 - consult Stratix II GX pin table for exact ball assignments per device variant |
| 핀 10 | GND — Ground ball |
| 핀 100 | VCCIO1 — Bank 1 I/O supply voltage |
| 핀 1000 | VCCRT — Transceiver supply |
| 핀 1001 | GXB_RX0 — Embedded transceiver channel 0 receive (typical) |
| 핀 1010 | REFCLK — Transceiver reference clock input |
| 핀 1100 | I/O Bank (sample) — User I/O ball - exact assignment varies by package |
| 핀 1200 | VCCINT — Core supply voltage |
| 핀 1300 | GND — Ground ball |
| 핀 1400 | DQS — DDR/DDR2 data strobe ball (sample) |
| 핀 1500 | I/O (sample) — User I/O ball |
| 핀 1508 | NC — No-connect or reserved per Stratix II GX pin table |
| 핀 20 | VCCIO3 — Bank 3 I/O supply voltage |
| 핀 200 | GND — Ground ball |
| 핀 300 | VCCAUX — Auxiliary supply voltage for I/O and configuration |
| 핀 400 | GXB_TX0 — Embedded transceiver channel 0 transmit (typical) |
| 핀 500 | I/O (sample) — User I/O ball - see Stratix II GX pinout file |
| 핀 600 | VCCINT — Core supply voltage |
| 핀 700 | CONFIG — Configuration mode pin (sample) |
| 핀 800 | GND — Ground ball |
일반적인 애플리케이션
EP2SGX90FF1508C4N 적합 용도: 6 애플리케이션s: Wired Communications Line Cards, ASIC Prototyping, DSP Accelerator Cards, Test and Measurement Instrumentation, Radar and Signal-Processing Front Ends, Video Broadcast and Image Processing.
Wired Communications Line Cards
The EP2SGX90FF1508C4N's embedded multi-gigabit transceivers (up to 6.375 Gbps) and 650 user I/Os make it well-suited for wired backplane and SFP+/XAUI line-card designs. The 90960 LEs and 4.5 Mbit embedded RAM are sufficient to handle PCS, MAC, and framer functions for multiple ports on a single device, while dedicated DSP blocks accelerate forward-error-correction and Reed-Solomon decoding. The 1508-FCBGA package supplies the pin density required for the wide parallel bus to a network processor plus dedicated transceiver ball assignments, reducing PCB layer count in dense switch-fabric designs.
추천
ASIC Prototyping
With 90960 logic elements, 4.5 Mbit of embedded RAM, and 650 user I/Os in a single BGA, the EP2SGX90FF1508C4N is a classic ASIC-prototyping vehicle. Designers map ASIC RTL blocks across multiple FPGAs using TDM or pin-multiplexed partitioning, leveraging Quartus II synthesis to verify timing closure pre-tapeout. The 1508-FCBGA footprint exposes enough I/O to break out common ASIC busses (AXI, AHB, DDR) and to instantiate transactor endpoints for PCIe or RapidIO verification. Industrial temperature variants exist for ASIC prototyping of automotive-grade designs.
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DSP Accelerator Cards
The dedicated variable-precision DSP blocks of the EP2SGX90FF1508C4N implement FIR, FFT, and matrix-multiply pipelines with hundreds of GMACs of throughput. With 90960 LEs and embedded multiplier resources, the device can host a complete radar or beamforming front end plus host-side PCIe interface logic. The 650 user I/Os break out to high-speed ADCs and DACs while embedded transceivers handle the backhaul to a host system. 1508-FCBGA thermal performance (40 x 40 mm) supports sustained DSP workloads with adequate airflow or heatsink attachment.
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Test and Measurement Instrumentation
The EP2SGX90FF1508C4N integrates waveform generation, pattern detection, and protocol-aware decoding logic for high-end test gear. Its 90960 LEs and 4.5 Mbit embedded RAM can capture deep signal traces for protocol analyzers, while embedded transceivers drive serial-bus stimulus up to 6.375 Gbps. The 650 user I/Os map to multiple parallel DUT interfaces with mixed I/O standards (LVDS, LVCMOS, HSTL, SSTL) per pin. Programmable logic in instrument designs enables field upgrades and protocol additions without ASIC respin.
추천
Radar and Signal-Processing Front Ends
In radar and electronic-warfare front ends, the EP2SGX90FF1508C4N's DSP blocks perform pulse compression, MTI filtering, and CFAR detection in real time, with embedded transceivers accepting digitized IF data from high-speed ADCs. The 90960 LEs and 4.5 Mbit embedded RAM support multi-channel data aggregation, while 650 I/Os permit direct interface to memory and host processing arrays. The 1508-FCBGA package maintains signal integrity for high-speed serial links between front-end modules and back-end signal processors.
추천
Video Broadcast and Image Processing
The EP2SGX90FF1508C4N's embedded RAM and DSP blocks enable real-time video scaling, de-interlacing, and color-space conversion for broadcast infrastructure. The 650 I/Os route multiple video streams (3G-SDI, HDMI, DisplayPort) through on-chip serializers and frame buffers, while embedded transceivers connect to upstream camera links or downstream modulators. Industrial temperature variants suit outdoor broadcast cabinets, and the 1508-FCBGA supports the dense multi-channel I/O needed for matrix-switched video routers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90FF1508C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90FF1508C4ES | EP2SGX90FF1508C4 | EP2SGX90FF1508C3N | EP2SGX90FF1508 | EP2SGX130GF1508C4N |
|---|---|---|---|---|---|---|
| Package | 1508-BBGA, FCBGA (40 x 40 mm) | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 90960 | 132480 |
| Embedded RAM (bits) | 4520448 | 4520448 | 4520448 | 4520448 | 4520448 | 6747840 |
| User I/Os | 650 | 650 | 650 | 650 | 650 | 650 |
| Speed Grade | -4 (C4) | -4 (C4) | -4 (C4) | -3 (C3) | unspecified | -4 (C4) |
| Lead-Free (N suffix) | Yes | ES suffix (extended screening) | Base (finish varies) | Yes | Base (finish varies) | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- True drop-in within the same family at the same speed grade (vs EP2SGX90FF1508C4ES)
- Same package, higher density path (vs EP2SGX130GF1508C4N)
- Same family speed-grade flexibility (vs EP2SGX90FF1508C3N)
설계 노트
The Stratix II GX EP2SGX90FF1508C4N requires multiple independent supply rails: VCCINT (core), VCCIO (per I/O bank), VCCAUX, VCCPD, VCCR/VCTT/VCCA for transceivers, and VCC_PLL for PLLs. Decoupling must follow the Stratix II GX PDN guidelines - bulk caps per rail plus 0.1 uF and 0.01 uF ceramics near each supply ball cluster. Estimate (based on typical Stratix II GX power calculator): a fully utilized EP2SGX90 at 50 percent toggle rate can draw 3 to 5 A on VCCINT alone; size your regulator with at least 30 percent headroom.
The 1508-FCBGA (40 x 40 mm, 1 mm pitch) requires a multi-layer PCB with a thermal via array beneath the central ball grid to meet the Stratix II GX junction-to-ambient thermal envelope. Without forced airflow or a heat-spreader attachment, ambient power dissipation should not exceed approximately 5 to 8 W for industrial reliability. Estimated: with the package's published theta_JB and a 2 oz copper PCB with thermal vias, the junction-to-ambient thermal resistance drops by 30 to 40 percent versus JEDEC EIA/JESD51 still-air.
Route transceiver channels (GXB_RX, GXB_TX) with 100 ohm differential impedance, length matching to within the budget defined by the Stratix II GX transceiver user guide (typically 5 to 10 ps of intra-pair skew). Keep AC-coupling capacitors close to the FPGA receive pins, place ferrite beads on the VCCR/VCTT analog supplies, and isolate the transceiver ground return from digital switching currents. Configuration pins MSEL[2:0] select the configuration mode (FPP, AS, PS, JTAG) and must be pulled to defined logic levels before configuration begins.
Do not leave unused transceiver channels floating - per the Stratix II GX pin connection guidelines, unused TX pins must be left open and unused RX pins must be biased through the recommended resistor divider. A common mistake is forgetting VCC_PLL decoupling for every PLL block; missing or inadequate filtering causes PLL jitter or unlock. Finally, ensure the configuration bitstream uses the correct Stratix II GX device ID or Quartus will refuse to load and the CONF_DONE pin will stay low.
규정 준수 정보
Lead-free finish indicated by 'N' suffix; RoHS and REACH compliance per Intel product compliance documentation. AEC-Q100 not applicable (commercial/industrial FPGA).
