EP2SGX90FF1508C4ES - Stratix II GX FPGA 90K LE 1508-FBGA | Intel
부품 번호: EP2SGX90FF1508C4ES ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 100 | $1480 | $148,000.00 |
| 250 | $1325 | $331,250.00 |
| 500 | $1195 | $597,500.00 |
| 1,000 | $1095 | $1,095,000.00 |
EP2SGX90FF1508C4ES 개요
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic functionality is defined by the user after manufacturing, rather than being fixed at the fab. FPGAs occupy a specific niche in the semiconductor hierarchy between general-purpose CPUs (which execute software serially) and application-specific integrated circuits (ASICs) which are hard-wired at fabrication. The Stratix II GX family specifically targets high-speed serial I/O and DSP-heavy designs, integrating multi-gigabit transceivers and dedicated multiplier/accumulator blocks alongside the programmable logic fabric.
Key features of this device include 4828 logic array blocks (LABs) / 4828 CLBs, 4,828 Kbits of embedded memory (TriMatrix memory blocks), 252 18x18 multipliers for DSP, up to 717 MHz core frequency, twelve 6.375 Gbps transceivers for high-speed serial, and a 1.2 V core supply (1.15 V to 1.25 V tolerance). The 1508-pin FC-FBGA package supports high-density board routing with controlled-impedance signal paths and uses flip-chip packaging for superior thermal and electrical performance over wire-bond equivalents.
The device is fabricated on a 90 nm CMOS process and includes on-chip 8B/10B encoding/decoding, clock data recovery (CDR), and dynamic phase alignment (DPA) for serial protocols including PCI Express, Serial RapidIO, XAUI, and CEI-6G. Engineering sample suffix "ES" indicates this specific part is an untrimmed pre-production unit intended for evaluation and design verification rather than volume production builds.
Typical applications include high-speed serial interface prototyping (PCIe Gen1, XAUI, RapidIO), DSP co-processing cards, baseband processing for wireless infrastructure, and broadcast video processing engines. The 1508-FBGA package is suitable for high-layer-count PCBs with microvia stackups and advanced thermal management.
When designing with this device, ensure a 12-layer PCB minimum with continuous GND planes beneath the BGA, controlled-impedance routing for the 6.375 Gbps transceiver channels, and a multi-phase power supply with sub-milliohm decoupling. Engineering samples (ES) must not be used in fielded production systems; specify production-grade suffix (C4N, C5, etc.) for volume builds.
This page synthesizes distributor pricing, drop-in Stratix II GX equivalents, and engineering sample (ES) handling guidance not found in any single manufacturer datasheet, providing a one-stop reference for sourcing and design-in.
드롭인 대체품: EP2SGX90FF1508C4ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90FF1508C4ES (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Total RAM Bits, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90FF1508C4N
✅ 드롭인✓ 재고 있음
$1500 / 개
데이터시트 보기 →EP2SGX90FF1508C4
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2SGX90FF1508C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2SGX90FF1508C3N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2SGX90FF1508C3ES
✅ 드롭인✓ 재고 있음
$1340 / 개
데이터시트 보기 →EP2SGX90F1508C3
✅ 드롭인✓ 재고 있음
$1350 / 개
데이터시트 보기 →EP2SGX90FF1508C4ES 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements / Cells | 90960 |
| Logic Array Blocks (LABs) | 4828 |
| Configurable Logic Blocks (CLBs) | 4828 |
| Maximum Internal Frequency | 717 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V to 1.25 V) |
| Transceivers | 12 channels at up to 6.375 Gbps |
| Embedded Memory | 4828 Kbit TriMatrix memory blocks |
| Embedded Multipliers | 252 (18x18) |
| User I/O Pins | 650 (approx.) |
| Package Type | 1508-ball FC-FBGA |
| Package Code | MS-034AAR-1, FBGA-1508, 40 x 40 mm, 1 mm pitch |
| 동작 온도 | 0 C to 85 C (Commercial / Extended) |
| Grade | Engineering Sample (ES) |
| RoHS 상태 | Compliant (verify by date code) |
EP2SGX90FF1508C4ES ms-034aar-1, fbga-1508, 40 x 40 mm, 1 mm pitch 핀 구성 가이드
EP2SGX90FF1508C4ES(ms-034aar-1, fbga-1508, 40 x 40 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90FF1508C4ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90FF1508C4ES 적합 용도: 6 애플리케이션s: PCI Express Gen1 Endpoint Development, Serial RapidIO Switch Prototyping, XAUI / 10G Ethernet MAC Prototyping, Broadcast Video Processing Engine, Wireless Baseband Processing Card, Test & Measurement Instrumentation Backbone.
PCI Express Gen1 Endpoint Development
The Intel EP2SGX90FF1508C4ES is well-suited for PCI Express Gen1 endpoint prototype designs where integrated transceivers eliminate the need for external PHY silicon. The device offers 12 high-speed serial channels at up to 6.375 Gbps, which comfortably covers the 2.5 Gbps PCIe Gen1 electrical specification with margin for signal-integrity losses. The 90,960 logic elements and 252 dedicated 18x18 multipliers are sufficient for implementing a soft PCIe IP core plus endpoint DMA engines and application-layer logic on a single fabric, avoiding external companion chips. Designers use this FPGA on x1, x4, and x8 PCIe endpoint cards and as a system validation reference before committing to ASIC tapeout.
추천
Serial RapidIO Switch Prototyping
With 12 multi-gigabit transceivers and 90,960 logic elements, the EP2SGX90FF1508C4ES is widely used to prototype Serial RapidIO (SRIO) switches for embedded DSP and baseband processing fabrics. The Stratix II GX hard SERDES block supports the 1.25, 2.5, and 3.125 Gbaud SRIO rates natively, while the 252 hardware multipliers enable inline DSP operations between SRIO message streams without consuming fabric logic. The 1508-FBGA package provides the controlled-impedance BGA escape routing that 3.125 Gbaud differential pairs require. Application examples include wireless base-station DSP cards, radar signal-processing sleds, and multi-DSP backplanes for software-defined radio platforms.
추천
XAUI / 10G Ethernet MAC Prototyping
The EP2SGX90FF1508C4ES integrated transceivers deliver the 3.125 Gbaud lane rate required for XAUI-based 10 Gigabit Ethernet, enabling MAC and PHY layer prototyping on a single FPGA. The 90K logic elements comfortably fit a 10G MAC plus PCS, while the 4,828 Kbits of TriMatrix memory provide sufficient packet buffering for short-burst forwarding and statistics counters. Use this part on network processor test cards, 10G line card bring-up platforms, and switch-fabric evaluation boards. Its 1508-FBGA footprint matches the high-layer-count PCBs that 6.375 Gbps signal integrity demands.
추천
Broadcast Video Processing Engine
The EP2SGX90FF1508C4ES handles SDI, HD-SDI, and 3G-SDI video processing pipelines thanks to its high-speed transceivers that pair with external SDI PHY serializers. The 252 18x18 multipliers accelerate real-time color-space conversion, scaling, and deinterlacing, while the 4,828 Kbits of block RAM hold multiple lines of HD video (1920x1080) for cross-frame temporal processing. The 1508-FBGA's flip-chip thermal performance supports the continuous high utilization typical of broadcast video workloads. Typical uses include broadcast switchers, video format converters, and studio-grade video capture cards.
추천
Wireless Baseband Processing Card
The Stratix II GX architecture's combination of high-speed transceivers and abundant DSP blocks makes the EP2SGX90FF1508C4ES ideal for wireless baseband prototyping in LTE, WiMAX, and proprietary OFDM systems. Each 18x18 multiplier supports single-cycle MAC operations needed for FFT, Viterbi decoding, and turbo decoding. Twelve transceiver lanes simultaneously handle multiple antenna paths plus a CPRI or OBSAI link to a base station radio unit. The 90,960 logic elements support multi-channel MIMO processing up to 4x4 configurations on a single FPGA. The 1508-FBGA package provides the thermal headroom required for sustained high-utilization DSP workloads.
추천
Test & Measurement Instrumentation Backbone
The EP2SGX90FF1508C4ES is frequently used in high-end oscilloscopes, logic analyzers, and protocol analyzers because its 12 transceivers capture multi-channel high-speed serial traffic while the 90K logic elements implement trigger logic, pattern matching, and protocol decoding. The 4,828 Kbits of block RAM serve as deep acquisition memory for time-correlated multi-channel capture. The 1508-FBGA package on a 12-layer PCB delivers the signal integrity that 6.375 Gbps capture requires, and the flip-chip thermal design sustains continuous-capture workloads. Engineering sample (ES) suffix on this part is particularly common in T&M because prototype instrument builds run in low volumes.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90FF1508C4ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90FF1508C4N | EP2SGX90FF1508C4 | EP2SGX90FF1508C5N | EP2SGX90FF1508C3N | EP2SGX90FF1508C3ES |
|---|---|---|---|---|---|---|
| Package | 1508-ball FC-FBGA (40x40 mm) | 1508-ball FC-FBGA (40x40 mm) - same | 1508-ball FC-FBGA (40x40 mm) - same | 1508-ball FC-FBGA (40x40 mm) - same | 1508-ball FC-FBGA (40x40 mm) - same | 1508-ball FC-FBGA (40x40 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 90960 | 90960 |
| Speed Grade | -4 (C4 suffix), Engineering Sample | -4, production | -4, production | -5 (faster), production | -3 (slower), production | -3, Engineering Sample |
| Part Grade | Engineering Sample (ES) | Production (N) | Production | Production (N) | Production (N) | Engineering Sample (ES) |
| Transceivers (6.375 Gbps) | 12 | 12 | 12 | 12 | 12 | 12 |
| Multipliers (18x18) | 252 | 252 | 252 | 252 | 252 | 252 |
| Embedded Memory | 4828 Kbit | 4828 Kbit | 4828 Kbit | 4828 Kbit | 4828 Kbit | 4828 Kbit |
주요 차별점
- Engineering sample pricing typically 30-40% below production-grade parts (vs EP2SGX90FF1508C4N)
- Same 1508-FBGA footprint enables zero-cost PCB migration to production parts (vs EP2SGX90FF1508C4N / EP2SGX90FF1508C5N)
- 12 transceivers at 6.375 Gbps supports PCIe Gen1, XAUI, and Serial RapidIO simultaneously (vs EP2SGX60FF1152C4 (60K LE variant))
설계 노트
Estimated: at full fabric utilization with all 12 transceivers active at 6.375 Gbps, the EP2SGX90FF1508C4ES dissipates approximately 8-12 W. The 40 x 40 mm FC-FBGA package requires a top-side heatsink plus 4 thermal vias in the BGA thermal pad array. Ensure junction temperature stays below 100 C by providing at least 200 LFM of forced air cooling across continuous operation. Use the Stratix II GX PowerPlay Early Power Estimator to confirm the thermal budget before committing to layout.
Recommended: route 12 transceiver differential pairs with 100 ohm differential impedance on a 12-layer PCB minimum. Use stripline (inner layer) routing for the longest XAUI lanes to minimize EMI, and microstrip (outer layer) only for short break-out regions. The 1 mm BGA pitch allows two traces between adjacent pads on the breakout layer; provide GND stitching vias every 200 mils around the BGA field to suppress package-mode resonances.
Recommended: provide a 1.2 V core supply at 8-12 A continuous with load-step transient response under 5 mV. Use a 4-phase PWM controller with ceramic output capacitors (10 x 22 uF X5R per phase) and a pi-filter input network. Add 100 nF X7R decoupling caps at every VCCINT ball plus 10 uF bulk caps distributed every 20 balls. For VCCIO, separate banks may operate at 1.5 V, 1.8 V, 2.5 V, or 3.3 V - each bank needs its own regulator if voltages differ.
Critical: the ES suffix indicates this is an engineering sample, not a production-grade unit - Intel/Altera explicitly excludes ES parts from warranty coverage and may exhibit reduced timing margin. Do not ship ES parts in fielded products; specify the production C4N suffix for volume builds. Also, Quartus versions 14.0 and newer DO NOT support Stratix II GX - pin your tool version to Quartus II 13.0 or earlier.
Recommended: for 6.375 Gbps transceiver channels, follow the Stratix II GX board design guidelines for pre-emphasis and equalization settings. Use a TDR-measured reference channel with insertion loss below 6 dB at 3.125 GHz. Place AC-coupling capacitors (100 nF X7R) as close as possible to the receiver pins, and route TX and RX pairs with minimum 5W spacing to reduce crosstalk.
규정 준수 정보
RoHS and lead-free per Altera/Intel FBGA assembly standards - verify by date code for ES samples. AEC-Q100 not applicable as this is a commercial-grade FPGA. REACH and conflict minerals compliance inherited from Intel Programmable Solutions Group disclosures.