EP3C16F256C6 - 15,408-Cell 500 MHz FPGA | Altera
부품 번호: EP3C16F256C6 ✓ 활성EP3C16F256C6 개요
An FPGA is a programmable logic device that replaces application-specific fixed digital logic with interconnected configurable logic, memory, and programmable I/O blocks. Engineers configure an FPGA for parallel processing, control logic, signal conditioning, communications, or general-purpose digital systems. The Cyclone III family combines these configurable resources with a high-pin-count ball-grid package intended for compact, high-density PCB assemblies.
Key verified characteristics include 15,408 logic cells, 168 I/Os, 516,096 embedded-memory bits, and a maximum listed frequency of 500 MHz. The 256-LBGA package provides 256 package terminals and uses a lead-free construction identified as MS-034. The supplied operating-temperature information spans -40°C to +125°C, making the component relevant to industrial and extended-temperature equipment when the complete device qualification and system requirements are satisfied.
The EP3C16F256C6 combines a 65 nm process node with a 1.2 V listed supply voltage. Its 256-terminal surface-mount package supports dense routing to external memory and peripherals, while 168 user I/Os provide interfaces for control buses, data acquisition, communications, and general-purpose logic. Available source data does not provide the full I/O standard list, memory architecture details, AC timing characteristics, or recommended operating conditions, so those parameters should be confirmed in the Cyclone III device handbook and datasheet before release.
Typical uses include industrial automation controllers, communication interfaces, embedded signal-processing systems, test equipment, and network-interface designs. In each case, the FPGA can implement parallel datapaths and state machines while the 168 I/Os connect the programmable logic to converters, transceivers, memories, and control peripherals. Designs requiring deterministic interfaces, multiple voltage domains, or high-speed memory must verify the exact bank and pin constraints in the manufacturer documentation.
A critical design consideration is that legacy FPGA availability and lifecycle plans should be checked before new production commitment. The verified distributor listings indicate current sourcing options, but they do not provide a formal lifecycle statement, long-term supply commitment, or automotive qualification. Engineering teams should therefore confirm procurement continuity, tooling support, and design-file compatibility before adopting this device in a new platform.
This page consolidates verified distributor specifications, package information, sourcing data, and carefully qualified same-family alternatives. It also distinguishes directly verifiable facts from parameters that remain unavailable, helping engineers compare the EP3C16F256C6 without treating generic FPGA assumptions as manufacturer-specified characteristics.
드롭인 대체품: EP3C16F256C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
EP3C16F256C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C8
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP3C16F256C7
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP3C16F256C6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C6 최대 정격 & 전기적 특성
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Cells | 15,408 cells |
| Maximum Frequency | 500 MHz |
| Embedded Memory | 516,096 bits |
| User I/O Count | 168 I/Os |
| Package Terminals | 256 terminals |
| Package Type | 256-LBGA |
| Package Construction | Lead-free FBGA-256, MS-034 |
| Technology Node | 65 nm |
| 공급 전압 | 1.2 V |
| 동작 온도 | -40°C to +125°C |
| 실장 유형 | Surface Mount |
| Terminal Form | Ball |
| Lead-Free Status | Lead-free |
EP3C16F256C6 lead-free fbga-256, ms-034 핀 구성 가이드
EP3C16F256C6(lead-free fbga-256, ms-034 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C16F256C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C16F256C6 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Communication Interface and Protocol Bridge, Embedded Signal Processing, Test and Measurement Equipment, Network Interface Card, Programmable Logic Subsystem.
Industrial Automation Controller
The EP3C16F256C6 fits an industrial automation controller because it combines 15,408 programmable logic cells with 168 I/Os in a 256-LBGA package. Its listed -40°C to +125°C temperature range supports extended-temperature equipment, while 516,096 embedded-memory bits provide resources for buffering control data and diagnostic traces. The FPGA can implement parallel state machines, sensor acquisition logic, interlocks, and actuator sequencing in one configurable device. A design should verify the exact I/O voltage standards, timing constraints, and qualification requirements before deployment.
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Communication Interface and Protocol Bridge
The EP3C16F256C6 can implement a communication interface or protocol bridge when a design requires programmable parallel datapaths and numerous external connections. Its 168 I/Os can support byte-wide buses, status signals, clocking, and multiple transceiver channels, while the 500 MHz listed maximum frequency provides a basis for timing-critical logic. In a bridge design, the FPGA can perform framing, buffering, checksum generation, and rate adaptation between unlike interfaces. Engineers must confirm pin-bank voltages, supported standards, clocking topology, and maximum interface rates in the device documentation.
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Embedded Signal Processing
The EP3C16F256C6 is suitable for parallel embedded signal-processing tasks that benefit from configurable logic rather than a fixed instruction set. Its 15,408 logic cells and 516,096 embedded-memory bits can support filtering, correlation, data packing, and real-time control pipelines, while 168 I/Os provide broad connectivity to converters and memory. The listed 500 MHz maximum frequency describes the device class rather than the throughput of every arbitrary design. Signal integrity, I/O timing, resource allocation, and implementation timing closure must be evaluated with the relevant FPGA toolchain.
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Test and Measurement Equipment
The EP3C16F256C6 can serve as the programmable control and datapath element in test and measurement equipment. Its 15,408 logic cells allow concurrent sequencing of test channels, acquisition control, result processing, and front-panel interfaces, while 168 I/Os simplify connections to instruments and fixtures. The listed 1.2 V core supply and 65 nm process identify the device family but do not determine achievable timing. Designers should evaluate clock-jitter requirements, I/O slew behavior, thermal margins, and timing closure before selecting the FPGA for precision instrumentation.
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Network Interface Card
The EP3C16F256C6 can implement a network interface card when the design needs configurable packet handling, local buffering, and extensive host connectivity. The 15,408 logic cells and 516,096 embedded-memory bits support practical parallel architectures, while 168 I/Os allow implementation of multiple buses and status interfaces without requiring a fixed ASIC. The 256-LBGA package also supports compact multilayer PCB construction. A production design must validate board-level timing, transceiver behavior, thermal performance, configuration security, and long-term software-tool availability.
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Programmable Logic Subsystem
The EP3C16F256C6 is well suited to a programmable logic subsystem that consolidates control, glue logic, and parallel data handling around one or more companion processors. Its 168 I/Os can connect directly to microcontrollers, transceivers, memory devices, and status peripherals, while the embedded-memory capacity supports local packet or sample buffering. The device's listed 500 MHz frequency gives designers a concrete performance class for planning pipeline depth. Final implementation should account for routing delays, I/O standards, clock-domain crossings, and the exact pin assignments of the selected board revision.
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추천 제품 요약
엔지니어링 참조 데이터: EP3C16F256C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C16F256C8N | EP3C16F256C8 | EP3C16F256C7 | EP3C16F256C6N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Cells | 15,408 cells | 15,408 cells | 15,408 cells | 15,408 cells | 15,408 cells |
| Technology Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Grade Designation | C6 | C8N | C8 | C7 | C6N |
주요 차별점
- Verified 15,408-cell Cyclone III resource configuration (vs EP3C16F256C8N)
- Explicit extended-temperature listing (vs EP3C16F256C8)
- Documented maximum frequency and core voltage (vs EP3C16F256C7)
- Broad I/O availability for high-pin-count systems (vs EP3C16F256C6N)
설계 노트
Treat the listed 1.2 V value as the core supply, not as a universal board voltage. The verified sources do not provide the recommended operating ranges, current limits, power-up sequence, or I/O-bank voltage table, so do not design the power tree from memory. Obtain the official electrical-characteristics tables, apply the required core and I/O decoupling, and verify sequencing and voltage tolerances against the actual selected configuration. A 256-LBGA device also requires careful plane distribution because ball-grid power delivery can create significant simultaneous current demand.
Reserve the complete 256-ball land pattern and follow the manufacturer PCB, solder-mask, paste, and via-in-pad guidance for the FBGA package. The supplied sources do not include the detailed land pattern, so a generic BGA drawing must not be substituted without checking package dimensions and ball-pitch data. Pay particular attention to decoupling placement, clock and reset routing, configuration-strapping access, and escape routing for the 168 I/Os. A dense BGA also benefits from multilayer construction and thermal-via placement below the device.
The 65 nm process does not by itself determine junction temperature or board performance. Although the listed operating range is -40°C to +125°C, calculate actual dissipation from the selected design and evaluate it against the package thermal data, which is not included in the verified sources. Use exposed PCB area, copper planes, and thermal vias as appropriate, while preserving the required land-pattern geometry. For the maximum specified ambient temperature, margin must be demonstrated using validated junction-temperature and timing behavior rather than relying only on the component rating.
Do not treat EP3C16F256C8N or another EP3C16 suffix variant as automatically interchangeable merely because it has 256 terminals. Suffix changes can affect speed grade, temperature grade, ordering code, or commercial status. Before substitution, compare the complete orderable part number, package drawing, pinout, voltage tolerances, timing models, configuration method, and tool support. The supplied evidence does not include enough electrical data to approve a new alternative without engineering review, even though the alternatives share the same family and 256-terminal package class.
The listed 500 MHz maximum frequency is a device-level reference and does not guarantee that arbitrary logic will close at 500 MHz. Constrain clock networks, account for routing and I/O delay, use the appropriate timing models, and validate board-level signal integrity with controlled-impedance routing and termination where required. The verified data does not enumerate supported I/O standards or differential impedance requirements. Therefore, interface selection must begin with the official pin and I/O tables rather than from general Cyclone III assumptions.
규정 준수 정보
The verified data explicitly identifies the device as lead-free and describes the FBGA-256 package as MS-034. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals declarations were not present in the supplied sources and therefore remain unknown.
