EP3C16F256C7 - 15,408-LC Cyclone III FPGA | Intel/Altera
부품 번호: EP3C16F256C7 ✓ 활성EP3C16F256C7 개요
An FPGA is a programmable digital semiconductor whose interconnect and logic resources can be configured after manufacture. Within the semiconductor hierarchy, a field-programmable gate array is a user-programmable logic device that sits above fixed-function application-specific integrated circuits when design flexibility is more valuable than a fixed hardware cost structure. The Cyclone III family provides a cost-optimized platform for designs requiring moderate logic density, dedicated block RAM, and multiple I/O standards without moving to a larger programmable-logic family.
The EP3C16F256C7 provides 15,408 logic elements and 516,096 bits of embedded RAM, giving designers a defined resource budget for control state machines, packet buffers, data acquisition, and parallel image pipelines. Its 168 user I/O support interfaces to external converters, memory, transceivers, and displays. Because the device is packaged in a 256-LBGA, board assembly requires a fine-pitch PCB layout, careful via and escape-routing planning, and complete thermal analysis. The -40 °C to +125 °C rating supports industrial-temperature deployments.
Typical uses include industrial automation controllers, multi-channel data-acquisition modules, communications-interface bridges, motor-control and power-system control, test-and-measurement front ends, and embedded video-processing subsystems. An FPGA is particularly useful when several peripherals or parallel data paths must be integrated without developing a custom ASIC.
Design considerations center on pin assignment, power integrity, decoupling, and thermal management. Because complete pin names and bank power requirements were not present in the verified source data, engineers should use the Altera pinout and power-supply documentation for the exact 256-LBGA footprint before layout release. Configuration flash, clocking, decoupling, and every power ball must be planned together rather than added after routing.
This page consolidates verified distributor specifications, package information, pricing evidence, and same-family replacement context into one engineering reference. It also distinguishes documented facts from parameters that still require confirmation from the manufacturer datasheet, reducing the risk of designing from distributor-search snippets alone.
드롭인 대체품: EP3C16F256C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C16F256C7 (동일 폼 팩터 및 풋프린트) — 차이점: Embedded Memory, Operating Temperature.
EP3C16F256C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C8
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP3C16F256I7N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP3C16F256I7N
✅ 드롭인가격 문의
데이터시트 보기 →EP3C16F256I8
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C16F256I8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C7 최대 정격 & 전기적 특성
| Device Type | FPGA (Field Programmable Gate Array) |
| Device Family | Cyclone III |
| Logic Cells / Logic Blocks | 15,408 |
| Embedded Memory | 516,096 bit |
| User I/O | 168 |
| Total Package Pins | 256 |
| Package Type | 256-LBGA (FBGA-256) |
| Package Type Designation | Other, LEAD FREE, MS-034, FBGA-256 |
| 실장 유형 | Surface mount |
| 동작 온도 | -40 °C to +125 °C (-40 °F to +257 °F) |
| Lead-Free Status | Lead free |
| Internal Block RAM Capacity | 516,096 bit |
EP3C16F256C7 other, lead free, ms-034, fbga-256 핀 구성 가이드
EP3C16F256C7(other, lead free, ms-034, fbga-256 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C16F256C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C16F256C7 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Multichannel Data-Acquisition System, Communications Interface Bridge, Motor Control and Power-System Control, Test and Measurement Front End, Embedded Video Processing.
Industrial Automation Controller
The EP3C16F256C7 fits compact industrial controllers that coordinate sensors, actuators, and safety interlocks without implementing a custom ASIC. Its 15,408 logic elements can host control state machines and protocol interfaces, while 516,096 bits of embedded memory support buffering and data organization. The 168 user I/O provide connections to digital field inputs, relay outputs, and field-bus transceivers. The -40 °C to +125 °C rating is appropriate for industrial equipment, provided the surrounding components, power system, and enclosure support the same thermal environment. Engineers should confirm supply rails, bank assignments, and I/O standards in the device documentation before PCB release.
추천
Multichannel Data-Acquisition System
The Cyclone III FPGA can collect and organize data from parallel ADC channels using its 168 user I/O and embedded memory. A practical architecture places the converters on selectable banks, uses the programmable fabric for triggering and channel alignment, and stores captured blocks in the 516,096 bits of on-chip RAM. This configuration shortens the path from converter samples to packet processing while avoiding a high-bandwidth external memory requirement for moderate frame sizes. The FPGA's 15,408 logic elements can also implement interpolation, filtering, or timestamp generation. Validation should include pin-bank voltage compatibility, converter timing margin, and Quartus timing closure before hardware release.
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Communications Interface Bridge
EP3C16F256C7 is appropriate for bridging serial or parallel communication formats where protocol timing and framing must be adapted in hardware. Its programmable logic fabric can implement receive FIFOs, packetizers, CRC checks, and clock-domain crossings, while the 516,096 bits of memory provide useful packet buffering. The 168 I/O leave sufficient parallel channels for companion transceivers and control signals in a 256-LBGA implementation. A designer can retain the same pinout architecture while reprogramming logic for different standards, reducing board revisions. Confirm transceiver voltage standards, supported I/O banks, maximum interface rates, and timing closure against the final protocol requirements.
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Motor Control and Power-System Control
The Cyclone III FPGA can execute deterministic current-loop, PWM, and fault-handling logic where predictable timing is valuable. Its programmable logic supports parallel control channels, dead-time generation, encoder decoding, and protection interlocks, while the 168 I/O connect gate drivers, position sensors, and status signals. With 15,408 logic elements, the device can also accommodate supervisory logic or communication rather than relying on a separate controller. The -40 °C to +125 °C range supports industrial environments, although power-stage components require separate thermal design. Safety and power-conversion designs should review isolation, timing margins, fault coverage, and any applicable regulatory requirements independently.
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Test and Measurement Front End
A programmable logic front end built around the EP3C16F256C7 can coordinate multiple instruments, trigger events, and perform real-time measurements without a discrete microcontroller for every function. The 168 I/O support instrument handshakes, data buses, clock sources, and status indicators, while the FPGA fabric implements timing engines and result capture. Its 516,096 bits of embedded RAM can buffer acquisition bursts, and the 15,408 logic cells can support counters, state machines, or digital signal processing stages. Designers should budget timing closure for high-speed acquisition paths, use the FPGA as the timing reference where appropriate, and implement self-tests so instrument faults cannot silently produce invalid measurements.
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Embedded Video Processing
The EP3C16F256C7 can serve as a modest image-processing pipeline for industrial cameras, inspection equipment, or compact vision controllers. Parallel sensor data can enter through the 168 user I/O, be converted into a predictable pixel pipeline, and stored temporarily in the 516,096 bits of embedded memory. The 15,408 logic elements can support exposure timing, color processing, thresholding, or a simple feature detector rather than a full software vision processor. Using an FPGA reduces the latency between acquisition and decision compared with a general-purpose processor. The design must confirm the sensor's pixel clock, data-bus width, supported I/O standards, and timing closure at the target frame rate.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C16F256C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C16F256C7N | EP3C16F256C8 | EP3C16F256I7 | EP3C16F256I7N |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Embedded Memory | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit |
| User I/O | 168 | 168 | 168 | 168 | 168 |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Order / Speed Grade | C7 | C7N | C8 | I7 | I7N |
주요 차별점
- Documented industrial-temperature range (vs EP3C16F256C7N)
- Established 15,408-logic-element resource budget (vs EP3C16F256I7N)
- 168 user I/O in the 256-LBGA footprint (vs EP3C16F256C8)
설계 노트
Treat the 256-LBGA escape routing as a constrained signal-integrity problem rather than a generic fine-pitch fanout. Assign every power, ground, configuration, clock, and user I/O ball from the manufacturer package files before schematic capture. Keep high-speed clocks away from noisy power-conversion nodes, use short return paths for each interface, and preserve the documented decoupling topology around the device.
The verified source excerpt did not state the complete core and I/O supply voltages, so do not derive the power tree from memory. Confirm every supply rail and its allowable tolerance in the manufacturer electrical-characteristics documentation. Check total static and dynamic current for the selected 15,408-logic-element design, then use the package thermal data to verify that rail planning and board copper can support the intended operating temperature.
The EP3C16F256C7 supports -40 °C to +125 °C, but junction temperature is not limited by ambient temperature alone. Estimate worst-case activity-factor dissipation from the implemented design and combine it with the board's thermal resistance and airflow. Preserve the manufacturer's recommended via-array and copper-plane geometry beneath the LBGA so heat and current can leave the package.
Do not approve a suffix-variant substitution solely because the package matches. The C, I, 7, 8, and N codes can encode different commercial, temperature, speed, or lead-free conditions. Verify each ordering-table field, the required Quartus device support, configuration method, electrical characteristics, and package ballout. The 256-LBGA footprint may remain usable while timing, thermal, or procurement requirements still change.
규정 준수 정보
The verified DigChip specification identifies the package as LEAD FREE. No explicit RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statement was present in the supplied source data, so those fields remain unknown.
