EP3C16F484C8N - Cyclone III FPGA 15K LE 484-BGA | Intel
부품 번호: EP3C16F484C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $46.88 | $46.88 |
| 10 | $42.2 | $422.00 |
| 100 | $37.5 | $3,750.00 |
| 500 | $33.25 | $16,625.00 |
| 1,000 | $29.95 | $29,950.00 |
EP3C16F484C8N 개요
Background Knowledge: A Field Programmable Gate Array (FPGA) is a programmable semiconductor that lets designers implement arbitrary digital logic - combinational, sequential, and memory - via a configuration bitstream. FPGAs sit within the broader taxonomy of programmable logic devices (PLD), bridging the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic. The Cyclone III family is positioned as a low-cost, low-power FPGA family from Intel/Altera, optimized for volume production in industrial, consumer, and communications applications rather than high-end signal processing.
Key features include 15,408 logic elements organized in 963 LABs (Logic Array Blocks), 56 embedded 18x18 multipliers supporting up to 70 MHz DSP throughput, and 4 PLLs for clock management. The device also supports external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM through dedicated PHY blocks. Total on-chip RAM is 504 Kbit distributed across M9K memory blocks, sufficient for buffering moderate data streams.
Architecturally, Cyclone III uses a LUT-based fabric with embedded multiplier blocks and hard memory controllers, providing deterministic timing and predictable performance across the commercial temperature range. The 60 nm process and 1.2 V core operation help reduce dynamic power versus prior Cyclone generations, making it suitable for thermally-constrained embedded systems.
Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototyping, telecommunications line cards, and consumer electronics requiring custom glue logic or moderate DSP. It also serves as a cost-effective prototyping vehicle for ASIC development.
When designing with this device, careful attention must be paid to power sequencing, decoupling, and JTAG configuration routing. The 484-BGA package requires a 4-layer minimum PCB with controlled-impedance traces for high-speed interfaces.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet alone.
드롭인 대체품: EP3C16F484C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C16F484C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Embedded Memory, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C16F484C7N
✅ 드롭인✓ 재고 있음
$30.1 / 개
데이터시트 보기 →EP3C16F484C6N
✅ 드롭인✓ 재고 있음
$338.75 / 개
데이터시트 보기 →EP3C16F484I7N
✅ 드롭인✓ 재고 있음
$36.4 / 개
데이터시트 보기 →EP3C120F484C7N
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP3C120F484I7
✅ 드롭인✓ 재고 있음
$595.8 / 개
데이터시트 보기 →EP3C16F484C8N 최대 정격 & 전기적 특성
| Series | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 15,408 LE |
| Adaptive Logic Modules (ALMs) | 963 ALM |
| Logic Array Blocks (LABs) | 963 LAB |
| Embedded Memory | 504 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/O Pins | 346 |
| 패키지 | 484-BGA (FineLine BGA) |
| Speed Grade | 8 |
| 동작 온도 | 0C to +85C (commercial) |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.2 V (typical) |
| Configuration | JTAG / Active Serial / Fast Passive Parallel |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP3C16F484C8N 484-bga (fineline bga) 핀 구성 가이드
EP3C16F484C8N(484-bga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C16F484C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C16F484C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing Pipelines, Telecommunications Line Cards, Automotive Infotainment Prototyping, ASIC Prototyping Platform, Test and Measurement Instrumentation.
Industrial Motor Control
The EP3C16F484C8N's 15,408 logic elements, 56 embedded 18x18 multipliers, and 4 PLLs make it well suited for field-oriented control (FOC) of three-phase AC induction and PMSM motors. Engineers can implement multi-axis current loops, space-vector PWM, and encoder interfaces in a single device. The 346 user I/Os comfortably accept Hall sensors, resolver feedback, and gate-driver signals. Compared with using a microcontroller+DSP combination, an FPGA-based approach delivers deterministic loop times and higher PWM resolution at 50-100 kHz switching frequencies. The commercial 0-85C temperature range covers most factory-floor enclosures; use EP3C16F484I7N for outdoor or cabinet-mounted drives.
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Video Processing Pipelines
For mid-resolution video processing (VGA to 720p), the EP3C16F484C8N provides sufficient logic and the 56 dedicated multipliers to implement real-time pixel pipelines, color space conversion (YUV to RGB), and scaling. The 504 Kbit embedded RAM in M9K blocks serves as line buffers, eliminating external SRAM in many designs. DDR2 interfaces up to approximately 200 MHz connect to external frame buffers when needed. Designers typically pair this FPGA with HDMI/DVI encoder PHY devices; the 346 user I/Os handle parallel RGB, BT.656, or LVDS signaling. For higher resolutions (1080p), step up to EP3C25 or EP3C40 with larger on-chip memory.
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Telecommunications Line Cards
The EP3C16F484C8N's combination of 346 user I/Os, DDR2/QDRII controller PHYs, and 56 multipliers supports multi-channel T1/E1 framers, low-density SERDES bridging, and packet classification engines. Its deterministic fabric timing is valuable for telecom backplane applications. The 484-BGA package exposes enough I/Os to connect to framer ICs, PHY transceivers, and network processors simultaneously. Compared with ASIC solutions, the Cyclone III allows rapid protocol customization for niche line cards, and the low 60 nm process power suits dense rack-mounted designs. Use the I7N grade for outdoor cell-site equipment.
추천
Automotive Infotainment Prototyping
While the commercial C8N grade itself is not automotive qualified, the Cyclone III family supports rapid prototyping of infotainment features such as display controllers, media decoders (MP3, basic MPEG), and CAN/LIN gateway logic. The 56 hardware multipliers accelerate audio processing, and 504 Kbit RAM covers intermediate audio buffers. Designers use EP3C16F484C8N on development boards to validate algorithms before porting to a qualified automotive Cyclone variant. The 346 I/Os accept parallel LCD panels, touch controllers, and audio codec interfaces. Final production typically migrates to automotive-qualified FPGAs from Cyclone or other families.
추천
ASIC Prototyping Platform
Engineers use the EP3C16F484C8N as a target for verifying custom ASIC RTL before tape-out, partitioning large designs across multiple FPGAs. With 15K logic elements and 504 Kbit RAM it can host moderate-complexity subsystems such as custom RISC cores, peripheral bridges, or signal processing pipelines. JTAG configuration allows rapid bitstream iteration, and 346 I/Os provide access to verification pads. Multi-FPGA partitioning tools such as Synplify Premier or Certify leverage the deterministic timing of Cyclone III for predictable ASIC-to-FPGA correlation. This use case typically stresses the speed grade; many teams move to C7N or C6N variants for headroom.
추천
Test and Measurement Instrumentation
The EP3C16F484C8N delivers precise digital pattern generation, custom protocol decoding, and interface bridging for bench-top T&M equipment. Engineers implement JTAG boundary-scan controllers, I2C/SPI master/slave bridges, and protocol analyzers in this device. The 4 PLLs provide flexible clock synthesis for multiple instrument domains, and the 346 I/Os accept front-panel connector signals without external buffering. Commercial 0-85C operation is sufficient for laboratory environments; use the I7N grade for field-test equipment exposed to temperature swings. The 504 Kbit RAM holds captured waveforms between trigger events.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C16F484C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C16F484C7N | EP3C16F484C6N | EP3C16F484I7N | EP3C120F484C7N | EP3C120F484I7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA | 484-BGA - same | 484-BGA - same | 484-BGA - same | 484-BGA - same | 484-BGA - same |
| Logic Elements | 15,408 LE | 15,408 LE | 15,408 LE | 15,408 LE | 119,088 LE | 119,088 LE |
| Speed Grade | 8 (slowest in C-suffix) | 7 (faster) | 6 (fastest C-suffix) | 7 (faster) | 7 (faster) | 7 (faster) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | -40C to +100C (industrial) |
| Embedded Memory | 504 Kbit | 504 Kbit | 504 Kbit | 504 Kbit | 3,888 Kbit | 3,888 Kbit |
| Embedded 18x18 Multipliers | 56 | 56 | 56 | 56 | 576 | 576 |
| User I/O Pins | 346 | 346 | 346 | 346 | 289 | 289 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Commercial temperature rating with speed grade 8 at lowest cost in Cyclone III 484-BGA family (vs EP3C16F484C7N)
- Commercial-only operating temperature range matches benign-environment applications (vs EP3C16F484I7N)
- Right-sized 15K LE density avoids silicon waste vs higher-density 484-BGA siblings (vs EP3C120F484C7N)
설계 노트
The EP3C16F484C8N requires multiple power rails: 1.2 V core (VCCINT), 2.5 V PLL analog (VCCA_PLL), 3.3 V or 2.5 V I/O banks (VCCIO), and a 1.2 V/2.5 V configuration supply (VCCPD). Per the Cyclone III handbook, VCCPD must be powered before or simultaneously with VCCINT to avoid I/O latch-up. Recommended decoupling is at least one 100 uF bulk capacitor per rail plus 0.1 uF and 0.01 uF ceramic capacitors at every power pin pair. Use a power sequencing controller such as TI TPS3808 or Linear LTC2955 to enforce proper rail ramp order.
Estimated: with all 15,408 logic elements switching at 100 MHz at 1.2 V core, the EP3C16F484C8N can dissipate approximately 0.5-1.5 W depending on toggle rate. The 484-BGA package has a theta_JA around 20-25 C/W on a standard 4-layer JEDEC test board with no airflow, yielding a junction temperature rise of 10-40 C above ambient. The commercial grade is rated to 85C ambient, giving ample margin. For industrial designs using EP3C16F484I7N, ensure that junction temperature stays below 100C; consider thermal vias under the BGA and bottom-side copper pours.
The 484-BGA package at 1.0 mm ball pitch requires at least a 4-layer PCB with controlled impedance for clocks, DDR interfaces, and LVDS pairs. Breakout of the inner balls benefits from via-in-pad or dog-bone fan-out. Per the Cyclone III pin connection guidelines, JTAG TCK should be source-terminated to avoid ringing in long chains, and all unused I/O pins must be configured as outputs driving ground (or input with weak pull-up) to prevent floating inputs. The center GND balls serve as both thermal and electrical ground; thermal via arrays under the BGA are essential for heat dissipation.
Common mistakes when designing with EP3C16F484C8N include: (1) leaving VCCPD floating or applying it after VCCINT, which prevents configuration; (2) tying nCONFIG low during power-up without a proper reset supervisor; (3) omitting the CRC check during JTAG programming; (4) failing to set MSEL[3:0] pins to the correct configuration mode (active serial, fast passive parallel, etc.); (5) routing high-speed clocks through non-impedance-controlled traces; (6) using too few ground balls in the BGA fan-out, causing thermal and signal-integrity problems. Verify all settings against the Cyclone III configuration handbook before board fabrication.
규정 준수 정보
RoHS and REACH compliant per Intel/Altera product declaration. The N suffix indicates lead-free packaging. Commercial temperature grade only (0-85C); not AEC-Q100 qualified. Use EP3C16F484I7N for industrial -40C to +100C operation.