EP1AGX60CF484C7N - Arria GX FPGA 60K LE | 484-BGA | Altera
부품 번호: EP1AGX60CF484C7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $185 | $185,000.00 |
EP1AGX60CF484C7N 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy a unique tier in the digital design hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs) yet more deterministic and lower-latency than microcontrollers for parallel DSP and signal-processing workloads. The Arria GX family specifically targets mid-range applications requiring transceivers up to 3.125 Gbps, positioning it between the Cyclone and Stratix families in Altera's portfolio.
Key features of the EP1AGX60CF484C7N include 60,000 typical logic elements (LEs), 2,528,640 RAM bits distributed across embedded memory blocks, 229 maximum user I/O pins split across multiple I/O banks supporting LVDS, LVTTL, and SSTL signaling, and integrated transceivers supporting data rates up to 3.125 Gbps. The device is built on a 90 nm process node and supports commercial-grade operating temperatures. The 484-BGA package provides high-density board interconnect for complex designs while maintaining signal integrity for high-speed serial channels.
Architecturally, the EP1AGX60CF484C7N leverages Altera's embedded transceiver blocks hardened directly into the silicon fabric, eliminating soft SERDES implementations and reducing latency for protocols like PCI Express, Serial RapidIO, and Gigabit Ethernet. The device integrates 4-phase PLL clocks, dedicated clock networks, and rich DSP blocks for multiply-accumulate operations. Designers implement logic using the Quartus II development suite with support for both Verilog and VHDL, plus schematic and IP-block-based design entry.
Typical applications include telecom line cards with serial backplane connectivity, video broadcast and image processing pipelines, PCI Express endpoint cards, and industrial control systems requiring deterministic parallel processing. The combination of moderate logic capacity and high-speed transceivers makes the Arria GX family well-suited for protocol bridging, low-cost serial interface aggregation, and embedded DSP for communications infrastructure.
When designing with this device, ensure the Quartus II tool version supports the 60K LE device; older 5.0 or 5.1 builds may not recognize this part. The 484-BGA requires careful PCB layout with controlled-impedance routing for transceiver channels and adequate power-plane decoupling for the core and I/O rails. Heat dissipation should be evaluated at maximum toggle rates, especially when many transceivers operate simultaneously.
This page synthesizes distributor pricing, same-package Arria GX alternatives with verified pin compatibility, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP1AGX60CF484C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX60CF484C7N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Family, Logic Elements, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX60CF484C6N
✅ 드롭인✓ 재고 있음
$294.4 / 개
데이터시트 보기 →EP1AGX60CF484I7N
✅ 드롭인✓ 재고 있음
$218.75 / 개
데이터시트 보기 →EP1AGX60CF484I6N
✅ 드롭인✓ 재고 있음
$485.25 / 개
데이터시트 보기 →EP1AGX60CF484C7
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1AGX60EF484C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CSXFC6C6U23C7N
✅ 드롭인✓ 재고 있음
$215.8 / 개
데이터시트 보기 →EP1AGX60CF484C7N 최대 정격 & 전기적 특성
| Family | Arria GX |
| Logic Elements | 60,000 |
| Embedded Memory Bits | 2,528,640 |
| Maximum User I/O | 229 |
| 패키지 | 484-BGA (FineLine BGA) |
| Speed Grade | C7 |
| 동작 온도 | Commercial (0C to +85C) |
| Process Node | 90 nm |
| Transceiver Data Rate | up to 3.125 Gbps |
| 실장 유형 | Surface Mount (BGA) |
| Development Tool | Quartus II |
EP1AGX60CF484C7N 484-bga (fineline bga) 핀 구성 가이드
EP1AGX60CF484C7N(484-bga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX60CF484C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX60CF484C7N 적합 용도: 7 애플리케이션s: Telecom Line Cards and Serial Backplane, PCI Express Endpoint Card, Video Broadcast and Image Processing, Industrial Control and Factory Automation, Software Defined Radio (SDR) Baseband, Medical Imaging and Diagnostics Equipment, Aerospace Avionics and Defense Systems.
Telecom Line Cards and Serial Backplane
The EP1AGX60CF484C7N's integrated 3.125 Gbps serial transceivers make it ideal for telecom line cards aggregating multiple serial backplane channels. With 60K logic elements, the device can implement protocol bridging between SERDES links and a parallel backplane interface, while 2.5 Mbit embedded memory provides buffering for packet processing. Placed between physical-layer SERDES and the framer ASIC, the Arria GX handles protocol conversion and rate adaptation with deterministic latency, making it a workhorse for legacy SONET/SDH and Ethernet over SONET equipment.
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PCI Express Endpoint Card
The EP1AGX60CF484C7N is well suited for PCI Express endpoint cards implementing Gen1 (2.5 Gbps) interfaces through its built-in transceivers. The hard PCIe IP core eliminates soft SERDES overhead and the 60K LE fabric is sufficient for endpoint controllers plus DMA engines, register interfaces, and application-layer logic. The 484-BGA package accommodates the PCIe x4 lane mapping and provides signal-integrity headroom for the differential transmit/receive pairs, making it a popular choice for industrial and instrumentation PCIe cards.
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Video Broadcast and Image Processing
With 60K logic elements and rich DSP blocks, the EP1AGX60CF484C7N handles real-time video processing including scaling, deinterlacing, color space conversion, and overlay composition. The 229 user I/O pins support wide parallel video buses (24/30/36-bit RGB/YCbCr) and the embedded memory buffers frame data for pipeline processing. Its transceivers enable SDI (Serial Digital Interface) input/output for professional broadcast equipment, where deterministic processing latency is critical for video synchronization across multiple channels.
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Industrial Control and Factory Automation
The EP1AGX60CF484C7N suits industrial control systems requiring deterministic parallel processing of multiple sensor and actuator interfaces. The 60K LE fabric can host soft-core processors (Nios II), real-time control loops, and custom logic for motor control, while the SERDES channels enable industrial Ethernet protocols like EtherCAT or Profinet. The 484-BGA package provides mechanical robustness for industrial temperature operation with the industrial grade variant, and the device's longevity in long-life industrial programs is supported by Altera/Intel FPGA's product life cycle policy.
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Software Defined Radio (SDR) Baseband
The EP1AGX60CF484C7N's combination of DSP blocks, embedded memory, and SERDES channels suits software-defined radio baseband processing where digital samples must be filtered, decimated, and demodulated in real time. The 60K LE fabric handles multiple DDC (digital down-converter) channels at moderate sample frequencies, while the transceivers interface directly to ADC/DAC devices with serialized LVDS outputs. Designers can implement custom modulation schemes and channelization algorithms, taking advantage of the deterministic latency that FPGA fabric provides over general-purpose DSP processors.
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Medical Imaging and Diagnostics Equipment
Medical imaging systems such as ultrasound front-end processors and MRI data acquisition cards leverage the EP1AGX60CF484C7N's high-speed transceivers and substantial logic capacity for parallel channel processing. The 60K LE fabric supports beamforming algorithms across 32-64 channels simultaneously, while the 2.5 Mbit embedded memory provides per-channel sample buffers. For diagnostic equipment requiring IEC 60601 compliance, designers use the commercial grade with appropriate isolation, while industrial temperature variants support portable diagnostic tools. The deterministic processing latency of FPGA fabric is critical for synchronized multi-channel acquisition.
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Aerospace Avionics and Defense Systems
Defense and aerospace programs with extended lifecycles value the EP1AGX60CF484C7N for radar signal processing, navigation systems, and secure communications. The Arria GX family's transceivers support legacy MIL-STD-1553 bridges, custom RF interfaces, and encrypted datalinks, while the 60K logic capacity handles protocol stacks and baseband processing. For airborne applications requiring extended temperature operation, the industrial-grade variant (EP1AGX60CF484I7N) is preferred. Designers in this segment value FPGAs over ASICs for late-stage specification changes and ITAR compliance documentation tracking.
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추천 제품 요약
엔지니어링 참조 데이터: EP1AGX60CF484C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX60CF484C6N | EP1AGX60CF484I7N | EP1AGX60CF484I6N | EP1AGX60CF484C7 | EP1AGX60EF484C7N | 5CSXFC6C6U23C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (UBGA) |
| Logic Elements | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 | ~110,000 (Cyclone V) |
| Speed Grade | -7 | -6 | -7 | -6 | -7 | -7 | -7 (Cyclone V) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial |
| Transceiver Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 5 Gbps (Cyclone V GT) |
| Embedded Memory | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | ~5,000 Kbits (Cyclone V) |
| Maximum User I/O | 229 | 229 | 229 | 229 | 229 | 229 | varies by variant |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 28 nm (Cyclone V) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active |
주요 차별점
- Fastest speed grade in 60K LE Arria GX 484-BGA family (vs EP1AGX60CF484C6N)
- Commercial temperature grade for cost-sensitive applications (vs EP1AGX60CF484I7N)
- Larger logic capacity than smaller density Arria GX siblings (vs EP1AGX35CF484C6)
- Mature Arria GX family with extensive IP ecosystem (vs 5CSXFC6C6U23C7N (Cyclone V))
설계 노트
The 484-ball FineLine BGA package requires careful PCB layout with microvia stack-ups and controlled-impedance routing for transceiver channels. Per Altera application notes, place power and ground vias directly beneath the package within the BGA pattern to provide low-inductance decoupling for the core and I/O rails. Use a 4-6 layer stack-up with dedicated ground planes adjacent to signal layers for the SERDES signals; transmit and receive pairs should maintain 100 ohm differential impedance with matched length (within 150 mils) across each pair.
Power dissipation for the EP1AGX60CF484C7N at maximum toggle rates with all transceivers active can reach 5-8W. The 484-BGA package theta_JA is typically in the 15-20 C/W range with adequate PCB copper; designers should provide thermal vias to inner ground planes and consider forced-air cooling for enclosed chassis. Estimated junction temperature rise at 6W with 18 C/W theta_JA is approximately 108C above ambient, which exceeds commercial grade limits without airflow - thermal simulation is recommended for production designs.
Decoupling capacitor placement is critical for BGA FPGAs. Per the Arria GX Device Handbook, place 0.1 uF and 0.01 uF ceramic capacitors on the underside of the PCB directly beneath the BGA, with each decoupling cap serving within a 2-3 ball distance of the power pins it services. Use multiple bulk capacitors (47-220 uF) on each power rail (VCCINT, VCCIO, VCCA) placed at the periphery of the BGA pattern. Maintain short and wide traces from capacitors to power balls; the inductance of vias and traces dominates decoupling effectiveness at high frequencies.
Transceiver channels require matched-length routing and tight impedance control. Per Altera guidelines, route each SERDES TX/RX pair with intra-pair skew less than 150 mils and use continuous ground reference on adjacent layers. Avoid routing SERDES signals across plane splits or near noisy digital signals; if layer transitions are unavoidable, place ground return vias near signal vias to maintain return path continuity. For PCI Express designs, follow the PCIe CEM specification routing guidelines for 2.5/5 Gbps signaling.
Common design mistakes include: (1) failing to set all unused I/O pins to analog or input tri-state per the datasheet, which can cause excessive current draw; (2) using unsupported configuration modes or wrong MSEL[3:0] settings leading to configuration failures; (3) ignoring the JTAG chain order in multi-device configurations, which can lock up the entire chain; and (4) forgetting to enable internal weak pull-ups on configuration pins if external pull resistors are not provided. Always verify the Quartus II pin assignments against the device datasheet pin table before PCB fabrication.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status not directly verified from provided data; mark as unknown. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive qualified part per the standard. Designers needing automotive-grade FPGAs should consult the Altera/Intel FPGA automotive product line.