EP3C16U256C8 - 15,408-LC Cyclone III FPGA | Intel
부품 번호: EP3C16U256C8 ✗ 단종EP3C16U256C8 개요
An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after manufacture. Within the semiconductor hierarchy, an FPGA is a programmable logic device, combining digital logic blocks, embedded block RAM, programmable interconnects, and user I/O. It differs from a fixed-function application-specific integrated circuit because its behavior is defined by a configuration bitstream rather than permanent circuitry.
The Cyclone III architecture provides 15,408 logic elements organized into 963 logic array blocks, together with 516,096 bits of embedded memory. The device provides 168 I/O, as listed by DigiKey, and is available in the compact 256-ball package described by the verified distributor data. These resources support parallel digital logic, control, data acquisition, signal processing, embedded-memory, and interface-intensive designs.
The EP3C16U256C8 belongs to the EP3C16 device family, whose 16 designation corresponds to the 15,408 logic elements and 963 logic array blocks reported by the distributor sources. Its combination of a 256-ball package and 168 available I/O makes it suitable for designs requiring moderate logic density, substantial embedded memory, and a comparatively high pin count in a compact board footprint.
Typical uses include industrial control, data-acquisition systems, communications equipment, embedded signal-processing modules, video and image pipelines, and general-purpose programmable-logic prototypes. Because it uses nonvolatile configuration memory, the device can retain its programmed logic across power cycles, allowing autonomous operation without an external configuration controller once the configuration image is stored.
Board design must account for power sequencing, decoupling, signal integrity, thermal performance, and configuration-data integrity. The BGA-256 footprint requires careful escape routing, while high-speed interfaces demand controlled impedance and return paths. Designers should also confirm the exact power, temperature, and pinout requirements against the manufacturer documentation before layout or substitution.
This page consolidates the verified distributor specifications, source links, pricing evidence, package data, same-family replacement candidates, and practical selection guidance for engineers evaluating the Intel EP3C16U256C8.
드롭인 대체품: EP3C16U256C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C16U256C8 (동일 폼 팩터 및 풋프린트) — 차이점: Logic Elements, Package, RoHS Status.
EP3C16F256C8
✅ 드롭인가격 문의
데이터시트 보기 →EP3C16F256C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C10U256C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C16U256C8N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP3C16U256C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C16U256C8 최대 정격 & 전기적 특성
| Device Type | Cyclone III field-programmable gate array (FPGA) |
| Logic Elements | 15,408 logic elements |
| Logic Array Blocks | 963 LABS |
| Embedded Memory | 516,096 bits |
| User I/O | 168 I/O |
| 패키지 | 256-ball UFBGA package |
| Package Code | FBGA |
| Package Dimensions | 14 x 14 mm |
| Package Height | 2.20 mm |
| Ball Pitch | 0.80 mm |
| Terminal Form | Ball |
| Terminal Count | 256 terminals |
| Package Shape | Rectangular |
| Technology | CMOS |
| Temperature Grade | Commercial |
| Manufacturer | Intel |
| RoHS 상태 | Compliant |
| Core Supply Voltage | 1.2 V |
EP3C16U256C8 rectangular 핀 구성 가이드
EP3C16U256C8(rectangular 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C16U256C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C16U256C8 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Data-Acquisition Systems, Communications and Protocol Conversion, Video and Image Processing, Signal Processing and Filtering, Programmable Logic Prototyping.
Industrial Control and Automation
The EP3C16U256C8 fits machine-control and factory-automation logic because its 15,408 logic elements and 963 logic array blocks support parallel control functions, while 168 I/O provide substantial board-level connectivity. It can combine sequencing, interlocks, counter, and timer logic without relying on a fixed control program. The 516,096 bits of embedded memory are useful for state histories, communication buffers, and local data tables. Because the verified device is a commercial-grade part, designers must confirm whether its specified temperature range satisfies the installation environment and whether every I/O standard matches the field wiring.
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Data-Acquisition Systems
For data-acquisition modules, the EP3C16U256C8 can collect control signals, coordinate multiple converters, and perform real-time digital filtering in programmable logic. Its 168 I/O provide ample channel-select and status connections, while 516,096 embedded memory bits can hold sample buffers, calibration tables, or intermediate filter data. The 15,408 logic elements allow acquisition control and parallel processing to coexist in one device. Designers should budget timing closure for sampling-clock distribution and verify converter interface voltages against the exact EP3C16U256C8 package and I/O specifications before PCB release.
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Communications and Protocol Conversion
The EP3C16U256C8 is suitable for communications adapters that need configurable framing, data routing, buffering, and interface timing. Its 963 logic array blocks can implement parallel state machines and protocol engines, while the 516,096-bit embedded memory can support packet queues or dual-port buffering. The 168 I/O make it practical to combine multiple parallel interfaces with control signals. Clocking and interface qualification remain essential: engineers must confirm pin multiplexing, supported I/O standards, clock-pin assignment, and timing margins against the official package documentation.
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Video and Image Processing
The EP3C16U256C8 can support parallel pixel pipelines, test-pattern generation, color processing, and image pre-filtering when the design does not require a higher-end video processor. Its 15,408 logic elements provide parallel datapath capacity, and 516,096 embedded memory bits can serve as line buffers or intermediate storage. The 168 I/O allow direct connection to parallel sensors and display interfaces. Video designs must nevertheless account for pixel-clock timing, horizontal and vertical blanking, I/O-voltage compatibility, and external memory requirements if frame buffers exceed the device's embedded-memory capacity.
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Signal Processing and Filtering
The EP3C16U256C8 is appropriate for fixed-point filtering, correlation, modulation, and real-time signal conditioning where parallel arithmetic is useful. Its 15,408 logic elements allow multiple arithmetic pipelines to operate concurrently, while the embedded memory can hold coefficients, delay lines, or captured samples. The 168-I/O device also provides room for sample buses, control signals, and status monitoring. To realize predictable performance, the design should use supported clock resources, respect routing-delay limits, and verify coefficient storage and I/O timing through static timing analysis.
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Programmable Logic Prototyping
The EP3C16U256C8 works well for education, prototyping, and subsystem development because 15,408 logic elements, 963 logic array blocks, 516,096 memory bits, and 168 I/O provide substantial design space in one 256-ball package. Engineers can implement processor peripherals, custom instruction pipelines, interfaces, and test logic before consolidating functions into an ASIC or higher-density device. The package still demands careful BGA layout, so prototype boards should include accessible programming connectors, robust power distribution, and test points for clock, reset, configuration, and diagnostic signals.
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추천 제품 요약
엔지니어링 참조 데이터: EP3C16U256C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C16F256C8 | EP3C16F256C7N | EP3C10U256C8N | EP3C16U256C8N | EP3C16U256C7N |
|---|---|---|---|---|---|---|
| Package | 256-ball UFBGA, 14 x 14 mm | 256-ball UFBGA | 256-ball UFBGA | 256-ball UFBGA | 256-ball UFBGA | 256-ball UFBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| FPGA Family | Cyclone III | Cyclone III EP3C16 | Cyclone III EP3C16 | Cyclone III EP3C10 | Cyclone III EP3C16 | Cyclone III EP3C16 |
| Speed Grade | C8 | C8 | C7 | C8 | C8 | C7 |
주요 차별점
- Substantial programmable logic in a compact 256-ball package (vs EP3C10U256C8N)
- C8 speed-grade ordering (vs EP3C16F256C7N)
- Documented 168-I/O connectivity (vs EP3C16F256C8)
설계 노트
Treat the EP3C16U256C8 as a 256-ball BGA rather than a conventional leaded package. Route every ball through the manufacturer-recommended escape geometry, use a multilayer stack-up with continuous reference planes, and place decoupling capacitors close to the identified power balls. Do not infer power or ground positions from a generic BGA drawing because the EP3C16U256C8 has a device-specific 256-ball assignment.
Reserve controlled-impedance routing for clocks and high-speed external interfaces, and provide continuous return paths beneath each signal. Keep configuration, reset, and validation signals away from noisy switching nets when practical. Before layout release, compare every proposed signal against the exact package pinout, I/O-standard support, clock-capable pins, and configuration restrictions documented for the selected Intel device and speed grade.
Use the EP3C16U256C8's verified 1.2 V core supply as one part of the complete power architecture, but do not infer every I/O and auxiliary voltage from that value. Separate core and I/O rails where required, account for startup current in the supply design, and place bulk and high-frequency decoupling at the device. Confirm recommended capacitor values, voltage tolerances, sequencing rules, and power-up behavior against the official manufacturer documentation.
Do not treat a shared Cyclone III family name as proof of interchangeability. The EP3C16F256C8, EP3C16F256C7N, and EP3C10U256C8N candidates differ in device identifier, speed grade, or resource tier, and their extracted excerpts do not establish every pin as compatible. Validate configuration pins, I/O standards, core voltage, memory resources, clock pins, and package drawing before approving any substitution for production.
규정 준수 정보
RoHS compliance is explicitly identified by the LCSC product result. The supplied excerpts do not establish REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
