EP3C25Q240C8 - Cyclone III FPGA, 24624 LE | Intel
부품 번호: EP3C25Q240C8 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $79.42 | $79.42 |
| 10 | $79.42 | $794.20 |
| 96 | $79.42 | $7,624.32 |
| 500 | $79.42 | $39,710.00 |
| 1,000 | $79.42 | $79,420.00 |
EP3C25Q240C8 개요
An FPGA, or Field Programmable Gate Array, is an integrated circuit whose logic fabric can be configured after manufacturing to implement custom digital circuits. FPGAs sit above ASICs in flexibility and below MCUs in sequential processing convenience: instead of executing software instructions, an FPGA creates parallel hardware logic such as counters, state machines, DSP datapaths, memory controllers, and bus interfaces. The EP3C25Q240C8 belongs to the Cyclone III family, which is optimized for low-cost, high-volume applications requiring substantial programmable logic with moderate power consumption.
Key verified parameters include 24,624 logic elements, 608,256 total RAM bits, 148 user I/O signals, a 240-lead PQFP/BFQFP package, and a maximum internal frequency of approximately 472.5 MHz. These values are captured from distributor and datasheet-aggregator listings. The 240-pin package supports enough external connections for broad interfacing while remaining routeable on conventional low-cost multilayer PCBs. The 0.50 mm lead pitch and 34.60 x 34.60 mm body allow standard surface-mount assembly equipment to be used throughout production.
Cyclone III devices implement their programmable fabric using look-up-table-based logic elements, dedicated memory blocks, and embedded multiplier resources. In this EP3C25 density, the 608,256 RAM bits provide local data storage and FIFO support, while the logic elements allow parallel functions to operate at internal clock rates approaching 472 MHz. The commercial-grade C8 version is typically used in controlled indoor environments where high-speed data processing, protocol bridging, and custom state-machine logic must be implemented without the non-recurring engineering cost of an ASIC.
Typical applications include industrial automation control, communication protocol bridging, video and image processing, laboratory instrumentation, medical diagnostics, and edge-oriented FPGA systems. The high I/O count and moderate density make the EP3C25Q240C8 a practical bridge between low-end CPLDs and larger, more expensive FPGAs. For systems requiring a Nios II soft processor, the RAM and logic resources are also sufficient to implement small embedded processor subsystems alongside custom peripherals.
When designing with the EP3C25Q240C8, verify the exact core and I/O supply voltages from the Cyclone III device handbook, and place decoupling capacitors close to every power pin. Because the part is an SRAM-based FPGA, a configuration memory such as an EPCS or EPCQ device, or a JTAG download path, is mandatory for a self-starting board. Plans for speed grade, temperature range, and lead-free assembly should be confirmed before layout begins.
This page synthesizes distributor-level pricing, drop-in EP3C25 family alternatives, and practical FPGA board design notes that are not all present on a standard distributor product page. It is intended to give engineers a compact starting point for procurement and design review while directing them to the official Cyclone III documentation for detailed electrical specifications.
드롭인 대체품: EP3C25Q240C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C25Q240C8 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Logic Elements, Maximum User I/O, Process Node.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C25Q240C8N
✅ 드롭인✓ 재고 있음
$160.4667 / 개
데이터시트 보기 →EP3C25Q240C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C25Q240C7
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C25Q240I7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C25Q240I7
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C25Q240C8 최대 정격 & 전기적 특성
| FPGA Family | Cyclone III |
| Logic Elements | 24,624 |
| RAM Bits | 608,256 |
| User I/O Count | 148 |
| Package Type | 240-PQFP / 240-BFQFP |
| Package Body Size | 34.60 x 34.60 mm |
| Package Height | 4.10 mm |
| Package Pitch | 0.50 mm |
| 핀 수 | 240 |
| Internal Frequency | 472.5 MHz (472 MHz nominal) |
| Device Type | FPGA |
| CMOS Process | Low-cost CMOS FPGA |
| Speed Grade | 8 (indicated by C8 suffix) |
| Temperature Grade | Commercial (indicated by C suffix) |
| 실장 유형 | Surface Mount |
EP3C25Q240C8 0.50 mm 핀 구성 가이드
EP3C25Q240C8(0.50 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C25Q240C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C25Q240C8 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Communications and Networking Equipment, Video and Image Processing, Test and Measurement Instruments, IoT Edge and Embedded FPGA Controllers, Medical Diagnostic Electronics.
Industrial Control and Automation
The EP3C25Q240C8 fits industrial control systems because its 148 user I/Os can capture multiple encoder channels, limit switches, and PLC-style inputs while 24,624 logic elements execute parallel PID loops, PWM generation, and interlock logic without burdening a host CPU. The 608,256 RAM bits create small FIFOs and status buffers, and the PQFP package keeps board cost lower than fine-pitch BGA while still providing enough routing for isolated I/O. Pair the FPGA with serial configuration memory for a low-cost active-serial boot chain. For lower-I/O high-volume variants, a smaller family device may be considered after rechecking the pin plan.
추천
Communications and Networking Equipment
The EP3C25Q240C8 provides 24,624 logic elements for packet parsing, checksum engines, queue management, and custom framing, while the 608,256 RAM bits implement packet buffers, FIFOs, and descriptor tables. With 148 user I/Os, the FPGA can connect parallel Ethernet MAC/PHY buses such as MII and RMII, external SRAM, or SDRAM controllers implemented in fabric. The device does not include hardened high-speed transceivers, so line-rate interfaces above 1 Gbps require external PHYs or SERDES devices. The 0.50 mm pitch QFP is manageable in mixed-signal boards and supports moderate-density protocol bridging and industrial communication gateways.
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Video and Image Processing
This Cyclone III FPGA is well suited to video capture and display processing because 24,624 logic elements can execute Bayer interpolation, color-space conversion, and filter kernels at pixel rates, while 608,256 RAM bits act as line buffers or small frame-delay memories. The 148 user I/Os connect parallel CMOS image sensors, TTL/LVDS display interfaces, and memory buses directly. The commercial C8 grade supports internal pipeline clocks up to roughly 472 MHz, which is adequate for many 720p and 1080p HD preprocessing tasks. A 240-pin PQFP lowers prototype PCB cost compared with BGA while preserving usable routing channels for a video board.
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Test and Measurement Instruments
With 24,624 logic elements and 148 user I/Os, the EP3C25Q240C8 can implement acquisition sequencers, trigger comparators, digital counters, and data formatting logic in parallel. The 608,256 RAM bits buffer high-speed samples before handoff to a host processor or DSP. The 240-pin PQFP package simplifies board probing, manual rework, and low-volume instrument assembly. Its reported 472.5 MHz internal frequency supports high-speed digital front ends in oscilloscopes, logic analyzers, signal generators, and custom laboratory equipment. For larger channel counts and denser routing, a BGA package will be needed, but the commercial C8 QFP is a low-cost starting point.
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IoT Edge and Embedded FPGA Controllers
For edge nodes that need deterministic deterministic I/O, protocol bridging, and custom sensor processing, the EP3C25Q240C8 can host a Nios II soft processor together with custom accelerators. The large 24,624-logic-element fabric is more than simple glue logic, but it allows implementing multiple UART, SPI, I2C, and parallel sensor buses with a 148-pin interface. The RAM bits support processor cache, FIFOs, and local data storage. The PQFP package is easy to route on four-layer IoT PCBs. Since an SRAM-based FPGA does not retain its image, an EPCS or EPCQ configuration flash is required for standalone edge devices, with the option of remote update logic in the FPGA.
추천
Medical Diagnostic Electronics
Medical diagnostic devices often need deterministic parallel data acquisition and control. The EP3C25Q240C8 can handle front-end sequencing, sample averaging, and system-level I/O in instruments such as ultrasound controllers, imaging equipment, or laboratory analyzers. Its 148 user I/Os connect ADCs, DACs, motor drivers, and host interfaces, while the 608,256 RAM bits buffer acquired data. For controlled indoor medical environments, the commercial C8 grade may be sufficient, but any external temperature extremes require an industrial-grade I-variant. Medical compliance comes from the full board and system design, not from the FPGA alone; isolate safety-critical functions and always conduct a full risk review.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C25Q240C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C25Q240C8N | EP3C25Q240C7N | EP3C25Q240C7 | EP3C25Q240I7N | EP3C25Q240I7 |
|---|---|---|---|---|---|---|
| Package | 240-PQFP / BFQFP | 240-PQFP / BFQFP - same | 240-PQFP / BFQFP - same | 240-PQFP / BFQFP - same | 240-PQFP / BFQFP - same | 240-PQFP / BFQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 |
| Total RAM Bits | 608,256 | 608,256 | 608,256 | 608,256 | 608,256 | 608,256 |
| User I/O Count | 148 | 148 | 148 | 148 | 148 | 148 |
| Speed Grade | 8 | 8 | 7 | 7 | 7 | 7 |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Industrial (I) | Industrial (I) |
주요 차별점
- Original commercial C8 orderable in a leaded / non-N finish (vs EP3C25Q240C8N)
- Speed grade 8 selected for cost-sensitive timing margins (vs EP3C25Q240C7N)
- Commercial temperature range for controlled indoor environments (vs EP3C25Q240I7N)
설계 노트
Estimated: Cyclone III FPGAs typically use a 1.2 V core supply, but this value must be confirmed from the Cyclone III device handbook before design. Use a dedicated regulator or power module and place multiple 0.1 uF and 1 uF ceramic capacitors around the FPGA power pins. Ensure the printed circuit board has solid power and ground planes under the PQFP body to minimize core voltage noise and ground bounce during simultaneous switching outputs.
EP3C25Q240C8 is an SRAM-based FPGA; it must be configured at power-up from an external configuration device or through JTAG. For production, use an Intel/Altera EPCS or EPCQ serial flash device and set the MSEL pins to the correct active-serial mode. Include a pull-up network and a JTAG header for in-circuit debugging. If remote update is required, reserve additional configuration logic and a safe fallback image in flash.
The EP3C25Q240C8 comes in a 0.50 mm pitch, 240-pin PQFP/BFQFP body measuring 34.60 mm per side. For assembly, use a stencil aperture design that balances solder volume between the fine-pitch perimeter leads and any large thermal pad. Route high-speed user I/Os with controlled impedance when connecting to memory or communication interfaces, and keep the FPGA configuration pins away from noisy switching signals. Use thermal relief connections to internal planes while maintaining enough copper for power delivery.
A common FPGA design error is assigning I/O without reviewing per-pin VCCIO bank requirements. The 148 user I/Os are divided into I/O banks; assign each bank a voltage compatible with the interface. Never connect 5 V logic directly to Cyclone III I/O unless the device handbook explicitly permits 5 V tolerance. Also verify that every configuration, JTAG, and dedicated clock pin is connected even if unused, because floating dedicated pins can cause unexpected behavior.
규정 준수 정보
EP3C25Q240C8 does not carry the N lead-free suffix seen on EP3C25Q240C8N. The fetched snippets do not contain an explicit RoHS or lead-free statement for the targeted non-N variant, so compliance values are left unknown until verified from the manufacturer datasheet or an authorized distributor.
