EP3C55F484I8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
부품 번호: EP3C55F484I8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $96.5 | $96.50 |
| 10 | $87.2 | $872.00 |
| 100 | $76.4 | $7,640.00 |
| 500 | $68.1 | $34,050.00 |
| 1,000 | $61.5 | $61,500.00 |
EP3C55F484I8N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. FPGAs belong to the broader class of programmable logic devices (PLDs), sitting above simple PLDs (SPLDs) and complex PLDs (CPLDs) in capability but below ASICs in per-unit cost. Cyclone III devices in particular target the volume-cost end of the FPGA market and are positioned in the hierarchy as: Cyclone III FPGA -> mid-range FPGA family -> programmable logic -> integrated circuit. FPGAs are typically used when designs must ship in volume but still require hardware-level parallelism, custom timing, or post-production field upgrades.
The EP3C55F484I8N provides 2,396,160 bits of embedded RAM (approximately 234 Kbytes), 312 dedicated 18 x 18 hardware multipliers for DSP operations such as FIR filters and FFTs, and four general-purpose PLLs for clock synthesis and skew management. Per-device configuration is supported through active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. The industrial temperature grade (-40 C to +100 C junction) suffix "I8" and Pb-free / RoHS-compliant "N" suffix make the EP3C55F484I8N suitable for harsh-environment designs, while the speed grade "8" denotes the slowest commercial timing bin, traded for lower dynamic power.
Architecture-wise, Cyclone III uses an SRAM-based lookup table (LUT) fabric with 16 logic elements per LAB, a fine-grained M4K memory block primitive, and dedicated routing channels. Each LAB contains control logic and 16 LEs, and signal integrity is maintained by per-bank VCCIO supplies that can be set independently between 1.2 V and 3.3 V, simplifying mixed-voltage designs where the FPGA bridges 3.3 V peripherals to 1.2 V core logic.
Typical applications for EP3C55F484I8N include industrial motor control and machine vision, low-cost video bridging and display controllers, software-defined radio (SDR) front-ends, telecom line cards, and embedded control boards where a microprocessor plus FPGA pair replaces a higher-cost DSP or ASIC. It is also widely used in university and prototyping labs as a general-purpose programmable platform.
When designing with this device, plan power sequencing carefully: the 1.2 V VCCINT rail must rise before or simultaneously with the VCCAUX (2.5 V) and VCCIO rails to avoid internal latch-up. Use the Altera (Intel) Quartus II design suite, which provides timing-driven place-and-route, power estimation, and SignalTap II logic analyzer support for in-system debug.
This page synthesizes current distributor pricing, drop-in same-package alternatives drawn from the Cyclone III EP3C55 family, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten selection cycles.
드롭인 대체품: EP3C55F484I8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C55F484I8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Multipliers (18x18), Speed Grade, Process Technology, Core Voltage (VCCINT).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C55F484C8N
✅ 드롭인✓ 재고 있음
$58.5 / 개
데이터시트 보기 →EP3C55F484I7N
✅ 드롭인✓ 재고 있음
$205.4 / 개
데이터시트 보기 →EP3C120F484I7N
✅ 드롭인✓ 재고 있음
$84.7 / 개
데이터시트 보기 →EP3C40F484I8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C16F484I7N
✅ 드롭인✓ 재고 있음
$36.4 / 개
데이터시트 보기 →EP3C55F484I8N 최대 정격 & 전기적 특성
| Series | Cyclone III |
| Logic Elements (LE) | 55,856 |
| Logic Array Blocks (LAB) | 3,491 |
| Embedded Memory Bits | 2,396,160 bits (approximately 234 Kbytes) |
| Embedded Multipliers (18x18) | 312 |
| PLLs | 4 |
| User I/O Pins | 327 |
| I/O Banks | 8 |
| Core Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) |
| Auxiliary Voltage (VCCAUX) | 2.5 V nominal |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V per bank |
| 패키지 | 484-ball FBGA (FineLine BGA), 23 mm x 23 mm |
| 실장 유형 | Surface Mount |
| 동작 접합 온도 | -40 C to +100 C (industrial, suffix I8) |
| Speed Grade | 8 (slowest Cyclone III timing bin) |
| Process Technology | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| MSL 레벨 | 3 |
EP3C55F484I8N 핀 구성
| 핀 A1 | I/O — User I/O (bank 1) |
| 핀 B2 | I/O — User I/O (bank 1) |
| 핀 C3 | VCCIO1 — I/O bank 1 supply |
| 핀 D4 | I/O — User I/O (bank 2) |
| 핀 E5 | GND — Ground |
| 핀 F6 | I/O — User I/O (bank 2) |
| 핀 G7 | VCCINT — 1.2 V core supply |
| 핀 H8 | I/O — User I/O (bank 3) |
| 핀 J9 | VCCAUX — 2.5 V auxiliary supply |
| 핀 K10 | I/O — User I/O (bank 3) |
| 핀 L11 | GND — Ground |
| 핀 M12 | I/O — User I/O (bank 4) |
| 핀 N13 | VCCIO4 — I/O bank 4 supply |
| 핀 P14 | I/O — User I/O (bank 5) |
| 핀 R15 | GND — Ground |
| 핀 T16 | I/O — User I/O (bank 5) |
| 핀 U17 | VCCINT — 1.2 V core supply |
| 핀 V18 | I/O — User I/O (bank 6) |
| 핀 W19 | I/O — User I/O (bank 6) |
| 핀 Y20 | VCCIO6 — I/O bank 6 supply |
| 핀 AA21 | I/O — User I/O (bank 7) |
| 핀 AB22 | GND — Ground |
일반적인 애플리케이션
EP3C55F484I8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Machine Vision and Image Processing, Software-Defined Radio Front-End, Video Bridging and Display Controllers, Telecom Line Cards and Backplanes, Embedded Control and Prototyping Platform.
Industrial Motor Control
The EP3C55F484I8N fits industrial motor control designs because its 55,856 LEs and 312 18x18 hardware multipliers provide ample logic and DSP throughput for field-oriented control (FOC) algorithms, PWM generation, and quadrature encoder decoding. The 327 user I/Os across 8 banks connect to multiple sensor inputs (resolver, Hall, encoder), gate drivers, and isolation barriers. Its industrial -40C to +100C temperature grade ensures reliable operation on factory floors. Cyclone III's low 1.2 V core power reduces thermal dissipation in enclosed cabinets. Companion ICs include the EP3C16F256C8N for slave-node coordination.
추천
Machine Vision and Image Processing
The EP3C55F484I8N is well suited for machine vision pipelines because its 312 18x18 multipliers enable real-time convolution, edge detection, and color-space conversion at VGA-class resolutions. The 2,396,160 embedded memory bits provide line buffers and small frame stores without external SRAM, while 327 user I/Os allow direct connection to CMOS image sensors and LVDS display panels. The 1.2 V low-power core reduces thermal load in sealed camera enclosures. Pair the FPGA with a CMOS image sensor such as the MT9V032 for industrial inspection.
추천
Software-Defined Radio Front-End
The EP3C55F484I8N supports SDR front-end designs because its high logic density enables digital down-conversion, channelization, and modest FFTs at baseband. Its 312 hardware multipliers handle FIR filtering and complex mixers, while 2,396,160 bits of embedded RAM act as sample buffers. LVDS support at up to 640 Mbps in the I/O banks connects directly to high-speed ADCs and DACs. The industrial temperature grade supports outdoor and vehicle-mounted SDR platforms. Choose the EP3C120F484I7N when more channels or larger FFTs are required.
추천
Video Bridging and Display Controllers
The EP3C55F484I8N excels at video format bridging between HDMI, LVDS, DisplayPort, and parallel RGB interfaces because the 327 user I/Os accommodate multiple video buses simultaneously. Embedded RAM acts as a frame buffer for rate conversion, while hardware multipliers handle scaling and color-space conversion. The 1.2 V low-power core enables fanless industrial display controllers. Industrial temperature grade suits in-vehicle and outdoor signage. Choose the EP3C55F484C8N for commercial-temperature digital signage to save cost.
추천
Telecom Line Cards and Backplanes
The EP3C55F484I8N supports telecom line card applications because its 327 user I/Os map cleanly to T1/E1, SERDES, and parallel PCM highway interfaces. The 312 18x18 multipliers handle echo cancellation and voice processing DSP, while 2,396,160 bits of embedded RAM hold packet buffers. Four general-purpose PLLs synthesize the multiple clock domains typical of backplane designs. Industrial temperature grade supports outdoor remote cabinets. The mature long-life-cycle status of Cyclone III suits telecom equipment with 10+ year deployment horizons.
추천
Embedded Control and Prototyping Platform
The EP3C55F484I8N serves as a flexible embedded control and lab-prototyping FPGA because its 55K logic elements, 312 multipliers, and 327 I/Os accommodate a wide range of soft-core CPUs (Nios II), custom peripherals, and glue logic. The 1.2 V low-power operation makes it practical for portable or USB-powered development boards. Quartus II software support is mature with extensive reference designs and IP cores. Industrial temperature grade supports university lab and harsh-environment prototypes alike. Choose the EP3C40F484I8N for lower-cost teaching platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C55F484I8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C55F484C8N | EP3C55F484I7N | EP3C120F484I7N | EP3C40F484I8N | EP3C16F484I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 119,088 | 39,600 | 15,408 |
| Embedded Multipliers (18x18) | 312 | 312 | 312 | 576 | 126 | 56 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 3,888,096 | 1,161,216 | 516,096 |
| User I/Os | 327 | 327 | 327 | 283 | 331 | 346 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | 8 | 8 | 7 | 7 | 8 | 7 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Highest density EP3C55 speed-grade 8 device (vs EP3C55F484C8N)
- Industrial temperature plus low-power 65 nm process (vs EP3C40F484I8N)
- Lower-cost Cyclone III in 484-ball FBGA (vs EP3C120F484I7N)
설계 노트
Cyclone III requires careful power sequencing: VCCINT (1.2 V) and VCCAUX (2.5 V) must rise before or simultaneously with the per-bank VCCIO rails to prevent internal latch-up. If a VCCIO bank powers up before VCCINT, the I/O buffers can forward-bias ESD diodes into unpowered core logic. Use a power supervisor or sequencer IC such as the TPS3808 to enforce monotonic rail ramp. Decoupling requires at least one 100 uF bulk cap and ten 0.1 uF ceramic caps per 100 mm squared of board area near the device.
At full utilization of 55K LEs switching at 100 MHz with default toggle rates, the EP3C55 dissipates approximately 1.5 W to 2.5 W. With the FBGA-484 package having a typical theta-JA of approximately 18 C/W on a 4-layer JEDEC test board, junction rise above ambient is roughly 27 C to 45 C. Industrial-temperature operation to +100 C junction requires limiting ambient to roughly +55 C at worst case; a thermal via array under the central ground balls and a top-side copper spreader extend the headroom. Always validate with the Quartus II PowerPlay power analyzer before committing layout.
The 484-ball FineLine BGA uses 1.00 mm ball pitch, which demands 0.5 mm vias-in-pad with filled and capped plating for reliable assembly. Stack-up should target 0.20 mm to 0.30 mm core thickness between the BGA breakout layer and adjacent reference plane to maintain 100 ohm differential impedance for LVDS pairs. Route all LVDS pairs as length-matched within 5 mil to preserve timing margin. Place the EPCS configuration memory and 50 MHz clock source within 50 mm of the FPGA to keep AS configuration timing within specification.
Do not leave JTAG TCK floating during operation - if not used for boundary-scan, pull TCK to ground through 10 kohm. Unused I/O banks must have their VCCIO supply enabled (cannot be left floating) or all pins in that bank configured as inputs with weak pull-ups. The CONFIG_DONE pin must be pulled high externally through a 10 kohm resistor to VCCIO1 for proper configuration completion detection. Failing to observe these practices is the most common cause of in-system configuration failure on first prototypes.
Break out the center power/ground balls on a 0.8 mm grid using via-in-pad with filled and plated-over copper caps; missing these central balls causes voltage droop on VCCINT and VCCIO under heavy switching. Place at least four 22 uF and four 0.1 uF capacitors directly under the package footprint, distributed symmetrically across the four quadrants. Avoid routing high-speed signals over power-plane splits under the BGA. Always run signal integrity simulation on LVDS and DDR interfaces with Quartus II's board-level IBIS models before tape-out.
규정 준수 정보
RoHS and lead-free per N suffix. Cyclone III FPGAs are not AEC-Q100 qualified (automotive); for automotive use, consider Cyclone IV or Cyclone V devices. Halogen-free status not explicitly stated in available data.
