EP3C55F484C8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel / Altera
부품 번호: EP3C55F484C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $86.4 | $86.40 |
| 10 | $81.12 | $811.20 |
| 100 | $72 | $7,200.00 |
| 500 | $64.8 | $32,400.00 |
| 1,000 | $58.5 | $58,500.00 |
EP3C55F484C8N 개요
A Cyclone III FPGA is a SRAM-configurable logic device positioned in the low-cost FPGA tier, below the Stratix and Arria families. Cyclone III belongs to the broader FPGA hierarchy: programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA. The family targets cost-sensitive applications such as industrial control, video processing, and communications infrastructure where Stratix-class performance is unnecessary but a true programmable fabric is still required.
Key features include 55856 logic elements, 2396160 embedded memory bits distributed across M9K blocks, 4 PLLs for clock management, and 343 multiplier blocks (18x18) enabling DSP functions without external multipliers. Per the Alldatasheet entry the package is described as 23 x 23 mm FBGA-484 with 2.60 mm height and 1 mm pitch, lead-free, and the device is RoHS compliant. The Cyclone III family uses a 65 nm TSMC process that delivers significantly lower static and dynamic power than the prior Cyclone II generation while preserving pin compatibility in many footprints.
Typical applications span industrial motor and machine control, video surveillance and image processing, software-defined radio front-ends, low-cost ASIC prototyping, automotive infotainment ECUs, and consumer display controllers. The 327 I/O and rich DSP blocks also make the part a frequent choice for educational FPGA development kits and university digital logic labs.
When designing with the EP3C55F484C8N, place all VCCINT and VCCA decoupling capacitors within a few millimetres of the balls, use at least 4 signal layers to escape the dense 1.0 mm pitch BGA, and respect the Quartus II / Quartus Prime JTAG configuration sequence including nCONFIG, nSTATUS, and CONF_DONE handshakes. Power sequencing must bring VCCINT up before VCCA per the Cyclone III Device Handbook.
드롭인 대체품: EP3C55F484C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C55F484C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C55F484C7N
✅ 드롭인✓ 재고 있음
$52.75 / 개
데이터시트 보기 →EP3C55F484C6N
✅ 드롭인✓ 재고 있음
$148.7 / 개
데이터시트 보기 →EP3C55F484C8
✅ 드롭인✓ 재고 있음
$138.4 / 개
데이터시트 보기 →EP3C55F484C7
✅ 드롭인✓ 재고 있음
$52.95 / 개
데이터시트 보기 →EP3C55F484C6
✅ 드롭인✓ 재고 있음
$222 / 개
데이터시트 보기 →EP3C40F484C8N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EP3C55F484C8N 최대 정격 & 전기적 특성
| Device Family | Cyclone III |
| Logic Elements (LE) | 55,856 |
| User I/O Pins | 327 |
| Embedded Memory Bits | 2,396,160 |
| Memory Blocks (M9K) | 260 |
| Embedded Multipliers (18x18) | 260 |
| PLLs | 4 |
| Maximum Internal Frequency | 472 MHz |
| Core Voltage (VCCINT) | 1.2 V |
| 패키지 | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch |
| Package Height | 2.60 mm |
| Operating Temperature (Commercial) | 0 C to +85 C |
| Process Node | 65 nm TSMC low-power |
| Configuration | SRAM-based, JTAG / AS / PS modes |
| Lead-Free / RoHS | Yes - lead-free, RoHS compliant |
| 실장 유형 | Surface Mount (BGA) |
EP3C55F484C8N 핀 구성
| 핀 A1 | I/O — General-purpose user I/O bank (signal integrity depends on bank assignment) |
| 핀 A2 | I/O — General-purpose user I/O |
| 핀 B1 | I/O — General-purpose user I/O |
| 핀 B2 | GND — Ground |
| 핀 C1 | VCCINT — Core supply 1.2 V |
| 핀 D1 | VCCA — PLL analog supply 2.5 V |
| 핀 E1 | I/O — General-purpose user I/O |
| 핀 F1 | I/O — General-purpose user I/O |
| 핀 G1 | nCONFIG — Configuration control (active-low) |
| 핀 H1 | nSTATUS — Configuration status (active-low) |
| 핀 J1 | CONF_DONE — Configuration complete (active-high) |
| 핀 K1 | TCK — JTAG clock |
| 핀 L1 | TMS — JTAG mode select |
| 핀 M1 | TDI — JTAG data in |
| 핀 N1 | TDO — JTAG data out |
| 핀 P1 | I/O — General-purpose user I/O |
| 핀 R1 | I/O — General-purpose user I/O |
| 핀 T1 | VCCIO — I/O bank supply 1.5/1.8/2.5/3.3 V (bank-dependent) |
| 핀 U1 | I/O — General-purpose user I/O |
| 핀 V1 | I/O — General-purpose user I/O |
| 핀 W1 | GND — Ground |
| 핀 Y1 | I/O — General-purpose user I/O |
| 핀 AA1 | I/O — General-purpose user I/O |
| 핀 AB1 | VCCINT — Core supply 1.2 V |
| 핀 AC1 | I/O — General-purpose user I/O |
| 핀 AD1 | I/O — General-purpose user I/O |
| 핀 AE1 | GND — Ground |
일반적인 애플리케이션
EP3C55F484C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Front-End, ASIC Prototyping, Automotive Infotainment ECU, Educational FPGA Development Boards.
Industrial Motor Control
The EP3C55F484C8N fits industrial motor control because it offers 260 embedded 18x18 multipliers, 4 PLLs, and 327 user I/O - enough parallel math blocks to vector-FOC or space-vector-PWM a 3-phase inverter in a single device. The 472 MHz internal clock closes timing on the SVPWM carrier period at 20 kHz with margin. Its 484-FBGA package exposes sufficient pins for parallel ADC sampling (12-16 channels) plus incremental encoder inputs, while the 65 nm low-power Cyclone III process keeps inverter-stage logic dissipation manageable in a sealed cabinet.
추천
Video Surveillance and Image Processing
For video surveillance pipelines the EP3C55F484C8N's 2,396,160 embedded memory bits (260 M9K blocks) buffer full-HD frames line-by-line at 148.5 MHz pixel clock, and the 260 18x18 multipliers implement 2D convolution, Sobel edge detection, and motion-vector estimation in real time at 30 fps. With 327 I/O the part can accept parallel BT.1120 / digital video from a CMOS sensor plus a DDR2 SDRAM controller for frame storage. The 1.2 V core and Cyclone III low-power architecture keep thermal rise inside a sealed PoE camera housing without a heatsink.
추천
Software-Defined Radio Front-End
The EP3C55F484C8N suits SDR front-end DSP because its 260 18x18 multipliers and 4 PLLs deliver enough GFLOPS to implement a 4-channel DDC (digital down-converter) chain plus channelization at baseband sample rates up to 122.88 MHz. The 472 MHz fabric clock and dedicated PLL re-save clock network lock to a low-jitter external VCXO for ADC sampling. With 327 I/O the FPGA interfaces to parallel LVDS ADCs / DACs, while the 484-FBGA 1.0 mm pitch enables a small 4-layer PCB suitable for an embedded SDR module.
추천
ASIC Prototyping
ASIC prototyping with the EP3C55F484C8N leverages its 55,856 logic elements, 260 M9K RAM blocks, and 260 multipliers to emulate medium-complexity ASICs up to ~1.5 M gates. The 327 user I/O can be partitioned across multiple FPGA logic analyzers and BIST controllers, and the SRAM-based fabric supports unlimited design iterations via JTAG. Designers partition the ASIC across 1-3 FPGAs using Quartus II and verify at speed, accelerating time-to-silicon compared with simulation alone.
추천
Automotive Infotainment ECU
The EP3C55F484C8N powers automotive infotainment ECUs by bridging LVDS / OpenLDI display panels, MOST or CAN networks, and audio CODECs over its 327 user I/O. The 260 multipliers handle audio DSP (EQ, crossover, time alignment), while 2.4 Mbit embedded memory supports display frame-buffer double-buffering. The commercial-grade 0 to +85 C temperature range fits cabin-mounted head units; for harsher under-hood designs use the EP3C55F484I7N industrial variant instead. Quartus Prime flow integrates CAN IP cores and MOST network stacks.
추천
Educational FPGA Development Boards
The EP3C55F484C8N is a popular FPGA on university and hobbyist development boards because it provides 55,856 logic elements - enough to run RISC-V soft cores, custom 32-bit CPUs, and complete VHDL/Verilog coursework projects - at a price point affordable for educational kits. The 327 I/O drives onboard LEDs, switches, character LCDs, VGA / HDMI interfaces, and GPIO headers. The 484-FBGA package is manageable on a 4-layer educational PCB, and Quartus II Web Edition supports the entire Cyclone III family free of charge.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C55F484C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C55F484C7N | EP3C55F484C6N | EP3C55F484C8 | EP3C55F484C7 | EP3C55F484C6 | EP3C40F484C8N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-BGA (FBGA, 23x23 mm) | 484-BGA (FBGA, 23x23 mm) - same | 484-BGA (FBGA, 23x23 mm) - same | 484-BGA (FBGA, 23x23 mm) - same | 484-BGA (FBGA, 23x23 mm) - same | 484-BGA (FBGA, 23x23 mm) - same | 484-BGA (FBGA, 23x23 mm) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 (-29%) |
| Speed Grade | 8 (fastest) | 7 | 6 | 8 | 7 | 6 | 8 |
| User I/O | 327 | 327 | 327 | 327 | 327 | 327 | 331 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,161,216 (-52%) |
| Embedded 18x18 Multipliers | 260 | 260 | 260 | 260 | 260 | 260 | 126 (-52%) |
| Pb-Free Suffix | N (Pb-free) | N (Pb-free) | N (Pb-free) | non-N (older) | non-N (older) | non-N (older) | N (Pb-free) |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
주요 차별점
- Highest Fmax bin on the 484-FBGA Cyclone III family (vs EP3C55F484C7N)
- RoHS-compliant Pb-free ball finish for global sale (vs EP3C55F484C8 (non-N suffix))
- Mid-density 55K LE sweet spot for balanced designs (vs EP3C40F484C8N)
설계 노트
Estimated: at 1.2 V VCCINT, the EP3C55F484C8N core current can reach approximately 0.8 to 1.2 A depending on toggle rate. Place 100 nF + 10 uF decoupling capacitors within 5 mm of every VCCINT ball, and at least one 100 uF bulk tantalum near the regulator. Bring VCCINT up before VCCA per the Cyclone III Device Handbook to avoid latch-up; sequence VCCA (~2.5 V) within 100 ms of VCCINT. The 327 I/O on VCCIO banks can draw an additional 1 to 2 A when heavily loaded, so size the VCCIO regulator for the specific bank count actually used.
The 484-FBGA uses a 1.0 mm ball pitch which is escapeable on a 4-layer PCB with via-in-pad or microvia process. Use 0.5 mm via capture pad with 0.2 mm drill and a 4 mil trace width to break out the inner rows. Maintain at least 2 mm of continuous reference plane under the package for power integrity, and avoid routing signals across split power planes between VCCINT and VCCA. Per JEDEC J-STD-020 the FBGA is MSL3 - bake at 125 C for 24 hours before assembly if the sealed bag has been open longer than the floor-life limit.
Do not confuse speed grade 8 with package code 484; the '8' here is the Fmax bin, not a ball count. Be aware that EP3C55F484C8N is a commercial-temperature device - for industrial applications you must select the I7N variant. The non-N suffix parts (C8, C7, C6) are older Pb-ball revisions and may not be RoHS compliant for sale into the EU. Finally, Quartus Prime support for Cyclone III ended at version 20.1; older Quartus II 13.0sp1 is still required for many legacy IP cores and must be retained alongside the newer toolchain.
규정 준수 정보
RoHS-compliant lead-free FBGA per Alldatasheet entry 'LEAD FREE, FBGA-484'. AEC-Q100 not applicable - this is a commercial-grade FPGA; for AEC-Q100 automotive use select the I7N industrial variant plus a separate qualification review.
