EP3C80F780C6N - Cyclone III FPGA 81K LE 780-FBGA | Intel
부품 번호: EP3C80F780C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $488.62 | $488.62 |
| 10 | $458.1 | $4,581.00 |
| 100 | $415.5 | $41,550.00 |
| 500 | $372.4 | $186,200.00 |
| 1,000 | $330.2 | $330,200.00 |
EP3C80F780C6N 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reprogrammability. FPGAs sit above CPLDs in the programmable logic hierarchy and below fixed-function ASICs in NRE cost; they are used to implement custom datapaths, parallel DSP blocks, memory interfaces, and high-speed serial protocols without the cost and lead time of a custom IC. Cyclone III FPGAs specifically target the low-power segment of the FPGA market, where designers need tens of thousands of logic elements and embedded multipliers without the power budget of high-end transceivers.
Key features of the EP3C80F780C6N include four PLLs, 281 embedded 18x18 multipliers, 4 Mbits of embedded SRAM (2,810,880 bits), Cyclone III architecture support for DDR/DDR2/QDRII external memory interfaces, and 429 user I/O pins distributed across 8 I/O banks. The device supports LVDS, SSTL, and LVTTL I/O standards, and is supported by the Quartus II / Quartus Prime design toolchain. The device is offered in the commercial temperature grade (0 C to +85 C).
Architecturally, the EP3C80F780C6N uses look-up-table (LUT)-based logic elements, dedicated 18x18 multiplier blocks for DSP workloads, and embedded SRAM columns distributed across the fabric. The 65 nm TSMC process gives a typical static power figure well below 100 mW, making the Cyclone III family popular for industrial, automotive infotainment, video processing, and motor control applications.
Typical applications include industrial motor control, video surveillance and image processing pipelines, automotive driver-assistance preprocessing, software-defined radio front-ends, and embedded DSP cards. The high logic density and embedded multipliers make it particularly attractive for parallel processing tasks where a microcontroller or DSP alone would be too slow.
When designing with this device, plan for at least 12 PCB layers to escape the 780-ball BGA cleanly, and use the Quartus II pin planner to assign I/O banks to compatible voltage rails. Leave 20% logic and 30% memory headroom for late-stage ECOs to avoid running out of fabric on design closure.
This page synthesizes distributor pricing, FPGA-class drop-in alternatives, and practical PCB-layout guidance that are not aggregated on a single manufacturer or distributor page, giving you a one-stop reference for sourcing and substitution decisions.
드롭인 대체품: EP3C80F780C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C80F780C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Logic Elements (LE), Embedded 18x18 Multipliers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C80F780C6
✅ 드롭인✓ 재고 있음
$320.95 / 개
데이터시트 보기 →EP3C80F780C7N
✅ 드롭인✓ 재고 있음
$260 / 개
데이터시트 보기 →EP3C80F780C8N
✅ 드롭인✓ 재고 있음
$240.2 / 개
데이터시트 보기 →EP3C120F780C7N
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EP3C55F780C6N
✅ 드롭인✓ 재고 있음
$52.1 / 개
데이터시트 보기 →EP3C80F780I7N
✅ 드롭인✓ 재고 있음
$514.03 / 개
데이터시트 보기 →EP3C80F780C6N 최대 정격 & 전기적 특성
| Series | Cyclone III |
| Logic Elements (LE) | 81,264 |
| Embedded Memory Bits | 2,810,880 bits |
| Embedded Memory (Mbits) | 4 Mbits |
| Embedded 18x18 Multipliers | 281 |
| PLLs | 4 |
| Maximum User I/O | 429 |
| I/O Banks | 8 |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 500 MHz |
| 패키지 | 780-ball FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Operating Temperature (Commercial) | 0 C to +85 C |
| 실장 유형 | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, per AmpHeo listing) |
EP3C80F780C6N 780-ball fbga (fineline bga), 29 x 29 mm, 1.0 mm pitch 핀 구성 가이드
EP3C80F780C6N(780-ball fbga (fineline bga), 29 x 29 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C80F780C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C80F780C6N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance and Image Processing, Automotive Infotainment and Driver Assistance, Software-Defined Radio Front-End, Embedded DSP and Industrial Signal Conditioning, Industrial Networking and Protocol Bridging.
Industrial Motor Control
The EP3C80F780C6N fits industrial motor-control boards because its 281 embedded 18x18 multipliers and 4 Mbits of M9K block RAM execute field-oriented control (FOC) loops and SVPWM modulation at sub-microsecond latency. The 65 nm low-power process keeps dissipation under 2 W even at full DSP utilization, eliminating active cooling in sealed IP65 enclosures. With 429 user I/O pins, the device supports multi-axis drives (encoder, Hall, current-sense, and PWM channels for three axes) on a single chip. Industrial designers value the Quartus II IP catalog for resolver-to-digital and encoder-to-digital blocks, which shorten development cycles.
추천
Video Surveillance and Image Processing
In HD video pipelines the EP3C80F780C6N acts as a pre-processing stage that converts BT.656/BT.1120 or HDMI streams into frame buffers and runs Sobel, Canny, or motion-detection kernels in parallel. The 4 Mbits of embedded SRAM buffer several lines of 1080p video, while the 281 multipliers perform convolution at 200 MHz without external DSP chips. The 8 I/O banks simplify mixing 1.8 V LVDS for the sensor interface and 3.3 V LVCMOS for the host processor bus. Power consumption stays well below 3 W, supporting fanless IP-camera enclosures.
추천
Automotive Infotainment and Driver Assistance
The EP3C80F780C6N handles infotainment HMI rendering and ADAS pre-processing such as lane-departure-warning or pedestrian-detection front-ends. Its 81,264 logic elements absorb display controllers, video scalers, and CAN/LIN gateway logic on a single fabric, while the industrial-temperature derivative (-40 to +100 C) is used for under-hood and cabin modules. Designers pair the FPGA with DDR2 memory for frame-buffer storage and with LVDS links to camera modules. The 780-FBGA package survives automotive vibration profiles when assembled with underfill and corner-bond adhesives.
추천
Software-Defined Radio Front-End
Software-defined radio platforms use the EP3C80F780C6N to implement digital down-conversion, channelization, and modulation/demodulation in fabric, with the embedded multipliers performing 16-bit complex multiplications at hundreds of MSPS. The four PLLs generate the precise sample clocks required for ADC interfacing, while the 4 Mbits of block RAM buffer several hundred microseconds of baseband data. LVDS I/O pairs cleanly to 14-bit 125 MSPS ADCs without external glue logic, and the 1.2 V core keeps the radio card within thermal envelopes for portable SDR kits.
추천
Embedded DSP and Industrial Signal Conditioning
In data-acquisition cards the EP3C80F780C6N executes FIR, IIR, and Hilbert transforms on multi-channel 24-bit sigma-delta ADC streams. The 281 dedicated 18x18 multipliers enable multi-channel decimation filters running at 100 kSPS each, while the M9K memory blocks implement sample-rate converters. The 429 user I/O pins support dozens of simultaneously sampled analog channels, ideal for vibration analysis and acoustic emission testing. Low static power and a 1.2 V core keep 24/7 industrial monitoring systems within tight thermal budgets.
추천
Industrial Networking and Protocol Bridging
Protocol-conversion gateways leverage the EP3C80F780C6N to bridge EtherCAT, PROFINET, EtherNet/IP, and legacy serial buses on a single fabric. The Quartus II IP catalog provides time-sensitive networking (TSN) and EtherCAT slave controller cores that map efficiently onto Cyclone III logic. With 4 Mbits of embedded memory and four PLLs, the device handles deterministic traffic shaping at line rate. The 780-FBGA package supports industrial EMC hardening with proper stack-up, and the 1.2 V core draws minimal power in DIN-rail mounted controllers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C80F780C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C80F780C6 | EP3C80F780C7N | EP3C80F780C8N | EP3C120F780C7N | EP3C55F780C6N | EP3C80F780I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 119,088 (+47%) | 55,856 (-31%) | 81,264 |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 (+42%) | 2,396,160 (-15%) | 2,810,880 |
| Embedded 18x18 Multipliers | 281 | 281 | 281 | 281 | 576 (+105%) | 156 (-44%) | 281 |
| User I/O Pins (max) | 429 | 429 | 429 | 429 | 531 (+24%) | 377 (-12%) | 429 |
| Speed Grade | 6 (fastest) | 6 | 7 (slower Fmax) | 8 (slowest Fmax) | 7 | 6 | 7 |
| Operating Temperature | 0 to +85 C (Commercial) | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C | -40 to +100 C (Industrial) |
주요 차별점
- Highest-speed bin within the EP3C80 family in the 780-FBGA package (vs EP3C80F780C7N)
- 81,264 logic elements versus 55,856 on the cost-down EP3C55F780C6N (vs EP3C55F780C6N)
- Commercial temperature grade is sufficient for cost-sensitive industrial cabinets (vs EP3C80F780I7N)
설계 노트
The 780-ball FBGA at 1.0 mm pitch requires a PCB stack-up of at least 12 layers (8 routing + 4 planes) to escape cleanly. Use 0.8 mm laser-drilled microvias on the top layer for fan-out, and route signals on inner layers using 4-mil traces with 8-mil spacing. Maintain a continuous ground plane under the BGA to control impedance and provide a thermal return path for switching currents.
The EP3C80F780C6N has a typical junction-to-ambient thermal resistance around 17 C/W with a 12-layer PCB and adequate via thermal array under the package center balls. At full DSP utilization (~70% logic + 100% multipliers), estimated core power is 1.5-2.5 W; a small heat-spreader plate or 10 x 10 mm copper pour on the top side is sufficient for industrial environments. Add a 4-layer thermal via array (0.3 mm pitch) directly under the die footprint for additional margin.
Do not confuse the EP3C80F780C6N with the EP3C80F484C6N - the 484-FBGA variant has only 295 user I/O and ~70% of the 780-FBGA's I/O capacity, which is a non-drop-in change. Always verify pin compatibility against the Cyclone III device pin-out file before ordering 484-FBGA parts as 'equivalents'. Also note that the Cyclone III family requires 1.2 V core, 2.5 V analog PLL, and 3.3 V I/O supply rails - missing the analog PLL rail is a common board-spin issue.
Place the configuration flash (EPCS16 or compatible) within 2 inches of the FPGA DCLK and DATA0 pins to keep configuration traces short and impedance-controlled. Use 100-ohm differential routing only for LVDS pairs; SSTL-2 memory interfaces should use matched-length traces within 25 mils of the DQS strobe. Bank 8 is the only bank that supports the LVDS clock inputs; reserve it for high-speed differential clocks to avoid signal-integrity issues.
규정 준수 정보
Lead-free and RoHS-compliant per AmpHeo listing. AEC-Q100 qualification not applicable for the commercial C6N variant; choose I7N for industrial AEC-Q100 contexts. REACH and halogen-free status not explicitly disclosed in the Verified Web Data.
