Intel

EP3C80F780C7 - Cyclone III 81K LE FPGA, 780-FBGA | Intel

부품 번호: EP3C80F780C7 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.2 V Vdss 780-ball FBGA (FineLine BGA) Package 20 Speed 2,810,880 Memory
시작가 $298.75 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-09
볼륨 가격
수량 단가 합계
1 $423.54 $423.54
10 $398.2 $3,982.00
100 $365 $36,500.00
250 $332.5 $83,125.00
500 $298.75 $149,375.00
ℹ️ 모든 가격은 USD 기준입니다

EP3C80F780C7 개요

The Intel (formerly Altera) EP3C80F780C7 is a Cyclone III Field Programmable Gate Array (FPGA) with 81,264 logic elements, 2,810,880 bits of embedded memory, and 429 user I/O pins, housed in a 780-ball FineLine BGA (FBGA) package. It is fabricated on a low-power 65 nm CMOS process and is targeted at cost-sensitive, high-volume applications where the combination of high logic density, embedded multipliers, and low static power is required.

Cyclone III FPGAs belong to the broader family of SRAM-based programmable logic devices, which sit within the semiconductor hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike CPLDs (Complex Programmable Logic Devices) which use non-volatile flash or EEPROM configuration memory, SRAM-based FPGAs must be configured at every power-up from an external flash memory, but in exchange offer far higher logic density, embedded memory blocks, hardware multipliers, and DSP blocks. Cyclone III occupies the low-power, low-cost end of the SRAM-FPGA segment, making it a popular choice for industrial control, video processing, and communications infrastructure where power and cost are critical constraints.

Key differentiating specifications include up to 81,264 logic elements, 2,810,880 embedded RAM bits organized in M9K blocks, 244 embedded 18x18 hardware multipliers, and four phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, and operates from a 1.2 V core supply with separate VCCIO banks for flexible I/O voltage interfacing. Static power consumption is dramatically reduced compared to Cyclone II thanks to the 65 nm process.

The EP3C80F780C7 architecture consists of LABs (Logic Array Blocks) containing 16 Logic Elements each, interconnected by a multi-tier routing fabric. Embedded multiplier blocks and M9K memory blocks are distributed in columns alongside the LABs, providing efficient implementation of DSP pipelines and FIFO buffers. The configuration scheme uses a serial or parallel flash loader, with bitstream decryption available via the AES-128 option on higher-tier Cyclone III LS devices.

Typical applications include industrial machine vision, motor control and servo drive, broadcast video processing, software-defined radio baseband, telecom line cards, and portable medical instrumentation. The combination of high logic density and embedded DSP blocks makes the EP3C80F780C7 well suited to parallel signal-processing tasks where microcontrollers or DSP processors cannot meet throughput.

When designing with this device, plan for an external configuration flash (EPCS or compatible) because the FPGA is SRAM-based. Maintain solid power-plane decoupling on the 1.2 V core rail and observe simultaneous switching output (SSO) guidelines for the 780-ball FBGA to maintain signal integrity.

This page synthesizes distributor pricing across 19 channels, verified drop-in alternatives sharing the same 780-FBGA footprint, and practical design notes covering configuration, power sequencing, and signal integrity that go beyond the manufacturer datasheet itself.

드롭인 대체품: EP3C80F780C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP3C80F780C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Logic Elements, Embedded Multipliers.

Intel
Package: 780-pin FBGA (F780)
Process Technology: 65 nm low-k
비교 대상: EP3C80F780C7 →
Intel
Speed Grade: 7 (C7, commercial)
Logic Elements: 39,600 LE
Embedded Multipliers: 126 (18x18)
비교 대상: EP3C80F780C7 →
Intel
Package: 780-ball FineLine BGA
Process Technology: 65 nm low-power CMOS
Speed Grade: 7
비교 대상: EP3C80F780C7 →
Altera
Package: 780-pin FBGA (FineLine BGA)
Process Technology: 65 nm low-power CMOS (TSMC)
Speed Grade: C6
비교 대상: EP3C80F780C7 →
Intel
Package: 780-ball FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch
Process Technology: 65 nm low-power CMOS
비교 대상: EP3C80F780C7 →
Intel
Process Technology: 65 nm CMOS (TSMC low-k)
비교 대상: EP3C80F780C7 →
Intel
Process Technology: 65 nm TSMC low-power
Speed Grade: 8
비교 대상: EP3C80F780C7 →
Intel
Package: 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch
Speed Grade: 8
Logic Elements: 81,264
비교 대상: EP3C80F780C7 →
Intel
Package: 780-ball FBGA
Process Technology: 65 nm
Speed Grade: C7 (commercial, low power)
비교 대상: EP3C80F780C7 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP3C80F780C6N

✅ 드롭인
Intel
📦 780-FBGA
Cyclone III · 81,264 · 2,810,880 bits · 4 Mbits · 281 · 4 · 429 · 8

✓ 재고 있음

$330.2 / 개

데이터시트 보기 →

EP3C80F780C6

✅ 드롭인
Altera
📦 780-FBGA
Cyclone III · 81,264 · 2,810,880 bits · 429 · 244 · 4 · 500 MHz · 65 nm low-power CMOS (TSMC)

✓ 재고 있음

$320.95 / 개

데이터시트 보기 →

EP3C80F780C8N

✅ 드롭인
Intel
📦 780-FBGA
Cyclone III · FPGA - Field Programmable Gate Array · 81,264 · 2,810,880 bits · 244 (18x18) · 429 · 4 · 472 MHz

✓ 재고 있음

$240.2 / 개

데이터시트 보기 →

EP3C55F780C7N

✅ 드롭인
Intel
📦 780-FBGA
Cyclone III · 55,856 · 2,396,160 bits (approximately 2.4 Mbit) · 312 M9K blocks · 156 (18 x 18) · 377 · 4 · 20

✓ 재고 있음

$138.31 / 개

데이터시트 보기 →

EP3C120F780C7N

✅ 드롭인
Intel
📦 780-FBGA
Cyclone III · EP3C120 · 119,088 · 3,981,312 · 432 · 531 · 4 · 20

✓ 재고 있음

$162 / 개

데이터시트 보기 →

EP3C40F780C7N

✅ 드롭인
Intel
📦 780-FBGA
Cyclone III · 39,600 LE · 1,161,216 bits · 126 (18x18) · 535 · 780-ball FBGA (FineLine BGA) · 7 (C7, commercial) · 65 nm TSMC low-power

✓ 재고 있음

$145.4 / 개

데이터시트 보기 →

EP3C80F780C7 최대 정격 & 전기적 특성

Family Cyclone III
Logic Elements (LE) 81,264
Embedded Memory Bits 2,810,880
Embedded Memory Blocks M9K (9 Kbit each)
Embedded 18x18 Multipliers 244
User I/O Pins 429
Phase-Locked Loops (PLLs) 4
Global Clock Networks 20
Process Technology 65 nm CMOS, low-power
Core Supply Voltage (VCCINT) 1.2 V
Configuration Scheme SRAM, external flash (EPCS)
패키지 780-ball FBGA (FineLine BGA)
동작 온도 0C to +85C (commercial)
Speed Grade C7
RoHS 상태 Compliant

EP3C80F780C7 780-ball fbga (fineline bga) 핀 구성 가이드

EP3C80F780C7(780-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP3C80F780C7의 780-ball fbga (fineline bga) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP3C80F780C7.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP3C80F780C7 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Motor Control and Servo Drive, Broadcast Video Processing, Telecom Line Cards and Baseband, Software Defined Radio Baseband, Portable Medical Instrumentation.

🏭

Industrial Machine Vision

The EP3C80F780C7 fits industrial machine vision because its 81,264 logic elements and 244 embedded 18x18 multipliers can process multiple camera streams at line rate without off-chip DSP. The 2,810,880 embedded RAM bits hold full video line buffers, and the 429 user I/O pins interface directly to LVDS camera links, DDR2 memory, and Ethernet PHYs. Power dissipation stays low thanks to the 65 nm process, allowing fanless operation inside sealed IP67 vision enclosures.

🏭

Motor Control and Servo Drive

Field-Oriented Control (FOC) and Space Vector PWM (SVPWM) loops benefit from the EP3C80F780C7's 244 hardware multipliers running parallel encoder-feedback arithmetic. The 81K LE accommodates PID loops, commutation tables, and safety logic in a single device. Industrial temperature variants (-40C to +100C) exist for harsh environments, and the 780-FBGA's 429 user I/O provide abundant channels for multi-axis drives.

📺

Broadcast Video Processing

The EP3C80F780C7's M9K memory blocks and 244 multipliers handle real-time SD/HD video scaling, deinterlacing, and color-space conversion. Its 429 user I/O drive multiple BT.656 / BT.1120 / HD-SDI interfaces alongside DDR2 frame buffers. The Cyclone III architecture is documented in Altera reference designs for video format converters and broadcast switches, and the 780-FBGA exposes all required video pins.

🌐

Telecom Line Cards and Baseband

Telecom line cards use the EP3C80F780C7 to implement packet classification, traffic shaping, and baseband DSP at wire rate. The 81K LE supports 10+ channels of moderate-complexity DSP simultaneously, while 2.8 Mbit of embedded memory absorbs packet bursts. The four PLLs derive jitter-clean clocks from incoming line references, and the 780-FBGA's high I/O count interfaces to SERDES, network processors, and DDR2/QDR memory.

🌐

Software Defined Radio Baseband

The EP3C80F780C7's 244 hardware multipliers perform digital down-conversion, FIR filtering, and FFT-based channelization for SDR baseband processing. With 2.8 Mbit of embedded memory, it stores complex I/Q sample buffers between ADC and host CPU. The 65 nm low-power process suits portable and man-pack SDR enclosures where thermal envelope is constrained.

💊

Portable Medical Instrumentation

The EP3C80F780C7 enables portable ultrasound, patient monitoring, and point-of-care diagnostic devices by consolidating signal acquisition, DSP, and display driving into one low-power FPGA. With 81K LE and 244 multipliers it runs parallel beamforming or pulse-oximetry DSP, while the 429 user I/O drive TFT displays, ADCs, and wireless links. The 65 nm low-power process minimizes battery drain in handheld medical carts.

What is the logic element count of EP3C80F780C7?
The EP3C80F780C7 contains 81,264 logic elements (LEs) organized into Logic Array Blocks (LABs) of 16 LEs each. According to the Cyclone III Device Handbook, this positions it in the upper-mid density tier of the family, between EP3C55 (55K LE) and EP3C120 (120K LE), and it is widely used for industrial control, video bridging, and parallel DSP pipelines.
How much embedded memory does EP3C80F780C7 have?
The EP3C80F780C7 includes 2,810,880 bits of embedded SRAM distributed across M9K (9 Kbit) blocks, configurable as single-port RAM, dual-port RAM, FIFO, or ROM. This is sufficient for line buffers in video applications, packet buffers in telecom, and intermediate storage in DSP pipelines without consuming external memory bandwidth.
How many user I/O pins does EP3C80F780C7 provide?
The EP3C80F780C7 provides 429 user I/O pins arranged across 8 I/O banks on the 780-ball FBGA package. Each bank supports an independent VCCIO voltage, allowing direct interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS, SSTL, HSTL, and LVDS standards simultaneously on the same device.
What is the operating voltage of EP3C80F780C7?
The EP3C80F780C7 operates from a 1.2 V core supply (VCCINT) plus eight independent VCCIO bank supplies. VCCIO must match the I/O standard in use, and per-bank voltages may differ. The device also requires VCCA_PLL analog supplies for the four PLLs and VCCPD for configuration I/O.
Does EP3C80F780C7 require an external configuration flash?
Yes, the EP3C80F780C7 is SRAM-based and loses its configuration at power-down. At every power-up it must load its bitstream from an external configuration flash, typically Altera EPCS16, EPCS64, or EPCQ16. Active Serial (AS) mode is the most common, supporting bitstream sizes up to the device capacity.
What is the price of EP3C80F780C7?
EP3C80F780C7 is priced at approximately $423.54 per unit at qty-1 as of 2026-09-09, based on the Verified Web Data. Volume pricing drops to roughly $298.75 at 500 pieces through major distributors. Stock varies; lead time for full reels is typically 8-12 weeks because this is a high-density BGA.
Where can I buy EP3C80F780C7 online?
EP3C80F780C7 is available from authorized distributors including DigiKey, Mouser, Heisener, Octopart-listed brokers, and Avaq. As of 2026-09-09, Heisener reported in stock with same-day shipment. Octopart aggregates real-time pricing from 19 distributors to compare bulk discounts.
What is the lead time for EP3C80F780C7?
Lead time for EP3C80F780C7 is typically ships-today at major distributors for qty-1 to qty-100, according to the Verified Web Data as of 2026-09-09. For quantities above 500 pieces the lead time extends to 8-12 weeks because the 780-ball FBGA is a high-density package with limited capacity. Heisener quotes delivery within 7 days for expedited orders.
EP3C80F780C7 vs EP3C120F780C7 - which is better for high-density designs?
The EP3C120F780C7 has 119,088 logic elements versus the EP3C80F780C7's 81,264, a 47% density advantage. Both share the same 780-ball FBGA footprint and pinout family, so the C120 is a drop-in upgrade path for designs that exhaust C80 logic resources. Choose C120 when you need >30% additional LE headroom; C80 is more cost-effective when 81K LE suffices.
What is the difference between EP3C80F780C7 and EP3C80F484C7?
The EP3C80F780C7 uses a 780-ball FBGA package with 429 user I/O, while the EP3C80F484C7 uses a smaller 484-ball FBGA with 289 user I/O. Both contain the same 81,264 logic elements and 2,810,880 memory bits. They are NOT pin-compatible drop-in replacements - the smaller BGA reduces user I/O and limits external memory channel count.
When should I choose EP3C80F780C7 over Lattice ECP5?
Choose EP3C80F780C7 when you need proven 81K LE logic density, mature Quartus Prime toolchain support, and abundant reference designs. Choose Lattice ECP5 (LFE5U series) when you need lower static power, SERDES, and lower unit cost; however, ECP5 is in a different BGA package and requires a PCB redesign - it is not a drop-in replacement.
What is the best drop-in replacement for EP3C80F780C7?
The closest drop-in replacements are other EP3C80F780 speed-grade variants such as EP3C80F780C8, EP3C80F780C6, and EP3C80F780I7 (industrial temperature). All share the same 780-ball FBGA footprint and identical pinout. Cross-brand drop-in alternatives in the same package do not exist at this density tier; Xilinx Spartan-6 uses a different BGA pinout.
Where to download EP3C80F780C7 datasheet PDF?
The Cyclone III device family datasheet containing EP3C80F780C7 specifications is available at the Altera/Intel documentation archive. The third-party alldatasheet mirror hosts a 34-page Cyclone III electrical characteristics document. For the full device handbook, design software, and IBIS models, register on Intel's FPGA support site and download from the Cyclone III device page.
Where to find EP3C80F780C7 pinout?
The 780-ball FBGA pinout for EP3C80F780C7 is documented in the Cyclone III Device Handbook Pin-Outs chapter, and as an Excel file in the Pin-Out Files section of Intel's FPGA support site. The same pinout applies across all EP3C80F780 speed grades (C6/C7/C8/I7), so any reference design for the F780 package applies directly.
Is EP3C80F780C7 suitable for motor control applications?
Yes, EP3C80F780C7 is well suited to motor control. Its 244 embedded 18x18 hardware multipliers handle Field-Oriented Control (FOC) and Space Vector PWM (SVPWM) in hardware without burdening a soft processor. The 81K LE supports encoder feedback processing, PID loops, and safety logic in a single device. Industrial motor control is a primary Cyclone III use case documented in Altera reference designs.

엔지니어링 참조 데이터: EP3C80F780C7 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP3C80F780C7 when your design requires 70K-90K logic elements, 200+ embedded multipliers, and 350+ user I/O in a single 780-FBGA package. Typical fits include industrial machine vision, multi-axis motor control, broadcast video processing, and parallel DSP pipelines. Choose EP3C80F780C6/C8 if you need to trade timing margin (C8 = faster, C6 = slower) without changing footprint. Choose EP3C55F780C7N if you can drop to ~56K LE for cost savings, or EP3C120F780C7N as a future-proof upgrade. All variants share the same 780-ball FBGA footprint, enabling BOM flexibility and second-source qualification. Avoid the EP3C40F780C7N unless your design fits in ~40K LE - the 51% logic reduction is rarely worth the cost savings.

대체품과의 비교

파라미터 이 제품 EP3C80F780C6N EP3C80F780C6 EP3C80F780C8N EP3C55F780C7N EP3C120F780C7N EP3C40F780C7N
Brand Intel (Altera) Intel Intel Intel Intel Intel Intel
Package 780-FBGA 780-FBGA - same 780-FBGA - same 780-FBGA - same 780-FBGA - same 780-FBGA - same 780-FBGA - same
Logic Elements 81,264 81,264 (same) 81,264 (same) 81,264 (same) 55,856 (-31%) 119,088 (+47%) 39,600 (-51%)
Speed Grade C7 C6 (-1) C6 (-1) C8 (+1) C7 (same) C7 (same) C7 (same)
Embedded Memory (bits) 2,810,880 2,810,880 (same) 2,810,880 (same) 2,810,880 (same) 2,396,160 (-15%) 3,981,312 (+42%) 1,161,216 (-59%)
Embedded 18x18 Multipliers 244 244 (same) 244 (same) 244 (same) 156 (-36%) 288 (+18%) 126 (-48%)
User I/O 429 429 (same) 429 (same) 429 (same) 377 (-12%) 531 (same ball count) 535
PLLs 4 4 (same) 4 (same) 4 (same) 4 (same) 4 (same) 4 (same)

주요 차별점

  • Balanced 81K LE density with high user I/O in single package (vs EP3C55F780C7N)
  • Direct upgrade path to higher density without PCB change (vs EP3C120F780C7N)
  • 65 nm low-power process reduces static power significantly (vs EP3C40F780C7N)

설계 노트

Cyclone III uses a 1.2 V core rail (VCCINT) and per-bank VCCIO supplies. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor placed within 5 mm. Use a dedicated 1.2 V LDO (such as an LDO with 3 A rating for full utilization) and avoid sharing the 1.2 V rail with other high-current devices to prevent FPGA inrush from collapsing the supply.

Cyclone III is SRAM-based and loses bitstream on power-down. A configuration flash (EPCS16, EPCS64, or EPCQ16) is mandatory; Active Serial (AS) mode with the 4-pin interface is the default. nCONFIG must be held high for normal operation, and nSTATUS must be monitored for configuration errors. Do not leave nCONFIG floating - it requires a 10 kohm pull-up to VCCPD.

The 780-ball FBGA is a 1.0 mm pitch fine-pitch BGA requiring via-in-pad or dog-bone fanout. Plan at least 4 PCB layers with one solid ground plane adjacent to the BGA. Maintain 50 ohm controlled impedance on clock and high-speed LVDS pairs, and follow Intel's simultaneous-switching-output (SSO) recommendations to limit ground bounce across the 8 I/O banks.

Estimated: at 100% logic utilization with default toggle rate, EP3C80F780C7 dissipates approximately 2-3 W. The 780-FBGA thermal resistance theta_JA is approximately 12 C/W on a standard 4-layer JEDEC test board, yielding ~25-35 C junction rise above ambient. For sealed enclosures, plan a copper spreader or heat slug under the BGA exposed pad.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and lead-free confirmed via Altera/Intel product page. AEC-Q100 not applicable - this is a commercial-grade FPGA; industrial-temperature versions exist with 'I' suffix speed grades.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP3C80F780C7 EP3C80F780C7 datasheet Altera Cyclone III EP3C80 Cyclone III 81K logic elements 780 FBGA 780-ball FBGA FPGA 429 I/O EP3C80F780C7 motor control EP3C80F780C7 vs EP3C120F780C7 EP3C80F780C7 drop-in replacement EP3C80F780C7 buy price stock how many logic elements does Cyclone III EP3C80 have Cyclone III 780 FBGA pinout low power 65nm FPGA for industrial

관련 부품 & 용어

Intel Altera EP3C80F780C7 Cyclone III FPGA Field Programmable Gate Array Programmable Logic Device PLD SRAM-based FPGA 780-FBGA FineLine BGA BGA package family surface mount Logic Element LAB (Logic Array Block) M9K memory block embedded multiplier 18x18 multiplier DSP block PLL phase-locked loop LVDS LVCMOS SSTL HSTL I/O bank VCCINT VCCIO configuration flash EPCS Active Serial configuration 65 nm CMOS RoHS machine vision motor control FOC broadcast video telecom line card software defined radio medical instrumentation
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