EP3CLS200F780I7N - Cyclone III LS FPGA 198K LE | Intel | 780-FBGA
부품 번호: EP3CLS200F780I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 250 | $255 | $63,750.00 |
| 500 | $240 | $120,000.00 |
EP3CLS200F780I7N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the top of the programmable logic hierarchy - above CPLDs, PALs, and discrete glue logic - and serve as the prototypical "software-defined hardware" platform. The Cyclone III LS family specifically targets low-power, high-volume, reliability-sensitive applications and is positioned below Cyclone IV/V/10 in Intel's portfolio while above the original Cyclone series in capability.
Key features include 198,464 logic elements (LEs), 8,211,456 RAM bits organized in M9K blocks, 425 18x18 hardware multipliers for DSP, four general-purpose PLLs, 413 maximum user I/O, 8 clock networks per quadrant, and the Cyclone III LS soft-error mitigation IP. The silicon also supports hot-socketing, partial reconfiguration, and configuration via passive serial, fast passive parallel, and JTAG modes. Compared with the non-LS Cyclone III EP3C120 in the same FBGA-780, the LS variant adds parity checking on internal memory and SEU-aware configuration scrubbing.
From an architecture perspective, the EP3CLS200F780I7N leverages Intel's 65 nm TSMC process with copper interconnect and low-k dielectric, combining a four-input look-up table (LUT) logic element with dedicated carry chains, embedded memory blocks, and DSP blocks that each contain four 18x18 multipliers. The device achieves a maximum internal clock frequency of approximately 437.5 MHz (per published Cyclone III LS datasheet speed-grade tables) and is supported by Intel Quartus Prime (legacy Quartus II) design software for synthesis, place-and-route, and bitstream generation.
Typical applications include industrial motor control, factory automation programmable logic controllers, low-cost ASIC prototyping, software-defined radio front-ends, video processing pipelines, machine vision interfaces, military/aerospace subsystems requiring SEU tolerance, and portable medical instrumentation. Designers also use the EP3CLS200 in telecom line cards, test-and-measurement chassis, and embedded vision modules where moderate logic density meets cost constraints.
When designing with this device, carefully plan the power distribution network (PDN): a minimum of four PCB layers is recommended with continuous GND and 1.2 V planes, plus bulk decoupling within 25 mm of every VCCINT pin. The FBGA-780 land pattern requires 1.0 mm pitch with NSMD (non-solder-mask-defined) pads; follow Intel's package manufacturing guidelines to avoid tombstoning. Configuration scheme selection (AS vs. PS vs. JTAG) should be locked in early because it dictates the EPCS/EPCQ companion flash device.
This page consolidates distributor stock levels, verified drop-in replacements in the same FBGA-780 footprint, and practical layout notes not found in a single datasheet - giving design engineers and buyers an actionable reference for Cyclone III LS device selection.
드롭인 대체품: EP3CLS200F780I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3CLS200F780I7N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Speed Grade, RoHS Status, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3CLS200F780I7
✅ 드롭인✓ 재고 있음
$142.5 / 개
데이터시트 보기 →EP3CLS200F780C8N
✅ 드롭인✓ 재고 있음
$943.88 / 개
데이터시트 보기 →EP3CLS200F780C8ES
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP3CLS200F780C8
✅ 드롭인✓ 재고 있음
$1995 / 개
데이터시트 보기 →EP3CLS200F780C7N
✅ 드롭인✓ 재고 있음
$199.5 / 개
데이터시트 보기 →EP3CLS200F780C7
✅ 드롭인✓ 재고 있음
$102.4 / 개
데이터시트 보기 →EP3CLS150F780I7N
✅ 드롭인✓ 재고 있음
$128 / 개
데이터시트 보기 →EP3CLS100F780I7N
✅ 드롭인✓ 재고 있음
$174 / 개
데이터시트 보기 →EP3CLS200F780I7N 최대 정격 & 전기적 특성
| Device Family | Cyclone III LS |
| Series | EP3CLS200 |
| Logic Elements | 198,464 |
| Logic Array Blocks (LABs) | 12,404 LAB |
| Embedded Memory (bits) | 8,211,456 |
| Embedded Multipliers | 425 (18x18) |
| PLLs | 4 |
| Maximum User I/O | 413 |
| Process Technology | 65 nm CMOS (low-power) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| Speed Grade | 7 |
| 동작 온도 | -40 °C to +100 °C (industrial) |
| 패키지 | 780-ball FBGA (FBGA-780) |
| Ball Pitch | 1.0 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (lead-free per FBGA-780 datasheet note) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
EP3CLS200F780I7N 780-ball fbga (fbga-780) 핀 구성 가이드
EP3CLS200F780I7N(780-ball fbga (fbga-780) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3CLS200F780I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3CLS200F780I7N 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drives, Software-Defined Radio Front-End, Machine Vision and Image Processing, Aerospace and Defense Subsystems, ASIC Prototyping and Emulation, Test and Measurement Instrumentation.
Industrial Motor Control and Drives
The EP3CLS200F780I7N fits industrial motor control because it provides 425 dedicated 18x18 hardware multipliers to execute field-oriented control (FOC), space-vector PWM, and sliding-mode estimators at sub-microsecond loop periods. Four general-purpose PLLs generate the high-resolution PWM carrier frequencies (4-32 kHz typical) needed for IGBT drive stages, while 413 user I/O accommodates quadrature encoder inputs, Hall sensors, and resolver feedback channels. The industrial -40 °C to +100 °C temperature range survives VFD cabinet environments. Design tip: place the FPGA adjacent to the gate-driver optocouplers to minimize PWM propagation delay; use one PLL per motor axis to keep switching frequencies independent.
추천
Software-Defined Radio Front-End
The EP3CLS200F780I7N is suitable for software-defined radio baseband processing where 198,464 logic elements and 425 18x18 multipliers implement digital down/up-conversion, channelization, and digital pulse shaping for signals up to ~100 MHz bandwidth. The 8,211,456 bits of embedded M9K memory buffer I/Q samples between ADC/FIFO and DSP pipelines without external SRAM. SEU-aware scrubbing (a Cyclone III LS feature) prevents bit-flips from corrupting long-running radio links. Practical note: use a dedicated PLL to de-skew the ADC sampling clock from the FPGA fabric, and isolate the analog supply (2.5 V PLLVDD) from the noisy digital 1.2 V VCCINT with a ferrite bead.
추천
Machine Vision and Image Processing
The EP3CLS200F780I7N suits machine vision pipelines - camera-link frame grabbers, MIPI-CSI bridges, and real-time image pre-processing (Sobel, Canny, thresholding) at 1080p60 throughput. Its 425 hardware multipliers accelerate convolution kernels, and 8 Mbit of block RAM holds line buffers without external memory. The 413 I/O pins interface directly to Camera Link LVDS pairs, HDMI transmitters, or parallel CMOS sensors. The industrial temperature grade supports factory-floor deployments. Design tip: instantiate a dedicated PLL to generate the pixel clock from the camera's line/frame sync; reserve a top-row bank for high-speed LVDS to avoid crosstalk from switching I/O.
추천
Aerospace and Defense Subsystems
The EP3CLS200F780I7N is well-suited for aerospace and defense electronics where the Cyclone III LS silicon adds single-event upset (SEU) detection on configuration RAM and parity checking on internal memory - critical at altitude where cosmic-ray-induced bit-flips can corrupt state machines or data paths. Designers load the Altera SEU mitigation IP to scrub the configuration CRAM continuously, and use the JTAG interface for in-flight readback verification. The 198K LEs handle protocol stacks (MIL-STD-1553, ARINC 429, SpaceWire) alongside DSP for radar warning receivers. Note: for full radiation hardness, screen the lot or use a Rad-Tolerant variant; the EP3CLS200 is not formally QML-V qualified.
추천
ASIC Prototyping and Emulation
The EP3CLS200F780I7N serves as an ASIC prototyping vehicle for medium-complexity SoCs - the 198K LEs map typical RTL blocks, and the 8 Mbit of block RAM plus optional external DDR2 controller (via soft IP) emulates SoC memory subsystems. Engineers partition multi-million-gate ASICs across multiple EP3CLS200 devices on a prototyping board; each FBGA-780 device provides enough I/O for chip-to-chip trace routing at 200+ MHz. The Quartus II incremental compile flow accelerates iteration. Trade-off: fabric latency (~1 ns per LUT) is longer than ASIC; timing closure may not exactly mirror silicon, but functional verification is high-fidelity.
추천
Test and Measurement Instrumentation
The EP3CLS200F780I7N fits mid-range test equipment - logic analyzers, protocol exercisers, arbitrary waveform generators - because the 198K LEs implement deep state machines and parallel data paths, while the 425 multipliers enable on-chip FFT, FIR filtering, and digital pre-distortion. The 413 user I/O accommodates multiple test channels (LVDS, LVCMOS) plus front-panel displays via SPI bridges. The Cyclone III LS process offers deterministic timing suited to T&M calibration. Design tip: dedicate one PLL per test channel group to phase-align sampling clocks; isolate the FPGA's analog power pins (PLLVDD, VCCAUX) from switching supplies with pi-filters.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3CLS200F780I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3CLS200F780I7 | EP3CLS200F780C8N | EP3CLS150F780I7N | EP3CLS100F780I7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (1.0 mm pitch) | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Logic Elements | 198,464 | 198,464 | 198,464 | 150,848 | 100,448 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 | 8,211,456 | 6,113,856 | 4,248,768 |
| 18x18 Multipliers | 425 | 425 | 425 | 320 | 220 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Max User I/O | 413 | 413 | 413 | 413 | 413 |
| Speed Grade | 7 | 7 | 8 | 7 | 7 |
| Operating Temperature | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) |
| RoHS Status | Lead-free (RoHS compliant) | Non-RoHS tape-and-reel | Lead-free (RoHS compliant) | Lead-free (RoHS compliant) | Lead-free (RoHS compliant) |
주요 차별점
- Highest-density Cyclone III LS in FBGA-780 with SEU scrubbing (vs EP3CLS150F780I7N)
- Industrial temperature range at same density (vs EP3CLS200F780C8N)
- RoHS lead-free finish on identical die (vs EP3CLS200F780I7)
설계 노트
The EP3CLS200F780I7N requires a four-layer PCB minimum with continuous VCCINT (1.2 V), VCCAUX (2.5 V), and GND planes. Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCCINT/VCCAUX pin pair, and add 10 µF bulk tantalum or ceramic capacitors near each quadrant of the device. Estimated: with 198K LEs at typical 30% utilization toggling at 100 MHz, the core current draw is approximately 1.0-1.4 A on VCCINT and 100-150 mA on VCCAUX. Always follow Intel's PDN design guidelines for the Cyclone III LS family.
Estimated: at 1.2 V VCCINT and 1.2 A core current, internal dissipation is roughly 1.4 W. With FBGA-780's theta_JA around 15-20 °C/W (4-layer JEDEC test board, no airflow), junction temperature rise above ambient is ~25-30 °C, keeping Tj well below the 100 °C industrial limit at 70 °C ambient. For sealed enclosures without airflow, add a thermal pad bonded to an internal copper pour. Avoid placing the FPGA directly above heat-dissipating components.
FBGA-780 requires 1.0 mm pitch with non-solder-mask-defined (NSMD) pads per Intel package specifications. Use microvia-in-pad or dogbone fan-out for breakout, and keep all BGA escape traces on the top layer to layer 3 with continuous reference plane. Pair each differential I/O (LVDS) with 100 Ω differential impedance, and length-match within 150 mils. Stagger via-stitching around the BGA perimeter at 1.0 mm spacing to suppress edge radiation. Follow IPC-7351 and JEDEC JESD51 for land pattern and thermal characterization.
Three pitfalls to avoid: (1) Do not route I/O bank voltages with mismatched VCCIO - each bank supports 1.2/1.5/1.8/2.5/3.3 V independently and mixing LVCMOS33 with LVDS18 in adjacent banks without proper VCCIO sequencing can damage I/O buffers. (2) Configuration mode pins (MSEL0/MSEL1/MSEL2) must be hardwired to select Active Serial (AS), Passive Serial (PS), or FPP - a wrong setting silently prevents configuration. (3) Cyclone III LS configuration RAM is sensitive to brown-out - VCCINT must ramp monotonically; add a voltage supervisor (e.g., TPS3823) on the POR signal if supply rise time exceeds 100 ms.
규정 준수 정보
RoHS-compliant per FBGA-780 lead-free datasheet note. Industrial temperature grade but not AEC-Q100 qualified - this is a logic device, not an automotive-grade IC. Halogen-free status not stated in available data.
