EP3CLS200F780I7N vs EP3CLS200F780C8ES 비교
다음의 상세 나란히 비교: EP3CLS200F780I7N 제조: Intel 및 EP3CLS200F780C8ES 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3CLS200F780I7N | EP3CLS200F780C8ES |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $240.00 | $215.00 |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | Cyclone III LS |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 LAB | 12,404 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 413 | 413 |
| Process Technology | 65 nm CMOS (low-power) | 65 nm CMOS (low-power) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | 8 |
| 동작 온도 | -40 °C to +100 °C (industrial) | — |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| 패키지 | 780-ball FBGA (FBGA-780) | 780-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| RoHS 상태 | Compliant (lead-free per FBGA-780 datasheet note) | Compliant (lead-free FBGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded 18x18 Multipliers | — | 396 |
| Core Supply Voltage | — | 1.2 V |
| 동작 접합 온도 | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |