EP3CLS70F484I7N - Cyclone III LS FPGA, 70K LEs, 484-FBGA | Intel
부품 번호: EP3CLS70F484I7N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87 | $870.00 |
| 100 | $78 | $7,800.00 |
| 250 | $72 | $18,000.00 |
| 500 | $67.5 | $33,750.00 |
EP3CLS70F484I7N 개요
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets engineers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed I/O after manufacturing. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism, reconfigurability, and rapid prototyping without NRE costs. Cyclone III LS devices sit in the low-power, cost-optimized segment of Intel's FPGA portfolio and are commonly used as glue logic, co-processors, or primary control engines in industrial systems.
Key features include up to 274 embedded 18x18 multipliers for DSP, dedicated high-speed LVDS I/O up to 875 Mbps, 4 PLLs per device, and support for external memory interfaces including DDR2/DDR3/QDRII+. The device supports JTAG (IEEE 1149.1) and passive/active serial configuration modes. The 484-FBGA package uses Intel's lead-free FineLine BGA footprint with a 1.0 mm ball pitch.
Architecturally, the Cyclone III LS family combines low static power (~50 mW typical quiescent) with enhanced design security including configuration bitstream AES-128/256 encryption and JTAG access protection. This makes the device attractive for equipment manufacturers who need to protect IP and prevent cloning without paying for a higher-cost Cyclone IV or Cyclone V device.
Typical applications include industrial motor control and PLCs, video surveillance image processing, factory automation bridges (PROFINET/EtherCAT/MODBUS), medical imaging front-ends, and avionics/ground-vehicle digital signal processing subsystems. The wide industrial operating range also suits outdoor telecom line cards and rail-signalling controller boards.
When designing with this FPGA, plan the power tree to provide 1.2 V core, 2.5 V/3.3 V I/O, and a separate PLL analog supply. Use Intel Quartus II (legacy) or Quartus Prime design software for synthesis, place-and-route, and timing closure. Decoupling follows a 0402/0603 ceramic array under the BGA with at least one 100 uF bulk cap per rail.
This page synthesizes distributor pricing, same-package drop-in alternatives from Intel's Cyclone III/III LS family, and practical design notes not found in any single manufacturer datasheet.
드롭인 대체품: EP3CLS70F484I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3CLS70F484I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Logic Array Blocks (LABs), Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3CLS100F484I7N
✅ 드롭인✓ 재고 있음
$67.9 / 개
데이터시트 보기 →EP3CLS150F484I7N
✅ 드롭인✓ 재고 있음
$192.4 / 개
데이터시트 보기 →EP3CLS70F484I7
✅ 드롭인✓ 재고 있음
$49.1 / 개
데이터시트 보기 →EP3CLS70F484C8N
✅ 드롭인✓ 재고 있음
$56.8 / 개
데이터시트 보기 →EP3CLS70F484C7N
✅ 드롭인✓ 재고 있음
$96.3 / 개
데이터시트 보기 →EP3C120F484I7N
✅ 드롭인✓ 재고 있음
$84.7 / 개
데이터시트 보기 →EP3CLS70F484I7N 최대 정격 & 전기적 특성
| Family | Cyclone III LS |
| Logic Elements (LEs) | 70,208 |
| Embedded Memory Bits | 3,068,928 bits |
| User I/Os | 278 |
| DSP Blocks (18x18 Multipliers) | 274 |
| PLLs | 4 |
| Maximum User I/O Pins | 294 |
| Process Technology | 65 nm low-power CMOS |
| Core Supply Voltage | 1.2 V |
| 패키지 | 484-ball FBGA (FineLine BGA), 1.0 mm pitch |
| 동작 온도 | -40C to +100C (Industrial, I7 speed grade) |
| Configuration Mode | Passive Serial, Active Serial, JTAG |
| Memory Interfaces | DDR2, DDR3, QDRII+, RLDRAM II |
| LVDS Data Rate | Up to 875 Mbps per channel |
| RoHS 상태 | Compliant |
EP3CLS70F484I7N 484-ball fbga (fineline bga), 1.0 mm pitch 핀 구성 가이드
EP3CLS70F484I7N(484-ball fbga (fineline bga), 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3CLS70F484I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3CLS70F484I7N 적합 용도: 7 애플리케이션s: Industrial PLC and Motor Control, Video Surveillance and Image Processing, Medical Imaging Front-End, Factory Automation Protocol Bridge, Aerospace and Avionics Subsystems, Telecom Line Card Pre-Processing, Portable Test and Measurement Instruments.
Industrial PLC and Motor Control
The EP3CLS70F484I7N's 70,208 logic elements, 274 DSP 18x18 multipliers, and 4 PLLs make it well suited to industrial programmable logic controllers and multi-axis motor drives. Field-oriented control loops typically require 30-40K LEs plus high-precision PWM; the remaining headroom handles Modbus/Profibus/EtherCAT slave interfaces. Industrial -40C to +100C junction rating supports enclosed cabinet deployment. Quartus II with Qsys IP libraries shortens PLC firmware bring-up.
추천
Video Surveillance and Image Processing
The EP3CLS70F484I7N provides sufficient DSP bandwidth (up to 137 GMACs at 18x18) to implement real-time motion-detection, edge detection, and JPEG/H.264 pre-processing at D1/720p resolutions. Its 3,068,928 bits of embedded memory serve as line buffers for deinterlacing and noise-reduction pipelines. LVDS channels at 875 Mbps support direct LVDS camera input. Industrial temperature grade suits outdoor IP-camera housings without extra thermal management.
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Medical Imaging Front-End
In medical ultrasound and digital X-ray front-ends, the EP3CLS70F484I7N performs beamforming, FIR filtering, and envelope detection while staying within tight BOM constraints. The 274 18x18 multipliers drive 16-32 channel phased-array processing; the 278 user I/Os accept LVDS data from 8-12 bit ADCs at sample rates up to 80 MSPS. AES-encrypted configuration bitstream protects proprietary beamforming IP. 1.2 V low-power core aids thermal management in compact cart-mounted equipment.
추천
Factory Automation Protocol Bridge
The EP3CLS70F484I7N implements multi-protocol industrial bridges (PROFINET IRT to EtherCAT, MODBUS TCP to CANopen) by combining Nios II soft-core or ARM Cortex-M1 with deterministic Ethernet MACs. The 70K logic elements support full protocol stacks including Webserver, while 3 Mb of block RAM caches process data. Industrial -40C to +100C junction range supports cabinet and DIN-rail mounting. The device's 484-FBGA package simplifies high-density routing for 100 Mbps Ethernet PHYs.
추천
Aerospace and Avionics Subsystems
The EP3CLS70F484I7N's industrial temperature range, low static power, and 1.2 V core make it attractive for commercial avionics subsystems and UAV flight controllers where power budget and thermal envelope are constrained. The 70K LEs and 274 DSP blocks implement INS/GPS fusion, control law computation, and MIL-STD-1553 or ARINC-429 interfaces. AES bitstream encryption protects navigation IP. Designers should review DO-254 design-assurance guidance when targeting safety-critical flight applications.
추천
Telecom Line Card Pre-Processing
In edge telecom line cards, the EP3CLS70F484I7N performs packet classification, traffic shaping, and forward-error-correction (FEC) pre-processing before forwarding to network processors. Its 4 PLLs drive independent clocks for fabric, SERDES reference, and packet memory, while 278 user I/Os accept SGMII/1000BASE-T signals through external PHYs. Industrial temperature grade suits outdoor base-station and roadside-cabinet deployment. AES-encrypted configuration secures operator-specific QoS algorithms.
추천
Portable Test and Measurement Instruments
The EP3CLS70F484I7N powers portable oscilloscopes, logic analyzers, and protocol testers by providing rapid DSP for FFT and protocol decoding. The 274 multipliers enable real-time 1024-point FFT for spectrum display; 3 Mb of block RAM serves as deep acquisition buffer. Low 1.2 V core and Cyclone III LS static-power reductions extend battery life on handheld units. JTAG and active-serial configuration modes simplify factory firmware update and field re-flash through USB-Blaster.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3CLS70F484I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3CLS100F484I7N | EP3CLS150F484I7N | EP3CLS70F484I7 | EP3CLS70F484C8N | EP3C120F484I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (1.0 mm pitch) | FBGA-484 (1.0 mm pitch) - same | FBGA-484 (1.0 mm pitch) - same | FBGA-484 (1.0 mm pitch) - same | FBGA-484 (1.0 mm pitch) - same | FBGA-484 (1.0 mm pitch) - same |
| Logic Elements | 70,208 | 100,208 (+43%) | 150,408 (+114%) | 70,208 (same) | 70,208 (same) | 119,088 (+69%) |
| Embedded Memory | 3,068,928 bits | 3,888,384 bits (+27%) | 5,630,976 bits (+83%) | 3,068,928 bits (same) | 3,068,928 bits (same) | 3,981,312 bits (+30%) |
| DSP 18x18 Multipliers | 274 | 274 (same) | 344 (+26%) | 274 (same) | 274 (same) | 288 (+5%) |
| User I/Os (max) | 278 | 278 (same) | 278 (same) | 278 (same) | 278 (same) | 283 (+2%) |
| Speed Grade / Temp | I7 (Industrial, -40C to +100C) | I7 (same) | I7 (same) | I7 (same, no N) | C8 (Commercial, 0C to +85C) | I7 (same) |
| AES Configuration Encryption | Yes (LS family feature) | Yes | Yes | Yes | Yes | No (Cyclone III non-LS) |
주요 차별점
- AES bitstream encryption with tamper detection (vs EP3C120F484I7N (Cyclone III non-LS))
- Lower static power than standard Cyclone III (vs EP3C70F484I7N)
- On-die PLLs with dynamic phase shift (vs EP3CLS70F484I7 (no N suffix))
설계 노트
The EP3CLS70F484I7N requires four separate power rails: 1.2 V VCCINT (core), 2.5 V or 3.3 V VCCIO per bank, 3.3 V VCCA (PLL analog), and a configuration supply. Use a low-dropout regulator such as a TPS74401 or LTM4624 to generate 1.2 V with <2% tolerance; the FPGA's core current can reach 1-2 A under heavy DSP and SERDES activity. Decouple each rail with 0.1 uF and 10 uF ceramics plus one bulk 100 uF cap near the BGA's power balls. Power-on reset sequencing: VCCINT must rise before or simultaneously with VCCIO to avoid latch-up.
The 484-ball FineLine BGA has a typical theta-JA of approximately 14 C/W on a JEDEC 4-layer test board with airflow of 0 m/s. Estimated junction temperature at 1.5 W worst case (industrial DSP workload) is TJ = TA + 1.5 W x 14 C/W = TA + 21 C; for a 70 C ambient enclosure, TJ = 91 C - within the +100 C industrial limit. For enclosed industrial cabinets with no airflow, derate I/O toggle rate or add a thermal via array under the BGA thermal pad to reduce theta-JA below 10 C/W.
BGA-484 at 1.0 mm pitch requires 0.5 mm via-pad diameter, 0.25 mm laser-drilled micro-via, and 0.1 mm trace/space routing on the top layer; for a 4-layer stackup use 1-2-1 routing on outer layers. Place all decoupling within 100 mil of the BGA balls; route differential pairs (LVDS/clock) with 100 ohm differential impedance and length matching within 50 mil. Ground plane stitching vias every 200 mil around the BGA periphery; the BGA thermal pad must be soldered to a 6x6 thermal-via array tied to internal ground.
Configure the EP3CLS70F484I7N via JTAG (IEEE 1149.1) or active-serial (EPCS/EPCQ flash). For secure boot, use AES-encrypted configuration bitstream with the design's 128-bit or 256-bit key stored in the FPGA's non-volatile key store; load the key through JTAG once and lock it permanently. Always include a recovery mechanism (e.g., external MAX II CPLD or a hot-key push-button) to erase and re-load the key if lost, since AES key recovery is impossible by design.
Common design errors include: (1) connecting VCCIO to 1.8 V rails that cannot supply the inrush current - use 2.5 V or 3.3 V instead; (2) leaving unused I/O banks floating - tie them to VCCIO with the Quartus default setting; (3) ignoring tBIC (BIC_SEL setup) timing when configuring from a slow MCU - keep MSEL[2:0] pins at valid logic levels; (4) failing to enable the JTAG instruction for key-programming before issuing the AES key - this permanently locks the device. Always run Quartus power analyzer and pin-planner reports before tape-out.
규정 준수 정보
RoHS compliant per Intel/Altera product page; FBGA-484 uses lead-free SAC solder balls. Halogen-free status not explicitly stated in the verified web data - marked unknown. AEC-Q100 not applicable for FPGAs (not an automotive-grade qualification at component level). Conflict minerals compliance per Intel corporate policy.
