EP3CLS150F484I7N - Cyclone III 150K LE FPGA | Intel | FBGA-484
부품 번호: EP3CLS150F484I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215.75 | $107,875.00 |
| 1,000 | $192.4 | $192,400.00 |
EP3CLS150F484I7N 개요
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic function is defined after manufacturing by loading a user-supplied bitstream into on-chip SRAM configuration memory. FPGAs occupy the middle ground between general-purpose microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). The Cyclone III LS specifically targets applications that require reconfigurable logic plus hardware root-of-trust: industrial motor control, secure communications, automotive driver assist, and medical imaging front-ends.
Key features of the EP3CLS150F484I7N include 150,848 logic elements distributed across 9,428 LABs (logic array blocks), 6.14 Mbits of embedded SRAM (M9K blocks), 210 18x18 multipliers capable of up to 450 MHz DSP performance, 4 PLLs, 20 global clock networks, and up to 210 user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Power consumption is optimized for cost-sensitive high-volume applications through 1.0 V core operation and selectable I/O bank voltages.
Architecturally, Cyclone III LS uses a 65 nm low-power CMOS process with a programmable interconnect fabric driven by SRAM configuration cells. The 'LS' suffix adds a tamper-resistant configuration subsystem including 256-bit AES encryption, a non-volatile security key, and a hardware JTAG block that can lock the device against readback. This makes the EP3CLS150F484I7N suitable for designs where IP protection is a contractual or regulatory requirement.
Typical applications include industrial Ethernet switches, motor-control servo drives, video surveillance DVR back-ends, software-defined radio modems, low-cost ASIC prototyping, and PCI Express endpoint bridges. The 484-ball FBGA package supports moderate-density board layouts and reflow soldering at standard JEDEC J-STD-020 profiles.
When designing with this device, allocate at least 4 configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK or AS data lines) and respect the differential clock input pair placement rules. Quartus II (or newer Intel Quartus Prime) software is required for synthesis, place-and-route, and bitstream generation. The 'I7' speed grade and 'N' lead-free suffix indicate an industrial-temperature, lead-free / RoHS-compliant device.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP3CLS150F484I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3CLS150F484I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Logic Elements, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3CLS150F484I7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$101.1 / 개
데이터시트 보기 →EP3CLS200F484I7N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP3C120F484I7N
✅ 드롭인✓ 재고 있음
$84.7 / 개
데이터시트 보기 →EP3C80F484I7N
✅ 드롭인✓ 재고 있음
$286.91 / 개
데이터시트 보기 →EP3C55F484I7N
✅ 드롭인✓ 재고 있음
$205.4 / 개
데이터시트 보기 →EP3CLS150F484C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$115.2 / 개
데이터시트 보기 →EP3CLS150F484C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$102.75 / 개
데이터시트 보기 →EP3CLS150F484I7N 최대 정격 & 전기적 특성
| Family | Cyclone III LS |
| Logic Elements | 150,848 |
| Logic Array Blocks (LABs) | 9,428 |
| Embedded Memory (M9K blocks) | 6,137,856 bits (6.14 Mbit) |
| Embedded Multipliers (18x18) | 210 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O | 210 |
| 패키지 | FBGA-484 (FineLine BGA) |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage | 1.0 V (typical) |
| 동작 온도 | -40C to +100C (Industrial, 'I') |
| Speed Grade | 7 |
| Lead-Free / RoHS | Yes (suffix 'N') |
| Configuration Schemes | AS, AP, PS, FPP, JTAG |
| Security Features | 256-bit AES bitstream encryption, JTAG secure mode, CRC |
| DSP Performance | Up to 450 MHz on 18x18 multipliers |
EP3CLS150F484I7N fbga-484 (fineline bga) 핀 구성 가이드
EP3CLS150F484I7N(fbga-484 (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3CLS150F484I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3CLS150F484I7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance / DVR Back-End, Industrial Ethernet Switch / Protocol Bridge, Software-Defined Radio Modem, Medical Imaging Front-End, ASIC Prototyping Platform.
Industrial Motor Control
The EP3CLS150F484I7N is well matched to industrial servo drives and inverter controllers. Its 210 dedicated 18x18 hardware multipliers handle field-oriented-control (FOC) math at the typical 10-20 kHz PWM switching frequency, while 6.14 Mbit of embedded SRAM buffers current-loop and encoder-decoding state without external memory. The 210 user I/O pins drive multi-axis inverter bridges, and the -40C to +100C industrial temperature rating supports cabinet-mounted installations. Unlike microcontrollers, the FPGA's parallel hardware execution sustains deterministic sub-microsecond control-loop latency under heavy interrupt load.
추천
Video Surveillance / DVR Back-End
In multi-channel DVR and NVR back-ends, the EP3CLS150F484I7N handles H.264/H.265 encode offload, motion-detection preprocessing, and video pipelining. The 150K logic elements sustain 4-8 channels of 1080p30 preprocessing at 150 MHz, and 6.14 Mbit embedded memory holds reference frames for short-loop motion compensation. The LS family's 256-bit AES bitstream encryption protects manufacturer IP in competitive surveillance markets. Compared with ASSP SoCs, the FPGA's reconfigurable fabric lets OEMs add proprietary analytics without respinning the host board.
추천
Industrial Ethernet Switch / Protocol Bridge
The EP3CLS150F484I7N supports wire-speed protocol bridging for EtherCAT, PROFINET, and EtherNet/IP gateways. Its 20 global clock networks feed multiple Ethernet MAC IPs running concurrently, and 6.14 Mbit embedded SRAM provides line-rate packet buffers on the order of 16K packets at 64-byte payloads. The 210 I/O pins accommodate multi-port MII/RGMII PHYs plus GPIO for diagnostics, and the industrial temperature range suits factory-floor deployments. Hardware AES encryption in the LS family protects proprietary gateway bitstreams.
추천
Software-Defined Radio Modem
In software-defined radio baseband designs, the EP3CLS150F484I7N implements multi-standard waveform processing (LTE, WiMAX, proprietary) with parallel DSP blocks. The 210 18x18 multipliers sustain channel filter, FFT, and channel-coding arithmetic at baseband sample rates up to 100 MSPS, while 6.14 Mbit embedded memory holds waveform coefficients and symbol buffers. The 4 on-chip PLLs generate the multiple baseband clocks required for ADC/DAC interfacing, and the LS family's hardware AES protects waveform IP.
추천
Medical Imaging Front-End
The EP3CLS150F484I7N is deployed in ultrasound beamformers and patient-monitoring pre-processors. Its parallel multiplier array executes beamforming summation across 32-64 channels at real-time rates, and the 6.14 Mbit embedded SRAM holds channel calibration coefficients and beamformed frame buffers. The 4 PLLs synchronize ADC sample clocks with beamformer clocks, and the -40C to +100C industrial temperature rating tolerates chassis-internal heating. Hardware AES encryption helps protect patient-data bitstreams in regulated deployments.
추천
ASIC Prototyping Platform
Designers use the EP3CLS150F484I7N as a target for ASIC RTL prototyping because 150K logic elements map roughly to 3-5 million gates of typical ASIC netlists. The 6.14 Mbit embedded memory models ASIC SRAM macros, and the 210 I/O pins permit real-world peripheral interfacing. Compared with emulators, the FPGA's standard JTAG and AS configuration modes simplify bring-up, while Quartus Prime synthesis shortens the prototype iteration cycle. Once the RTL is validated, the same firmware tools used for the FPGA prototype can be reused for ASIC tape-out.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3CLS150F484I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3CLS150F484I7 | EP3CLS200F484I7N | EP3C120F484I7N | EP3C80F484I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 150,848 | 150,848 - same | 200,000 (Cyclone III LS) | 120,000 (Cyclone III) | 81,000 (Cyclone III) |
| Embedded Memory | 6.14 Mbit | 6.14 Mbit | 8.55 Mbit | 3.89 Mbit | 2.74 Mbit |
| 18x18 Multipliers | 210 | 210 | 250 | 288 | 128 |
| Maximum User I/O | 210 | 210 | 193 | 213 | 295 |
| AES Encryption | Yes (LS family) | Yes | Yes | No | No |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Speed Grade | 7 | 7 | 7 | 7 | 7 |
주요 차별점
- Largest 150K-LE Cyclone III LS in FBGA-484 footprint (vs EP3C120F484I7N)
- 256-bit AES bitstream encryption (vs EP3C120F484I7N (non-LS))
- Balanced DSP and logic density for mid-range applications (vs EP3CLS200F484I7N)
설계 노트
The EP3CLS150F484I7N in FBGA-484 has a typical junction-to-ambient thermal resistance (theta_JA) around 11 C/W with adequate PCB thermal vias under the package center. Estimated: at full design utilization (90% LE, 80% RAM, 50% multipliers) the device dissipates approximately 2-3 W steady-state; with 4 thermal vias under the BGA center thermal pad connected to an inner copper plane, junction temperature stays below 100C in still air at 70C ambient. For chassis-mounted industrial designs without forced airflow, add a 6 mm x 6 mm copper heatsink or extend the inner ground plane to maximize heat spreading.
The EP3CLS150F484I7N requires four separate supply rails: VCCINT (1.0 V core), VCCA (2.5 V PLL analog), VCCIO (per-bank, 1.2 V to 3.3 V), and VCCD_PLL (1.0 V PLL digital). Decoupling requirements per Intel Cyclone III Device Handbook: 100 nF X7R for every 5 LABs and one 10 uF bulk cap per supply, placed within 100 mils of the respective balls. Sequencing: VCCINT must ramp before VCCIO; failure to sequence damages internal ESD structures. Add a load switch or sequencer IC (e.g., LTC2928) when rails come from separate regulators.
The FBGA-484 has a 1.0 mm pitch with 484 balls on a 22x22 array (with depopulated corners). PCB layout must use microvia stacks or HDI technology with 0.4 mm laser-drilled microvias in pad for reliable assembly. Estimated: escape routing requires at least 4 routing layers between BGA and first breakout; for full I/O utilization, plan for 8-10 routing layers. Follow Intel AN 483 (formerly Altera AN 483) for FPGA-specific PCB stack-up guidance including impedance-controlled traces for LVDS pairs and reference-plane continuity under high-speed clock nets.
Three common pitfalls when designing with the EP3CLS150F484I7N: (1) assigning JTAG signals (TCK, TMS, TDI, TDO) to user I/O without disabling JTAG mode in the Quartus device options - this causes JTAG contention. (2) Forgetting to specify the configuration scheme (AS, PS, FPP) in the Quartus pin planner, leading to unassigned MSEL pins and a non-functional board. (3) Using the 'I7' speed grade with Quartus timing constraints that assume the faster 'C8' grade - hold-time violations appear at low voltage and cold temperature. Always download the matching device datasheet section for the exact speed grade.
Clock routing is the most layout-sensitive aspect. The 4 PLLs feed 20 global clock networks; long clock traces must be matched within 25 ps to avoid skew-induced timing failures. Estimated: route all clock nets on an inner stripline layer adjacent to a continuous ground plane. Place PLL filter components (the 0.1 uF + 10 uF RC network on VCCA) within 200 mils of the PLL ball with no signal traces crossing under the filter network to prevent coupling of high-frequency noise into the PLL voltage domain.
규정 준수 정보
RoHS compliant per 'N' suffix in MPN; lead-free (Pb-free) ball finish per JEDEC J-STD-020. Halogen-free per Intel Cyclone III LS materials declaration. AEC-Q100 not applicable - this is an FPGA intended for industrial/commercial use, not automotive-grade. For automotive designs, consider Cyclone IV or Cyclone V automotive-qualified variants.
