EP3SE110F1152C2N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Altera
부품 번호: EP3SE110F1152C2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2390 | $239,000.00 |
| 500 | $2150 | $1,075,000.00 |
| 1,000 | $1925 | $1,925,000.00 |
EP3SE110F1152C2N 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines the integration density of an Application-Specific Integrated Circuit (ASIC) with the flexibility of software-reconfigurable logic. FPGAs sit at the top of the digital logic hierarchy, above standard logic ICs, microcontrollers, and DSPs. The Stratix III E family is Altera's high-performance, DSP-and-transceiver-rich tier engineered for digital signal processing, high-speed serial I/O, and embedded processor subsystems, and is positioned within Intel's broader FPGA portfolio (Cyclone, Arria, Stratix, Agilex) for high-throughput compute and communications workloads.
Key features of the EP3SE110F1152C2N include 4,300 Logic Array Blocks (LABs) in the Stratix III E ALM-based fabric, embedded DSP blocks for high-speed multiply-accumulate operations, up to 24 transceivers capable of multi-gigabit serial links, and a programmable power technology that dynamically reduces static power. The device also integrates PCI Express hard IP, external memory controllers (DDR/DDR2/QDRII/RLDRAM), and a rich clock network with PLLs. Operating temperature is graded commercial (0 °C to +85 °C) as indicated by the "C2" speed/temperature grade code.
Typical applications include high-performance digital signal processing, telecom baseband processing, ASIC prototyping, software-defined radio, video processing pipelines, and high-throughput industrial imaging. The high logic density and generous embedded memory make the EP3SE110F1152C2N suitable for system-on-chip prototyping and compute acceleration in communications infrastructure.
When designing with the EP3SE110F1152C2N, careful attention must be paid to power-rail sequencing, multi-layer PCB stack-up with continuous reference planes, and signal integrity on high-speed serial links. The FC-FBGA package requires via-in-pad or microvia technology for breakout routing, and a minimum of 12 PCB layers is typically recommended.
This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes not found in the standalone manufacturer datasheet.
드롭인 대체품: EP3SE110F1152C2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE110F1152C2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE110F1152C2
✅ 드롭인✓ 재고 있음
$4100 / 개
데이터시트 보기 →EP3SE110F1152C2N-ES
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3SE260F1152C3N
✅ 드롭인✓ 재고 있음
$7500 / 개
데이터시트 보기 →EP3SE110F1152I2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1480 / 개
데이터시트 보기 →EP3SE110F1152C2N 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| User I/Os | 744 |
| Total Embedded Memory | 8,936,448 bits |
| Total RAM Blocks | 744 (M9K + M144K) |
| DSP Blocks | 112 (18x18 multipliers) |
| Maximum Core Frequency | 600 MHz |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| 패키지 | 1152-ball FC-FBGA (35x35 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | 0 °C to +85 °C (Commercial) |
| Speed Grade | C2 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP3SE110F1152C2N 1152-ball fc-fbga (35x35 mm) 핀 구성 가이드
EP3SE110F1152C2N(1152-ball fc-fbga (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE110F1152C2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE110F1152C2N 적합 용도: 7 애플리케이션s: Telecom Baseband Signal Processing, ASIC Prototyping and Emulation, Software-Defined Radio (SDR), Video Processing Pipelines, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Aerospace Avionics and Defense.
Telecom Baseband Signal Processing
The EP3SE110F1152C2N fits telecom baseband cards that require multi-channel FFT, turbo decoding, and channel aggregation. Its 112 DSP blocks each contain multiple 18x18 multipliers with accumulation, and the 8.9 Mbit embedded memory holds rotating channel coefficient tables without external SRAM thrash. Placed on a line card between CPRI fronthaul transceivers and the backplane fabric, the FPGA runs 4G LTE 20 MHz channels with ease. Compared with a DSP processor approach, the Stratix III E fabric closes timing at 300-450 MHz on typical SISO/MIMO datapaths and sustains deterministic latency that a software DSP cannot match. Note that the 1.1 V core requires a multi-rail sequencer per Stratix III handbook guidelines.
추천
ASIC Prototyping and Emulation
The EP3SE110F1152C2N's 107,500 logic elements are routinely used to prototype mid-complexity ASICs (typically 2-5M ASIC gates). The Stratix III E ALM-based fabric emulates ASIC standard cells one-to-one with reasonable timing fidelity, and the 744 user I/Os support break-out to daughter-card ASIC pin headers. Designers partition the ASIC into multiple Stratix III devices using Altera's proven multi-FPGA partitioning flow, with each EP3SE110 handling a slice of the design and dedicated clock channels keeping the emulated ASIC globally synchronous. Compared to a software simulation environment, hardware emulation at FPGA speeds is 100-1000x faster, which is critical for embedded software bring-up on top of the emulated SoC.
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Software-Defined Radio (SDR)
The EP3SE110F1152C2N is widely used in mid-tier SDR platforms that need flexible waveform reconfiguration across military and commercial bands. Its high DSP block count handles channelization, pulse shaping, and demodulation in firmware, while the embedded memory captures wide-bandwidth sample buffers. SDR platforms use the FPGA between the ADC/DAC front end and a host processor, with the FPGA doing real-time baseband and the host running higher-layer protocols. The trade-off versus an ASIC is reconfigurability at the cost of higher power and lower per-channel density; the EP3SE110 is a sweet spot for sub-200 MHz IF designs and prototype LTE waveforms.
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Video Processing Pipelines
Broadcast video processing benefits from the EP3SE110F1152C2N's 744 user I/Os and rich external memory controllers for DDR2/QDRII buffers. Typical pipelines route HD-SDI or 3G-SDI streams into the FPGA, perform de-interlacing, scaling, color-space conversion, and overlay composition, then output to HDMI or SDI. The DSP blocks accelerate motion-adaptive de-interlacing and noise reduction; embedded memory holds multiple scan-line buffers without external SRAM. Compared with a GPU or DSP approach, the FPGA delivers deterministic frame latency which broadcast workflows require, and the 1152-ball FC-FBGA package exposes enough I/O bandwidth to drive multiple parallel video streams.
추천
Industrial Imaging and Machine Vision
High-throughput industrial cameras and inspection lines use the EP3SE110F1152C2N to process multi-megapixel sensor data at line-scan or area-scan rates. The FPGA handles sensor demosaic, color correction, edge detection, and on-the-fly compression before forwarding to the host. Embedded memory acts as line buffers so external DDR2 can be offloaded for higher-level tasks. The 744 user I/Os accept multiple Camera Link, CoaXPress, or LVDS sensor interfaces simultaneously. Compared with a CPU+GPU pipeline, an FPGA-based vision system delivers deterministic latency per frame, lower power per pixel processed, and simplified EMC compliance in factory-floor environments.
추천
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators use the EP3SE110F1152C2N for real-time acquisition, triggering, and stimulus generation. The FPGA sits between the analog front end (ADC/DAC) and the display/processor subsystem, doing real-time eye-diagram computation, protocol decoding, and trigger logic. Embedded memory captures pre-trigger samples and the DSP blocks compute FFTs and statistical accumulations on the fly. The trade-off versus dedicated DSP is flexibility - the same hardware can be firmware-reconfigured for PCIe, USB, Ethernet, or serial protocol test - while still meeting deterministic acquisition timing that software-only platforms cannot achieve.
추천
Aerospace Avionics and Defense
Avionics databus concentrators and defense signal intelligence platforms use the EP3SE110F1152C2N to bridge MIL-STD-1553, ARINC 429, and modern Ethernet avionics buses with deterministic timing. The FPGA performs bus monitoring, message filtering, and protocol translation across multiple redundant channels simultaneously. Embedded memory buffers pre-recorded waveforms for electronic warfare applications, and the DSP blocks accelerate pulse detection and classification. The industrial-temperature EP3SE110F1152I2N variant extends operating range for airborne platforms. Compared with discrete protocol ASICs, an FPGA approach consolidates multiple bus interfaces in one device and reduces SWaP (size, weight, power) per channel.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE110F1152C2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE110F1152C2 | EP3SE260F1152C3N | EP3SE110F1152I2N | EP3SE110F1152C2N-ES |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) |
| Logic Elements | 107,500 | 107,500 | 255,000 | 107,500 | 107,500 |
| User I/Os | 744 | 744 | 744 | 744 | 744 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 14,602,496 | 8,936,448 | 8,936,448 |
| DSP Blocks | 112 | 112 | 384 | 112 | 112 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0 to +85 °C (Commercial) | 0 to +85 °C | 0 to +85 °C | -40 to +100 °C (Industrial) | 0 to +85 °C |
| Lifecycle Status | Obsolete (legacy factory-excess) | Obsolete | Obsolete | Obsolete | Engineering sample |
주요 차별점
- Drop-in pin compatibility with the entire Stratix III E 1152-ball family (vs EP3SE260F1152C3N)
- Industrial-temperature sibling preserves footprint across temperature grades (vs EP3SE110F1152I2N)
- Production-grade C2N vs engineering-sample screening (vs EP3SE110F1152C2N-ES)
설계 노트
The 1152-ball FC-FBGA package requires microvia or via-in-pad PCB technology. Use a minimum 12-layer stack-up with continuous GND and PWR reference planes, and route high-speed transceiver and external memory signals on stripline layers adjacent to a solid GND plane. Estimate: an 8-layer stack-up can work for I/O-only designs but degrades signal integrity on multi-gigabit serial links. Decoupling must follow Altera's Stratix III PDN recommendation - high-frequency 0.1 uF/0.01 uF ceramics as close as possible to every ball pair plus bulk 47-220 uF polymer capacitors on each supply rail.
Estimated power analysis: at typical utilization (60-70% LE, 50% DSP, full I/O switching) the EP3SE110F1152C2N draws 8-12 W from the 1.1 V core plus I/O bank power. Power-rail sequencing per Stratix III handbook requires the 1.1 V core supply to ramp monotonically within ±300 mV of any VCCIO bank supply to prevent ESD/IO latch-up during hot-socketing. Use a multi-rail sequencer (e.g. UCD90120A or equivalent) and verify the monotonicity with an oscilloscope across the entire operating temperature range.
Configure all unused I/O pins as input tri-stated with weak pull-ups to prevent floating inputs from drawing supply current and creating noise. For high-speed transceiver channels, follow Altera's Stratix III PCB design guide for channel loss budgets (typically target < -6 dB at Nyquist for 6.375 Gbps). Use Time-Domain Reflectometry (TDR) to validate controlled-impedance traces (100 ohm differential for transceivers, 50 ohm single-ended for general I/O) before sign-off.
Estimated junction temperature: at 10 W total power dissipation and a 35x35 mm FC-FBGA with theta_JA of approximately 8-12 C/W on a 12-layer PCB with adequate thermal vias under the BGA, junction rises 80-120 C above the inlet air temperature. Provide forced-air cooling at 200-400 LFM or attach a heat spreader for fan-less enclosures. Industrial-temperature EP3SE110F1152I2N is preferred for sealed enclosures where the inlet air can exceed +70 C.
Do not assume C2N and C3N speed grades are timing-equivalent - the C3 grade closes timing ~15-20% faster on DSP-heavy paths and may cause hold-time violations if a C2N-tuned design is shifted to C3 without re-running the time-fitting stage. Also do not confuse 'C2' (commercial) with 'I2' (industrial); the temperature range shift requires re-characterizing FPGA timing models. Confirm device-grade markings on the lid (Altera-top-mark format) before integrating into a regulated environment.
규정 준수 정보
RoHS and lead-free status inferred from Altera/Intel product page declarations. AEC-Q100 is not applicable to FPGAs of this density and operating grade; aerospace/defense users typically require additional MIL-STD qualification at the board level.
