EP3SE110F1152I2N - Stratix III E 107.5K LE FPGA | Intel / Altera
부품 번호: EP3SE110F1152I2N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1610 | $161,000.00 |
| 500 | $1530 | $765,000.00 |
| 1,000 | $1480 | $1,480,000.00 |
EP3SE110F1152I2N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O can be configured by the user after manufacture. FPGAs sit in the programmable-logic tier of the broader digital IC hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and are used to implement parallel datapaths, high-speed serial interfaces, and custom glue logic that would otherwise require several discrete components or a custom ASIC.
Key features include up to 8,936,448 system gates, embedded memory blocks, DSP blocks, and high-speed transceivers supporting multi-gigabit serial protocols. The device operates from a 1.05 V to 1.15 V core supply (nominal 1.1 V) plus dedicated PLL and I/O bank supplies. Up to 744 user I/O pins are available depending on bank configuration, and the 1.00 mm-pitch FCBGA-1152 package is designed for high-density, multi-layer PCB assembly.
Architecturally, Stratix III Enhanced devices use a 40-nm low-power process and a programmable power technology that lets unused logic, memory, and transceiver blocks enter a near-zero static state. The fabric combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), and DSP blocks that together provide tens of GMACs of DSP throughput.
Typical applications include high-speed wireline and wireless baseband processing, ASIC prototyping, high-performance digital signal processing, broadcast video processing, and high-end test-and-measurement instrumentation. The high pin count and serial bandwidth make it well-suited for line-card designs and protocol bridge functions.
When designing with this device, plan PCB stack-up for the 1.0 mm-pitch FCBGA, route all transceiver differential pairs with controlled impedance, and observe the Quartus II power-estimator early in the design cycle. Power-supply sequencing and decoupling must follow the Stratix III Enhanced pin connection guidelines to avoid stress on the core logic.
This page synthesizes distributor pricing, package-specific alternatives from the Stratix III Enhanced family, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: EP3SE110F1152I2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE110F1152I2N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Family, Speed Grade, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE110F1152I3N
✅ 드롭인✓ 재고 있음
$3980 / 개
데이터시트 보기 →EP3SE110F1152I4N
✅ 드롭인✓ 재고 있음
$2950 / 개
데이터시트 보기 →EP3SE110F1152I3G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SE110F1152I2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SE110F1152C4N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE110F1152C2N
✅ 드롭인✓ 재고 있음
$1925 / 개
데이터시트 보기 →EP3SE110F1152I2N 최대 정격 & 전기적 특성
| Series | Stratix III Enhanced (EP3SE110) |
| Family | Stratix III |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LABs) / CLBs | 4,300 |
| System Gates | 8,936,448 |
| User I/O Pins | 744 |
| Number of Terminals | 1,152 |
| Package Code | BGA (FCBGA) |
| Package Shape | Square |
| Ball Pitch | 1.00 mm |
| Supply Voltage Range | 1.05 V to 1.15 V (nominal 1.1 V) |
| Process Technology | 40 nm low-power CMOS |
| Maximum Internal Clock Frequency | 100 MHz (per distributor summary; device supports multi-Gbps transceivers) |
| 동작 온도 | -40C to +100C (industrial) |
| Speed Grade | I2 |
| Lead-Free / RoHS | Yes (suffix N) |
| 실장 유형 | Surface Mount |
EP3SE110F1152I2N square 핀 구성 가이드
EP3SE110F1152I2N(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE110F1152I2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE110F1152I2N 적합 용도: 6 애플리케이션s: High-Speed Wireline Baseband Processing, ASIC Prototyping and Emulation, Broadcast Video Processing, High-Performance DSP and Signal Processing, Test and Measurement Instrumentation, Industrial Automation and Machine Vision.
High-Speed Wireline Baseband Processing
The EP3SE110F1152I2N fits wireline baseband line cards where 107,500 logic elements plus embedded DSP and TriMatrix memory sustain multi-lane packet processing at line rate. Designers exploit the FPGA's parallel datapath to map multi-channel framers, CRC engines, and FEC decoders into the fabric without resorting to external ASICs. The 1,152-ball FCBGA exposes the multi-gigabit transceivers needed for 10G/40G-class SERDES, while the 744 user I/Os fan out to backplane connectors, SFP+ cages, and synchronization clocks. Industrial-grade silicon supports outdoor cabinet and central-office deployments across -40C to +100C without thermal derating.
추천
ASIC Prototyping and Emulation
The EP3SE110F1152I2N is widely used as an ASIC prototype platform because it offers enough logic capacity (107.5K LE) and package pin count (744 user I/Os) to map large RTL partitions while preserving timing visibility through Quartus II. Multiple FPGAs of this density can be co-simulated via differential LVDS bridges, enabling pre-silicon hardware validation of multi-million-gate designs. Industrial temperature and lead-free assembly suit pre-silicon boards that will also be re-used for field trials and customer demonstrations. Quartus II's TimeQuest timing analyzer lets engineers correlate FPGA prototype timing with the eventual ASIC SDC constraints.
추천
Broadcast Video Processing
Broadcast video pipelines rely on the EP3SE110F1152I2N's parallel arithmetic and high I/O bandwidth to perform SD/HD/3G-SDI switching, de-interlacing, color-space conversion, and on-screen graphics overlay in real time. The DSP blocks accelerate polyphase scaling and motion-adaptive deinterlacing without loading the host CPU. With 744 user I/Os, the FPGA can aggregate multi-source SDI inputs, genlock reference clocks, and HDMI/DVI display interfaces in a single device. Industrial temperature grade supports 24/7 broadcast studio and headend environments where downtime is unacceptable.
추천
High-Performance DSP and Signal Processing
The EP3SE110F1152I2N integrates DSP blocks optimized for GMAC-class fixed- and floating-point arithmetic, making it well suited to radar, electronic-warfare, software-defined radio, and medical-imaging front ends. The 107,500 logic elements and TriMatrix memory allow the engineer to instantiate long FFT pipelines, FIR/IIR filters, and adaptive beam-formers that meet real-time throughput budgets. The high-pin-count FCBGA brings the multi-gigabit transceivers required for ADC/DAC JESD204B/C link aggregation, while industrial temperature allows deployment in outdoor and ruggedized enclosures.
추천
Test and Measurement Instrumentation
Test and measurement equipment vendors leverage the EP3SE110F1152I2N to integrate deep waveform memory, custom protocol triggering, and parallel DSP signal analysis into one slot of an LXI or PXI chassis. The combination of 8,936,448 system gates, M9K/M144K memory blocks, and 744 user I/Os enables 4-8 channel 12.5 GS/s acquisition subsystems with on-FPGA decimation. Industrial temperature and lead-free compliance support bench, portable, and production-line ATE environments. Quartus II's incremental compile flow accelerates firmware rev cycles between hardware spins.
추천
Industrial Automation and Machine Vision
Factory automation controllers and machine-vision platforms rely on the EP3SE110F1152I2N for deterministic multi-axis motion control, real-time EtherCAT/MII protocol bridging, and on-FPGA image preprocessing for line-scan and area-scan cameras. The 1.1 V core plus 744 user I/Os consolidate encoder capture, drive interlock, and vision pre-filter pipelines into a single device, reducing PCB area and BOM cost. Industrial temperature grade and lead-free assembly meet the requirements of factory-floor equipment exposed to wide thermal swings and long mean-time-between-failure targets.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE110F1152I2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE110F1152I3N | EP3SE110F1152I4N | EP3SE110F1152I3G | EP3SE110F1152I2 | EP3SE110F1152C4N | EP3SE110F1152C2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA, 1.00 mm pitch | 1152-BBGA, FCBGA, 1.00 mm pitch - same | 1152-BBGA, FCBGA, 1.00 mm pitch - same | 1152-BBGA, FCBGA, 1.00 mm pitch - same | 1152-BBGA, FCBGA, 1.00 mm pitch - same | 1152-BBGA, FCBGA, 1.00 mm pitch - same | 1152-BBGA, FCBGA, 1.00 mm pitch - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | I2 | I3 | I4 | I3 | I2 | C4 | C2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Yes (N suffix) | Yes (N) | Yes (N) | Yes (G) | No (non-sle N) | Yes (N) | Yes (N) |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Core Voltage | 1.10 V (1.05-1.15 V) | 1.10 V | 1.10 V | 1.10 V | 1.10 V | 1.10 V | 1.10 V |
주요 차별점
- Higher density than Cyclone III control-plane companions (vs EP3C55F484C8N)
- Faster speed grade option within same package (vs EP3SE110F1152C2N)
- Integrated multi-gigabit transceivers and DSP blocks (vs EP3C80F780C8N)
설계 노트
The 1,152-ball FCBGA at 1.00 mm pitch requires a high-layer-count PCB stack-up (typically 8-12 layers) with matched-zimpedance routing for high-speed transceivers. Use laser-drilled microvias or stacked vias to escape the dense BGA grid, and follow Intel Stratix III Enhanced pin connection guidelines for power-pin grouping and decoupling. Plan PCB thermal relief around the center ground/power balls because the device dissipates tens of watts in typical use.
Stratix III Enhanced devices need multiple supplies: VCC (1.10 V core), VCCAUX, VCCPD (I/O pre-drivers), VCCPGM (configuration), and per-bank VCCIO. Sequence these rails per the Intel handbook to avoid long-term reliability stress on the ESD cells. Use the Quartus II PowerPlay early power estimator during RTL development to size regulators and decoupling before tape-out.
Differential pair routing for transceivers and LVDS must hold 100 ohm +/-10% differential with intra-pair skew under 1 ps/mm per cm of length. Keep at least 25 mil ground keep-out from pair edges and avoid 45-degree bends; use smooth curves or matched-length serpentine. Buried 50 ohm single-ended controlled-impedance is also required for DDR3 memory interfaces connected to the FPGA soft memory controller.
The EP3SE110 dissipates significantly more than smaller FPGAs; provide a minimum 1 square inch of unbroken ground pour on every layer directly under the FCBGA and thermal vias under the central ground balls. With adequate airflow the device sustains industrial temperatures; without it, derating or heatsink attachment is required.
Common design mistakes include omitting CONFIG_DATA pull-ups on the MSEL pins, leaving JTAG TCK un-terminated, and using non-Intel configuration devices such as third-party SPI flashes without Quartus II support verification. Always download the latest device handbook errata before locking the pinout and re-validate timing after any IP upgrade in Quartus II.
규정 준수 정보
RoHS-compliant lead-free assembly per 'N' suffix in MPN. AEC-Q100 not applicable - FPGAs are not AEC-Q100 qualified; see Intel/Altera industrial-grade temperature rating for harsh environments.
