EP3SE260H780C4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
부품 번호: EP3SE260H780C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP3SE260H780C4N 개요
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory blocks, DSP slices, PLLs) on a single silicon die. FPGAs sit in the wider taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors, and they enable parallel hardware implementation of algorithms that would otherwise require custom ASICs or multi-chip DSP solutions.
Key features of the EP3SE260H780C4N include 768 18x18 multipliers for DSP, 12 phase-locked loops (PLLs) for clock management, support for external memory interfaces including DDR3, DDR2, and QDRII+ up to 800 MHz, and integrated transceiver capability depending on die variant. The device is hardened for signal integrity with on-chip termination and adaptive equalization, and is rated for industrial-grade operating temperature.
Architecturally, the Stratix III E family uses an adaptive logic module (ALM) fabric that is roughly 25 percent more area-efficient than prior Stratix II Adaptive Look-Up Tables, while the partial reconfiguration and dedicated configuration logic enable secure in-field updates. The 65 nm process and 1.1 V core deliver a favorable performance-per-watt envelope for high-end DSP and packet-processing workloads.
Typical applications include high-performance digital signal processing for radar and software-defined radio, ASIC prototyping and emulation, high-speed packet processing in network infrastructure, video broadcasting and medical imaging pipelines, and high-throughput data-acquisition systems. The combination of logic density and dedicated multiplier resources is well suited to multi-channel DSP and FEC implementations.
Designers should plan for 0.86 V to 1.15 V core supply sequencing and use the Altera/Intel Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure. Thermal management at high toggle rates requires a multi-layer PCB with sufficient ground and power planes; reference the Stratix III handbook for thermal design guidelines.
This page synthesizes distributor stock and pricing, the Stratix III family pin-compatible variants, and practical design notes that complement the manufacturer datasheet and Quartus II device documentation.
드롭인 대체품: EP3SE260H780C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260H780C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE260H780C4LN
✅ 드롭인✓ 재고 있음
$11950 / 개
데이터시트 보기 →EP3SE260H780C4L
✅ 드롭인✓ 재고 있음
$1190 / 개
데이터시트 보기 →EP3SE260H780C4
✅ 드롭인✓ 재고 있음
$3150 / 개
데이터시트 보기 →EP3SE260H780I4N
✅ 드롭인✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP3SE260H780C3N
✅ 드롭인✓ 재고 있음
$1325 / 개
데이터시트 보기 →EP3SE260H780C2N
✅ 드롭인✓ 재고 있음
$3600 / 개
데이터시트 보기 →EP3SE260H780C4N 최대 정격 & 전기적 특성
| Family | Stratix III E (Enhanced) |
| Logic Elements | 255,000 |
| Logic Array Blocks (LABs) | 10,200 |
| Total RAM Bits | 16,672,768 |
| Embedded Memory | M9K and M144K blocks |
| User I/O Pins | 488 |
| DSP Blocks (18x18 Multipliers) | 768 |
| PLLs | 12 |
| Process Node | 65 nm CMOS |
| Core Voltage | 0.86 V to 1.15 V |
| Maximum Core Clock Frequency | 450 MHz |
| 패키지 | 780-ball FCBGA (Flip Chip BGA) |
| 실장 유형 | Surface Mount |
| 습도 민감도 레벨 (MSL) | 3 (168 hours) |
| 동작 온도 | 0C to +85C (commercial) |
| Configuration Method | Serial/Parallel via Quartus II |
EP3SE260H780C4N 780-ball fcbga (flip chip bga) 핀 구성 가이드
EP3SE260H780C4N(780-ball fcbga (flip chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE260H780C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE260H780C4N 적합 용도: 7 애플리케이션s: Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, High-Throughput Packet Processing, Radar Signal Processing, Medical Imaging Pipelines, High-Speed Data Acquisition Systems, Video Broadcasting Infrastructure.
Software-Defined Radio (SDR) Baseband
The EP3SE260H780C4N's 768 18x18 multipliers and 255K logic elements make it well suited for multi-channel SDR baseband processing where hundreds of FIR filters, FFTs, and channelizers run in parallel. The 16.7 Mbit embedded RAM holds bulk coefficient and sample buffers without external memory stalls, while the 12 PLLs derive the multiple baseband and IF clocks needed by an SDR front-end. Placed between a high-speed ADC and a packet processor, the E260 runs channelization, demodulation, and FEC simultaneously at baseband sample rates above 200 MSPS.
추천
ASIC Prototyping and Emulation
The 255K logic elements, 780-ball FCBGA package, and abundant interconnect make the EP3SE260H780C4N a common platform for partitioning and emulating mid-complexity ASICs before tape-out. Designers map RTL via Quartus II, leverage the 488 user I/O pins to break out ASIC boundary signals to logic analyzers, and use the partial-reconfiguration flow to iterate on sub-modules without full re-synthesis. Compared with ASIC, the E260 runs at lower clock but enables software-driven verification at near-real-time speeds, dramatically reducing respin risk.
추천
High-Throughput Packet Processing
Network equipment designers use the EP3SE260H780C4N to implement 10G/40G Ethernet packet classifiers, deep packet inspection engines, and protocol offload engines at line rate. The combination of 768 multipliers, 16.7 Mbit on-chip memory for hash and TCAM emulation, and 12 PLLs supports simultaneous processing of multiple 10G lanes with deterministic latency. Compared with general-purpose CPUs, the E260 delivers an order-of-magnitude higher packets-per-second throughput per watt for fixed-function packet pipelines.
추천
Radar Signal Processing
Phased-array radar systems depend on dense DSP resources to perform pulse compression, Doppler filtering, and CFAR detection across hundreds of channels in real time. The EP3SE260H780C4N's 768 18x18 multipliers and 16.7 Mbit embedded RAM handle multi-channel FFT-based processing at the pulse repetition rate required by modern radar modes. The industrial-grade EP3SE260H780I4N variant extends the same architecture to military/aerospace thermal envelopes.
추천
Medical Imaging Pipelines
CT, MRI, and ultrasound imaging systems use the EP3SE260H780C4N to perform back-projection, beamforming, and real-time image reconstruction on parallel data streams from sensor arrays. The 768 multipliers and abundant embedded RAM accelerate convolution and FFT kernels that dominate reconstruction latency, while the 488 user I/O pins accept raw data from multiple high-speed ADCs. Compared with GPU implementations, the E260 delivers deterministic latency for real-time clinical workflows.
추천
High-Speed Data Acquisition Systems
The EP3SE260H780C4N sits at the heart of multi-channel data-acquisition systems where it buffers ADC samples into on-chip RAM, performs pre-trigger decimation, and forwards reduced-rate data to a host processor or storage array. With 488 user I/O pins, the device can ingest LVDS pairs from many ADCs simultaneously, while the 12 PLLs generate the per-channel sampling clocks. This makes the E260 a strong fit for oscilloscopes, spectrum analyzers, and radar/EW recorders.
추천
Video Broadcasting Infrastructure
Broadcast studios use the EP3SE260H780C4N for multi-channel SD/HD/3G-SDI routing, color-space conversion, and overlay compositing in real time. The 768 multipliers accelerate chroma resampling and deinterlacing kernels, while the 488 I/O pins accept dozens of SDI streams and drive HDMI output bridges. The wide on-chip RAM eliminates the external frame buffer in many light-compositing pipelines, reducing BOM cost and latency.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE260H780C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE260H780C4LN | EP3SE260H780C4L | EP3SE260H780C4 | EP3SE260H780I4N | EP3SE260H780C3N | EP3SE260H780C2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA (H780) | 780-ball FCBGA (H780) - same | 780-ball FCBGA (H780) - same | 780-ball FCBGA (H780) - same | 780-ball FCBGA (H780) - same | 780-ball FCBGA (H780) - same | 780-ball FCBGA (H780) - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Total RAM Bits | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 |
| Speed Grade | C4 | C4 | C4 | C4 | I4 (industrial) | C3 (slower Fmax) | C2 (slowest Fmax) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Lead-Free (Pb-Free) | no | yes | yes | no | no | no | no |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Drop-in lead-free variant available without PCB changes (vs EP3SE260H780C4LN)
- Industrial temperature drop-in variant available (vs EP3SE260H780I4N)
- Lower-speed drop-in grades available for cost-sensitive designs (vs EP3SE260H780C2N)
설계 노트
The Stratix III E260 requires multiple power rails: 0.86 V to 1.15 V core (VCC), 2.5 V PLL analog (VCCA_PLL), and per-bank I/O voltages from 1.2 V to 3.3 V. Power sequencing per the Stratix III handbook is mandatory - core and I/O rails must be monotonic, and VCC must precede VCCA_PLL by at least 1 ms or a POR fault may occur. Use the dedicated Power Management Bus (PMBus) interface on a compatible controller (for example UCD9240 or LTM4675) to implement sequencing, voltage margining, and telemetry.
At high toggle rates (300 MHz+) with high logic utilization, the Stratix III E260 can dissipate 10 W to 15 W, requiring a multi-layer PCB with continuous ground and power planes directly under the FCBGA. The 780-ball FCBGA package has a small thermal resistance but no top-side heat slug, so thermal management is PCB-side only. Reference the Stratix III thermal estimation worksheet in Quartus II to compute junction temperature, and add a heatsink or forced airflow if theta_J-A and ambient cannot keep Tj below 100C in commercial designs.
The 780-ball FCBGA uses 1.0 mm ball pitch - escape routing requires microvia or via-in-pad PCB technology. Reference Intel's Stratix III H780 package PCB layout guidelines for stack-up recommendation (typically 6 to 10 layers, 0.4 mm core thickness, sequential lamination). Match all differential pairs (LVDS, DDR) within the length tolerance specified in the pin-out file to maintain signal integrity at 800 Mbps and above.
Configuration mode pin strapping must be set correctly before power-up: MSEL[3:0] selects between AS (active serial), AP (active parallel), PS (passive serial), and JTAG. A common pitfall is leaving MSEL floating - it must be pulled to VCCIO or GND with 4.7 kohm resistors per the Stratix III handbook. Also verify that the configuration flash is sized correctly - a single compressed bitstream for E260 can exceed 90 Mbit for high-utilization designs.
규정 준수 정보
Standard C4N variant uses tin-lead (SnPb) ball finish. Lead-free variants (C4LN, C4L) are RoHS-compliant. FPGAs are not AEC-Q100 qualified - choose automotive-grade microcontrollers or ASSPs for AEC-Q100 requirements.
