EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
부품 번호: EP3SE260H780I4N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2950 | $2,950.00 |
| 10 | $2750 | $27,500.00 |
| 25 | $2580 | $64,500.00 |
| 100 | $2350 | $235,000.00 |
| 250 | $2150 | $537,500.00 |
EP3SE260H780I4N 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device consisting of an array of programmable logic blocks, embedded memory blocks, DSP blocks, and high-speed transceiver slices, all interconnected by a programmable routing fabric. FPGAs occupy the top of the programmable logic hierarchy (FPGA -> programmable logic -> ASIC-class integration -> semiconductor), bridging the gap between fixed-function ASICs and software-driven processors. The Stratix III family was Intel/Altera's mid-2000s high-performance node, with the Enhanced ('E') sub-family adding more transceivers and DSP bandwidth versus the standard Stratix III.
Key features include 488 user I/O pins, 16,672,768 embedded memory bits, 10,200 LABs (Logic Array Blocks), embedded DSP blocks, and support for high-speed external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. The device supports the JTAG IEEE Std. 1149.1 boundary-scan specification, allowing pin-level interconnect testing without physical probes, and supports in-system programming via the Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) configuration modes.
Typical applications include high-speed digital signal processing, software-defined radio (SDR), video broadcast infrastructure, ASIC prototyping, high-end test and measurement, and military/aerospace signal processing. The combination of high logic density, abundant embedded multipliers, and 488 GPIO pins makes it well suited for parallel multi-channel processing where DSP throughput per dollar per watt is the primary constraint.
When designing with the EP3SE260H780I4N, plan for a multi-rail power solution (typically 1.1 V core, 2.5 V/3.3 V I/O, and 1.2 V PLL analog) and follow Intel's PCB layout guidelines for flip-chip BGA packages, including via-in-pad and microvia stackups to escape the 1.0 mm BGA pitch. Configuration memory requires an external EPCS or EPCQ flash device, and JTAG chain integrity must be verified before live system bring-up.
드롭인 대체품: EP3SE260H780I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260H780I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Mounting Type, Family, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE260H780I4LN
✅ 드롭인✓ 재고 있음
$14860 / 개
데이터시트 보기 →EP3SE260H780I4L
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE260H780I4
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP3SE260H780I3N
✅ 드롭인✓ 재고 있음
$3295 / 개
데이터시트 보기 →EP3SE260H780C4N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE110F780I4N
✅ 드롭인✓ 재고 있음
$1850 / 개
데이터시트 보기 →EP3SE260H780I4N 최대 정격 & 전기적 특성
| Family | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 |
| Embedded Memory Bits | 16,672,768 bits |
| Logic Array Blocks (LABs) | 10,200 |
| User I/Os | 488 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Operating Frequency | 450 MHz |
| 패키지 | 780-pin FC-HFBGA (FCBGA) |
| Package Dimensions | 33 mm x 33 mm |
| 동작 온도 | -40C to +100C (Industrial) |
| Configuration Modes | AS, PS, JTAG, FPP |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP3SE260H780I4N 33 mm x 33 mm 핀 구성 가이드
EP3SE260H780I4N(33 mm x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE260H780I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE260H780I4N 적합 용도: 6 애플리케이션s: High-Speed Digital Signal Processing, Software Defined Radio (SDR), Video Broadcast Infrastructure, ASIC Prototyping, Test and Measurement Instrumentation, Military and Aerospace Signal Processing.
High-Speed Digital Signal Processing
The EP3SE260H780I4N's 255,000 logic elements and embedded DSP blocks make it well suited for high-throughput signal processing pipelines such as radar baseband, software-defined radio (SDR) channelizers, and multi-carrier cellular baseband cards. At 450 MHz fabric Fmax with hundreds of 18x18 multipliers distributed across the fabric, the device sustains tens of GMACs of multiply-accumulate throughput. The 488 user I/Os support parallel LVDS data paths to high-speed ADCs and DACs, while the dedicated memory PHY blocks handle DDR3/QDRII+ buffers that keep the DSP pipelines fed with samples. Power dissipation at full DSP utilization typically ranges 8-15 W depending on toggle rate.
추천
Software Defined Radio (SDR)
Software-defined radio platforms require FPGAs with abundant DSP resources, high-speed serial transceivers, and flexible memory interfaces - all of which the EP3SE260H780I4N provides. The Stratix III E family integrates multi-gigabit transceivers supporting CPRI, OBSAI, and custom serial protocols, while the 16,672,768 embedded memory bits serve as fast sample buffers and FFT twiddle factor storage. The 488 user I/Os interface to RF front-end ADCs/DACs at LVDS rates up to 840 Mbps per pair, and the JTAG 1149.1 boundary-scan capability simplifies board bring-up of complex SDR mezzanine cards.
추천
Video Broadcast Infrastructure
Broadcast video routers, multi-format converters, and 4K/UHD processing engines benefit from the EP3SE260H780I4N's logic density and high I/O count. The device can multiplex hundreds of SDI/HD-SDI/3G-SDI streams, perform real-time scaling and deinterlacing, and bridge between HDMI 2.0, DisplayPort 1.4, and 12G-SDI domains. The 10,200 LABs absorb multi-format color-space conversion pipelines, while the high transceivers support SMPTE 2022 IP video transport. Industrial temperature grade and lead-free assembly support professional broadcast equipment reliability requirements.
추천
ASIC Prototyping
ASIC and ASSP prototyping demands the highest logic density available in a programmable fabric, which the EP3SE260H780I4N supplies at 255,000 logic elements. The Stratix III E architecture supports multi-FPGA partitioning via the LVDS-based Atom Wrapper methodology, allowing two or more devices to emulate larger ASICs. The 780-pin FC-HFBGA exposes 488 user I/Os plus dozens of high-speed serial lanes for chip-to-chip emulation interconnect, while the Quartus II design flow supports Verilog/VHDL synthesis of unmodified ASIC RTL. Industrial temperature operation supports realistic system-level characterization of pre-silicon ASICs.
추천
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, protocol analyzers, and arbitrary waveform generators rely on FPGAs like the EP3SE260H780I4N for real-time acquisition, triggering, and DSP. The device's 488 user I/Os interface to multiple high-speed ADC channels, while its 10,200 LABs implement complex trigger engines and protocol decoders. Embedded memory holds deep acquisition records, and the JTAG IEEE 1149.1 boundary-scan chain supports manufacturing test of completed instruments. Industrial temperature grade ensures 24/7 reliability in production-line ATE applications.
추천
Military and Aerospace Signal Processing
Ruggedized signal processing systems in defense and aerospace leverage the EP3SE260H780I4N's industrial temperature grade, abundant DSP resources, and high I/O bandwidth. Applications include electronic countermeasures (ECM), synthetic aperture radar (SAR), signals intelligence (SIGINT) collectors, and avionics data buses. The 780-pin FC-HFBGA package offers superior thermal and mechanical performance versus wire-bond BGAs, and the lead-free finish meets modern defense environmental specifications. The JTAG boundary-scan chain supports MIL-STD-883 test methodologies during board-level acceptance.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE260H780I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE260H780I4LN | EP3SE260H780I4L | EP3SE260H780I4 | EP3SE260H780I3N | EP3SE260H780C4N | EP3SE110F780I4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-HFBGA (FCBGA) | 780-pin FC-HFBGA (FCBGA) - same | 780-pin FC-HFBGA (FCBGA) - same | 780-pin FC-HFBGA (FCBGA) - same | 780-pin FC-HFBGA (FCBGA) - same | 780-pin FC-HFBGA (FCBGA) - same | 780-pin FC-HFBGA (FCBGA) - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 106,500 |
| Embedded Memory Bits | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 8,892,032 |
| Speed Grade | I4 (fastest industrial) | I4 (same) | I4 (same) | I4 (same) | I3 (-10% Fmax typical) | C4 (commercial temp) | I4 (same) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status (2026-09) | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Highest-density Stratix III E in production 780-pin FC-HFBGA (vs EP3SE110F780I4N)
- Industrial temperature grade with full speed grade I4 (vs EP3SE260H780C4N)
- Highest speed grade (I4) in industrial temperature (vs EP3SE260H780I3N)
설계 노트
Estimated: The EP3SE260H780I4N at typical DSP utilization (60-70% LE, mid toggle rate) consumes approximately 8-12 W. The 1.1 V core rail must be sourced from a high-efficiency buck converter capable of delivering at least 15 A continuous with tight output tolerance; the 2.5 V/3.3 V I/O rails typically draw 1-3 A total. Use Intel's PowerPlay early power estimator (EPE) spreadsheet during architecture phase to size the power tree accurately - assuming typical values will cause thermal issues during bring-up.
The 780-pin FC-HFBGA uses a 1.0 mm ball pitch with flip-chip die attach, requiring microvia (laser-drilled) PCB stackups with via-in-pad construction. Standard 4-layer FR-4 will not yield adequate signal integrity at LVDS speeds - plan for at least 8 layers with 2 signal layers between each ground/power plane pair. Exposed die bumps under the package require a center BGA thermal pad with 9-12 thermal vias tied to an internal ground plane for heat extraction.
Do not confuse the FC-HFBGA (flip-chip) package variant with the standard HFBGA (wire-bond) variant - they have different thermal profiles and different PCB land pad recommendations. The 'H' in the part number denotes the FC-HFBGA package. Also note that the I4 speed grade is the fastest industrial grade; if design timing does not close, an I3 part is pin-compatible and stock is sometimes available when I4 is constrained.
All configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK) require 4.7 kohm pull-up resistors to VCCIO of the configuration bank. The MSEL[2:0] pins must be hardwired to select the desired configuration mode (AS, PS, JTAG, or FPP). JTAG chain integrity should be verified by running the Boundary-Scan Description Language (BSDL) test vector on a bare PCB before the FPGA is configured - this catches solder shorts and opens in minutes rather than during functional bring-up.
규정 준수 정보
RoHS and lead-free compliance confirmed by Intel/Altera product documentation. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC. Halogen-free status not separately documented; consult the Intel PCN archive for IEC 61249-2-21 declaration if required.
