EP3SE50F780C3G - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
부품 번호: EP3SE50F780C3G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1289.07 | $1,289.07 |
| 10 | $1225 | $12,250.00 |
| 50 | $1160 | $58,000.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $1030 | $515,000.00 |
EP3SE50F780C3G 개요
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike a fixed-function ASIC, an FPGA's logic, memory, and I/O behavior are defined after manufacturing using a hardware description language (HDL) such as VHDL or Verilog. In the system hierarchy, an FPGA sits between general-purpose microcontrollers and custom ASICs: microcontrollers run software sequentially, ASICs are hardwired and inflexible, while FPGAs deliver hardware-level parallelism with design-time re-programmability.
Key features of the EP3SE50F780C3G include 19,000 ALMs (≈47,500 LEs), 5.49 Mbit embedded RAM (5,760 Kbit), embedded DSP blocks for high-throughput arithmetic, programmable I/O supporting multiple single-ended and differential I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and a hard memory controller plus PCML/SE SerDes capability that is characteristic of the Stratix III E transceiver-rich variant.
The Stratix III E family is built on TSMC's 40 nm process with a 1.1 V core supply, delivering an optimum balance of performance, density, and power efficiency versus the original Stratix III baseline. The 780-FBGA package uses a flip-chip land-grid-array construction with an exposed heat slug, providing low thermal resistance for high-utilization designs. Engineering trade-offs include routing congestion on dense designs and the requirement for Quartus II / Quartus Prime software and a configuration memory device (typically EPCS or separate flash) to load the bitstream at power-up.
Typical applications include high-speed digital signal processing, ASIC prototyping, wireline telecom line cards, military/aerospace signal processing, video broadcast infrastructure, and PCI Express endpoint designs using the embedded transceivers. Compared with newer Stratix V / Stratix 10 families, the Stratix III E is preferred when long-term availability, lower unit cost, or design reuse of existing Quartus II IP matters more than peak performance.
When designing with this device, plan for the configuration scheme (Passive Serial, Fast Passive Parallel, Active Serial, or JTAG) and ensure PCB layout uses a minimum 12-layer stack-up with continuous GND/power planes beneath the BGA to control simultaneous-switching-noise on the 488 I/O. Verify thermal headroom using the FPGA power estimator early; the exposed heat slug must be soldered to a thermal via array.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes drawn from the Stratix III handbook, providing information gain beyond what the manufacturer datasheet alone offers.
드롭인 대체품: EP3SE50F780C3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE50F780C3G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, Speed Grade, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE110F780C3G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SE50F780C4G
✅ 드롭인✓ 재고 있음
$593 / 개
데이터시트 보기 →EP3SE50F780C3
✅ 드롭인✓ 재고 있음
$890 / 개
데이터시트 보기 →EP3SE110F780C3
✅ 드롭인✓ 재고 있음
$220 / 개
데이터시트 보기 →EP3SE260H780C3
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP3SE50F780C3G 최대 정격 & 전기적 특성
| Series | Stratix III E |
| Manufacturer | Altera (now Intel) |
| Family | Stratix III E enhanced FPGA |
| Number of Logic Elements (LE) | 47,500 LE |
| Number of Adaptive Logic Modules (ALM) | 19,000 ALM |
| Embedded Memory | 5.49 Mbit (5,760,000 bit) |
| Number of User I/O | 488 |
| Core Supply Voltage | 1.1 V |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C3 |
| 패키지 / 케이스 | 780-BBGA, FCBGA (Flip-Chip) |
| 장착 스타일 | SMD/SMT |
| Packaging | Tray |
| RoHS 상태 | Compliant |
| 수명 주기 상태 | Not Recommended for New Designs (NRND) |
| Configuration Memory | External (EPCS / flash) |
EP3SE50F780C3G 780-bbga, fcbga (flip-chip) 핀 구성 가이드
EP3SE50F780C3G(780-bbga, fcbga (flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE50F780C3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE50F780C3G 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Speed Digital Signal Processing, Telecom Line Card Processing, Video Broadcast and Image Processing, Military and Aerospace Signal Processing, PCI Express Endpoint and Storage Controllers.
ASIC Prototyping and Emulation
The EP3SE50F780C3G fits ASIC prototyping because its 47,500 logic elements, 5.49 Mbit embedded memory, and 488 user I/O deliver enough capacity to partition and emulate medium-complexity ASIC RTL with Quartus II IP cores. Designers map ASIC blocks into ALMs and DSP tiles to validate gate-level behavior before committing to silicon, reducing respin risk. Compared with a Cypress/Cyclone-class FPGA, the EP3SE50's higher logic count and richer DSP/memory ratio enable multi-million-gate ASICs to be partitioned into a single device.
추천
High-Speed Digital Signal Processing
The EP3SE50F780C3G's embedded DSP blocks deliver high-throughput arithmetic for FFTs, FIR/IIR filters, and baseband processing at line rates up to several hundred MHz. Its 488 I/O support LVDS and HSTL/SSTL differential standards, enabling direct interfacing to high-speed ADC/DAC converters. The 5.49 Mbit embedded RAM buffers sample streams without external memory access, reducing latency. Engineers in software-defined radio and radar signal processing pick this part for the Stratix III E family's proven DSP IP and timing closure at commercial temperatures.
추천
Telecom Line Card Processing
Wireline telecom line cards use the EP3SE50F780C3G to implement channelized framer, mapper, and forward-error-correction functions. The 488 I/O mapped into multiple I/O banks support backplane connectivity via LVDS, and the embedded memory simplifies pointer/state storage for HDLC/PPP framing. Designers rely on its 1.1 V low-power core and proven Altera IP for CPRI/OBSAI bridges. The 0C to +85C commercial grade suits controlled-environment central office deployments where industrial temp is not required.
추천
Video Broadcast and Image Processing
The EP3SE50F780C3G handles SD/HD/3G-SDI bridging, color-space conversion, and real-time video scaling for broadcast infrastructure. Its 488 I/O can simultaneously ingest multiple SDI streams while driving DDR2/DDR3 memory controllers for frame buffering. The Stratix III E memory controller hard IP supports high-bandwidth frame-store access with deterministic latency, critical for broadcast timing. Compared with newer Stratix V devices, the EP3SE50 provides adequate logic, memory, and transceivers at a lower cost for cost-sensitive broadcast appliances.
추천
Military and Aerospace Signal Processing
Although the EP3SE50F780C3G itself is commercial grade (0C to +85C), programs reuse the design with the industrial or military-grade Stratix III E variants on the same 780-FBGA footprint. The device's high logic density, embedded DSP, and secure configuration options (encrypted bitstream via the Stratix III security feature) suit radar, electronic warfare, and avionics subsystems. Designers use it for early engineering development before locking the design onto a screened military temperature part.
추천
PCI Express Endpoint and Storage Controllers
The EP3SE50F780C3G implements PCI Express Gen1/Gen2 endpoint controllers using the hard PCIe IP block, making it suitable for storage controllers, host bus adapters, and instrument cards. Its 488 I/O accommodate multiple PCIe lanes plus SATA/SAS links, and the embedded memory services DMA descriptor rings. Compared with a Cyclone V SoC, the EP3SE50 provides higher logic density for protocol bridges (e.g., PCIe-to-10GbE), which is why telecom OEMs historically standardized on it.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE50F780C3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE110F780C3G | EP3SE50F780C4G | EP3SE50F780C3 | EP3SE110F780C3 | EP3SE260H780C3 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FBGA (FCBGA) | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same |
| Logic Elements | 47,500 LE | 110,000 LE (+131%) | 47,500 LE (same) | 47,500 LE (same) | 110,000 LE (+131%) | 260,000 LE (+447%) |
| Embedded Memory | 5.49 Mbit | 8.29 Mbit | 5.49 Mbit (same) | 5.49 Mbit (same) | 8.29 Mbit | 16.27 Mbit |
| User I/O Count | 488 | 488 (same) | 488 (same) | 488 (same) | 488 (same) | 488 (same) |
| Speed Grade | C3 | C3 (same) | C4 (faster Fmax) | C3 (same) | C3 (same) | C3 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Core Voltage | 1.1 V | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) | 1.1 V (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Mid-density sweet spot of the Stratix III E family (vs EP3SE260H780C3)
- Same package footprint as larger Stratix III E siblings (vs EP3SE110F780C3G)
- Established Stratix III E IP ecosystem (vs Cyclone V E (EP5CEBA7F31C8N))
설계 노트
The 780-FBGA FCBGA package has an exposed heat slug that must be soldered to a thermal via array on the PCB (typically 6x6 to 10x10 via grid, 0.3 mm drill, 1.0 mm pitch). Stratix III E designs with high utilization (>70% ALM, >50% DSP) typically dissipate 5-10 W; the heat slug solder joint reduces theta_JC substantially and is mandatory for reliable operation. Without proper thermal via attachment, junction temperature can exceed the 95C commercial-grade limit under continuous workloads.
Design a minimum 12-layer PCB stack-up for the 780-FBGA with continuous GND and PWR planes directly beneath the BGA to control simultaneous-switching-noise on the 488 I/O. Use 0.4 mm pitch microvia-in-pad construction with stacked vias for breakout, transitioning to through-vias beyond the BGA perimeter. Per JEDEC JESD51-9, characteristic impedance of 50 ohm single-ended and 100 ohm differential traces must be verified on all high-speed LVDS/HSTL pairs. Maintain reference-plane continuity under every high-speed trace to avoid return-path discontinuities.
Stratix III E power sequencing requires VCC (1.1 V core) to ramp before VCCPD and VCCIO banks, with monotonic ramp-up per the Stratix III handbook. Use a dedicated power sequencer or the Altera-recommended controller IC; failure to sequence correctly can latch-up or cause long-term reliability degradation. Provide local 0.1 uF + 10 uF decoupling on every VCCIO bank and additional bulk capacitance near the device to handle transient current demands during configuration.
Do not assume any FPGA configuration is automatic at power-up: the EP3SE50F780C3G requires an external configuration memory (EPCS16/EPCS64 for Active Serial) or a controller driving Passive Serial. Forgetting to populate MSEL pins correctly for the chosen configuration mode is a common prototype error. Also, design tools must be Altera/Intel Quartus II (legacy) or Quartus Prime with Stratix III device support; using Quartus without Stratix III support will fail synthesis.
규정 준수 정보
RoHS compliant per Altera/Intel product environmental disclosure. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC). Halogen-free status not explicitly stated in verified data; refer to official Intel PSG material declaration.
