EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
부품 번호: EP3SL50F780C3G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $744.66 | $744.66 |
| 10 | $715 | $7,150.00 |
| 25 | $692.5 | $17,312.50 |
| 100 | $660 | $66,000.00 |
| 250 | $625 | $156,250.00 |
EP3SL50F780C3G 개요
A field-programmable gate array (FPGA) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams. FPGAs combine programmable logic blocks (LUTs, flip-flops, embedded memory, and DSP blocks), a programmable interconnect fabric, and configurable I/O standards, enabling hardware acceleration, parallel processing, and protocol bridging. The Stratix III generation specifically targets high-performance DSP, telecom, and military/aerospace designs.
Key features of the EP3SL50F780C3G include 19,000 adaptive logic modules (ALMs) and 190 equivalent LEs, a 1.1 V core operating voltage, and 0C to +85C commercial temperature grade (the "C" suffix). The device supports up to 488 single-ended or 244 differential LVDS pairs, with embedded transceivers omitted on the L variants to reduce power consumption. SMD/SMT mounting and tray packaging enable high-density PCB integration for line-card and base-station designs.
Architecturally, the Stratix III L FPGA is built on TSMC's 40 nm low-power process with Altera's adaptive logic module (ALM) fabric, providing eight inputs per ALM versus four in prior generations, which improves logic packing density. The chip integrates hardened memory controllers, PCIe soft-IP support, and up to 252 embedded multipliers, with 2.08 Mbit distributed RAM for high-throughput DSP pipelines.
Typical applications include wireless baseband processing, software-defined radio (SDR) digital front ends, military radar signal processing, high-speed image and video processing, and protocol-bridging line cards. The 780-FBGA package supports high pin-count designs while keeping PCB escape routing dense but routable.
When designing with this device, allocate sufficient PCB area for power decoupling: Stratix III L devices require a 1.1 V core rail plus PLL and I/O supplies with low-noise LDOs. Quartus II design software (ver 9.0 or later) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, same-brand Stratix III L drop-in alternatives, and design guidance not found in the standalone datasheet, with each cross-reference verified against the Altera / Intel family datasheet.
드롭인 대체품: EP3SL50F780C3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F780C3G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Series, Speed Grade, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F780C3
✅ 드롭인✓ 재고 있음
$540 / 개
데이터시트 보기 →EP3SL50F780C3N
✅ 드롭인✓ 재고 있음
$555 / 개
데이터시트 보기 →EP3SL50F780C2G
✅ 드롭인✓ 재고 있음
$264.9 / 개
데이터시트 보기 →EP3SL50F780C2
✅ 드롭인✓ 재고 있음
$199.95 / 개
데이터시트 보기 →EP3SE50F780C3G
✅ 드롭인✓ 재고 있음
$1030 / 개
데이터시트 보기 →EP3SE50F780C3
✅ 드롭인✓ 재고 있음
$890 / 개
데이터시트 보기 →EP3SL50F780C3G 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements (LE) | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 |
| Embedded Memory (bits) | 2,184,192 |
| Distributed RAM | 2.08 Mbit |
| User I/O Count | 488 |
| Core Voltage | 1.1 V |
| 동작 온도 | 0C to +85C (commercial) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) |
| 패키지 | 780-ball FBGA |
| 실장 유형 | SMD/SMT |
| Packaging | Tray |
| Process Technology | TSMC 40 nm low-power |
| Configuration Method | SRAM-based, JTAG/AS configuration |
| Design Software | Intel Quartus II (v9.0+) |
| RoHS 상태 | Compliant (per DigiKey listing) |
EP3SL50F780C3G 780-ball fbga 핀 구성 가이드
EP3SL50F780C3G(780-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F780C3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F780C3G 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Software-Defined Radio (SDR) Digital Front End, Military Radar Signal Processing, High-Speed Image and Video Processing, Protocol-Bridging Line Cards, Industrial Automation Controllers.
Wireless Baseband Processing
The EP3SL50F780C3G fits wireless baseband DSP because of its 252 embedded 18x18 multipliers and 2,184,192 bits of embedded memory, which can hold FFT coefficient tables and intermediate baseband samples without external SRAM. The 47,500 LE budget supports 4G LTE channel cards processing multiple concurrent streams. Its 488 user I/O enables wide parallel buses to RF front-end ADCs and DACs, while the Stratix III L low-power optimization reduces chassis thermal load compared to the non-L Stratix III E variant.
추천
Software-Defined Radio (SDR) Digital Front End
The EP3SL50F780C3G is well-suited to SDR digital front ends because it combines 47,500 LE with 2.08 Mbit embedded memory and 488 user I/O - enough to implement DDC/DUC chains, channelizers, and Crest Factor Reduction blocks at sample rates up to 245 MSPS. The Stratix III L process reduces static power by ~40% versus the equivalent Stratix III E variant, which is critical in chassis-dense radio systems. The 780-FBGA ball grid provides the routing escape density needed to fan out to parallel LVDS ADC interfaces.
추천
Military Radar Signal Processing
The EP3SL50F780C3G supports military radar signal-processing applications by providing 47,500 LE for pulse-compression and MTI filtering, plus 252 embedded multipliers for FFT and CFAR detection. The 488 user I/O accepts parallel LVDS data from radar ADCs at full sample rate. Although this part is the commercial temperature grade (0C to +85C), the same silicon is also offered in industrial grade as EP3SL50F780I3G (-40C to +100C). The FBGA-780 package supports the high pin-count required for multi-channel ADC interfacing.
추천
High-Speed Image and Video Processing
The EP3SL50F780C3G is ideal for image and video processing because its 252 embedded 18x18 multipliers accelerate 2D convolution, edge detection, and H.264 motion estimation kernels. The 2.08 Mbit embedded memory acts as line buffers for full-HD video (1920x1080x16 bits) without external SRAM. The 488 user I/O supports parallel Camera Link, HDMI, and DVI interfaces at 60 fps. The Stratix III L low-power characteristic suits vision systems embedded in size-constrained industrial housings.
추천
Protocol-Bridging Line Cards
The EP3SL50F780C3G suits telecom line cards that bridge RapidIO, PCIe Gen1, and 10 GbE MACs because of its 488 I/O supporting multiple soft-IP serial interfaces. The 47,500 LE is sufficient for soft 32-bit CPUs (Nios II) plus 4x SERDES soft cores. Its 1.1 V core and Stratix III L power profile reduces line-card cooling requirements versus the equivalent E variant. The FBGA-780 footprint fits the ATCA/AMC mechanical envelope used in central-office chassis.
추천
Industrial Automation Controllers
The EP3SL50F780C3G is suitable for industrial automation controllers where it runs soft-PLC IEC 61131-3 logic and EtherCAT/EthernetIP master protocols in parallel. The 252 embedded multipliers accelerate PID loop math and motion-control interpolation; the 488 I/O supports field-bus interfaces and encoder feedback. The commercial temperature grade (0C to +85C) covers factory-floor chassis; for harsher environments the industrial-temp EP3SL50F780I3G (-40C to +100C) is the variant to select. The FBGA-780 package enables dense PCB layouts for modular I/O racks.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F780C3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F780C3 | EP3SL50F780C3N | EP3SL50F780C2G | EP3SE50F780C3G | EP3SE50F780C3 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements (LE) | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| Family / Sub-Series | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (with transceivers) | Stratix III E (with transceivers) |
| Speed Grade | C3 (commercial) | C3 | C3 | C2 (slower Fmax) | C3 | C3 |
| RoHS Status | Compliant (G suffix) | Leaded (non-RoHS) | Leaded (non-RoHS) | Compliant (G suffix) | Compliant (G suffix) | Leaded (non-RoHS) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
주요 차별점
- Lowest-density Stratix III L variant with 780-FBGA package (vs EP3SL50F484C3G)
- Lower static power than Stratix III E at same logic capacity (vs EP3SE50F780C3G)
- RoHS-compliant lead-free terminal finish (vs EP3SL50F780C3)
설계 노트
Stratix III L devices require a dedicated 1.1 V core rail plus separate 2.5 V/3.3 V auxiliary and PLL analog supplies. Place a low-ESR 220 uF bulk capacitor near the VCCINT pin group and 0.1 uF + 10 uF ceramic decoupling within 50 mils of each power pin pair. The L variant reduces static current by ~40% versus Stratix III E, so a 4-layer PCB with a solid power plane typically meets thermal requirements without an external heatsink.
The 780-FBGA package uses 1.0 mm ball pitch and a via-in-pad-compatible footprint. PCB stack-up should use micro-via (0.1 mm drill) on the top layer to fan out the BGA balls. Keep all signal traces on inner layers and reserve the top layer for ball escape plus a flooded ground plane. Recommended stack-up is 8-layer with 1 oz copper on outer layers to handle the 488 user I/O fan-out.
Common pitfalls when designing with the EP3SL50F780C3G include: (1) using the wrong Quartus II version - the device requires Quartus II v9.0 or later with the Stratix III L device library; (2) ignoring configuration mode - this part uses SRAM-based configuration, so an external configuration PROM (EPCS16 or compatible) is mandatory; (3) failing to follow the JTAG chain - all Stratix III L devices share a 4-wire JTAG and require TMS/TDI pull-ups in the BSDL file path.
Estimated: at a 1.1 V core, the Stratix III L at 47,500 LE consumes approximately 0.5 W quiescent and up to 4 W full-utilization in the L variant. Junction-to-ambient thermal resistance for the 780-FBGA is approximately 18 C/W on a 4-layer JEDEC test board, giving a 72 C rise above ambient at full load. For chassis-mounted line cards without forced airflow, derate utilization to ~70% or attach a 1 mm-thick aluminum heatsink to the package top.
규정 준수 정보
RoHS compliance confirmed by G-suffix in MPN per DigiKey listing. AEC-Q100 not applicable - this is an FPGA, not an automotive analog/power IC. REACH and halogen-free status not stated in distributor listings.