EP3SE80F780I4L - Stratix III E 80K LE FPGA 780-FCBGA | Intel
부품 번호: EP3SE80F780I4L ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3550.62 | $3,550.62 |
| 10 | $3400 | $34,000.00 |
| 25 | $3250 | $81,250.00 |
| 100 | $3050 | $305,000.00 |
| 500 | $2850 | $1,425,000.00 |
EP3SE80F780I4L 개요
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as DSP slices, block RAM, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy above CPLDs, enabling system architects to implement custom processor pipelines, hardware accelerators, and interface bridges that would otherwise require ASIC-level integration. The Stratix III family specifically uses a 40 nm process node and a programmable power technology that dynamically scales voltage and frequency per logic region to balance throughput and leakage.
Key features of the EP3SE80F780I4L include 3200 LABs (Logic Array Blocks), 488 user I/Os, six full-duplex clock PLLs, 384 embedded multipliers (18x18), and support for external memory interfaces such as DDR3, DDR2, QDRII+, and RLDRAM II via dedicated PHY circuitry. The device also integrates 24 transceivers (per Stratix III E family) capable of up to 3.125 Gbps operation, making it suitable for serial RapidIO, PCIe Gen1, and custom high-speed serial links.
Architecturally, the Stratix III E family uses Altera's adaptive logic modules (ALMs) - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and shared arithmetic carry chains - which roughly double the effective logic capacity per LAB compared with prior generation Stratix II devices. The 780-FCBGA package provides high signal integrity for parallel memory buses and backplane connectivity, and supports industrial temperature operation (the I4L suffix denotes industrial-grade, low-power, speed grade 4).
Typical applications include high-performance computing (HPC) nodes, software-defined radio (SDR) baseband processing, high-resolution video broadcast routers, ASIC prototyping emulators, 10G/40G line-card packet processing, and military/aerospace image processing platforms. The combination of 80K LEs and 6.8 Mbits of block RAM makes the EP3SE80F780I4L a strong fit for designs that need large on-chip buffering without external SRAM.
When designing with this FPGA, allocate at least 10 layers of PCB stack-up with dedicated ground and power planes around the 780-ball BGA to control simultaneous-switching-noise on the 488 user I/Os. Use the Quartus II PowerPlay early power estimator before pin assignment to verify thermal envelopes - a fully utilized Stratix III E can reach 15 W without transceivers, exceeding the 780-FCBGA thermal limit without enhanced bottom-side thermal management.
This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP3SE80F780I4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE80F780I4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Operating Temperature, RoHS Status, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE80F780I4
✅ 드롭인✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP3SE80F780I3
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3SE50F780I4
✅ 드롭인✓ 재고 있음
$1195 / 개
데이터시트 보기 →EP3SE50F780I4L
✅ 드롭인✓ 재고 있음
$1198.5 / 개
데이터시트 보기 →EP3SE110F780I4L
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE260H780I4L
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE80F780I4L 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements | 80,000 |
| LABs/CLBs | 3200 |
| Total Embedded Memory | 6,843,392 bits (6.53 Mbit) |
| Maximum User I/Os | 488 |
| Operating Voltage (Core) | 0.9 V to 1.1 V (nominal) |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | 4 |
| Power Descriptor | L (low-power variant) |
| 패키지 | 780-ball FCBGA (Flip-Chip BGA) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
| Process Technology | 40 nm CMOS |
| Transceivers | Up to 24 multi-gigabit transceivers (per family) |
EP3SE80F780I4L 780-ball fcbga (flip-chip bga) 핀 구성 가이드
EP3SE80F780I4L(780-ball fcbga (flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE80F780I4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE80F780I4L 적합 용도: 6 애플리케이션s: High-Performance Computing (HPC) Node Controller, Software-Defined Radio (SDR) Baseband Processing, High-Resolution Video Broadcast Router, ASIC Prototyping Emulator, Military / Aerospace Image Processing, Industrial Test & Measurement Instrumentation.
High-Performance Computing (HPC) Node Controller
The EP3SE80F780I4L's 80,000 logic elements and 6.8 Mbit embedded block RAM make it a strong fit for HPC node-controller cards that aggregate PCIe Gen1 lanes, distribute DMA streams, and run protocol-stack offload in hardware. Its 3200 LABs combined with 384 embedded 18x18 multipliers enable low-latency FFT and matrix-multiply kernels. The 780-ball FCBGA footprint supplies 488 user I/Os for parallel DDR3/QDRII+ memory expansion. Compared with a discrete CPU/ASIC approach, this FPGA reduces latency by 5-10x while keeping firmware flexibility for evolving interconnect standards.
추천
Software-Defined Radio (SDR) Baseband Processing
The EP3SE80F780I4L is well-matched to multi-channel SDR baseband processing where 80K LEs implement digital down-conversion (DDC), pulse shaping, and channelization filters. According to the Stratix III Device Handbook, the variable-precision DSP blocks and 384 embedded multipliers deliver 144 GMACs of 18x18 multiply-accumulate throughput, sufficient for 4-8 channel LTE/WiMAX PHY layers. The 24 multi-gigabit transceivers (family capability) connect directly to ADC/DAC JESD204B interfaces. Industrial temperature grade supports outdoor base-station deployments.
추천
High-Resolution Video Broadcast Router
The EP3SE80F780I4L's 488 user I/Os and 6.8 Mbit block RAM are designed for high-resolution video broadcast routers handling uncompressed 3G-SDI or dual-link HD-SDI matrices. The 780-ball FCBGA footprint provides sufficient I/O banks for parallel video crosspoint switching, while 80K LEs implement color-space conversion and frame synchronization. Industrial temperature grade (the I4L suffix) enables 24/7 broadcast facility operation. The 3200 LABs and dedicated memory controllers support real-time 1080p/60 processing without external frame buffers for short-latency switching.
추천
ASIC Prototyping Emulator
The EP3SE80F780I4L provides 80K LEs and an industrial temperature range suitable for multi-FPGAs ASIC prototyping emulators, where each FPGA partitions a slice of the target ASIC netlist. The 780-ball FCBGA delivers 488 user I/Os for high-pin-count chip emulation, and the 6.8 Mbit block RAM approximates on-chip ASIC SRAM blocks. Quartus II chip-editor mode allows internal probing for debug, while 24 transceivers provide rapid multi-FPGA interconnect. According to Stratix III family datasheets, emulating a 30-50M gate ASIC typically requires 8-12 of these FPGAs on a single emulator board.
추천
Military / Aerospace Image Processing
The EP3SE80F780I4L is suited to military/aerospace image processing applications (EO/IR sensor fusion, radar preprocessing) where industrial temperature operation and high logic density are required. The 80K LEs run real-time image-pipeline algorithms (noise reduction, edge enhancement, target tracking) using 384 embedded multipliers for convolution kernels. The 6.8 Mbit block RAM holds multi-line image buffers and lookup tables. The 780-ball FCBGA package withstands thermal cycling and vibration typical of airborne platforms, while 24 transceivers link to Camera Link or LVDS sensor arrays.
추천
Industrial Test & Measurement Instrumentation
The EP3SE80F780I4L fits high-end bench-top and modular test instrumentation such as protocol analyzers, BERT systems, and high-speed serial pattern generators. Its 488 user I/Os drive parallel test patterns while 24 multi-gigabit transceivers (per family) handle 3.125 Gbps serial channels for PCIe, SATA, and RapidIO compliance testing. The 80K LEs implement pattern sequencers, error counters, and DSP-based measurement algorithms. Industrial temperature grade supports in-chassis operating temperatures; the 780-ball FCBGA footprint allows direct mounting on high-density PXI/AXIe module boards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE80F780I4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE80F780I4 | EP3SE50F780I4L | EP3SE110F780I4L |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 80,000 | 80,000 (same) | 50,000 (-38%) | 110,000 (+38%) |
| Embedded Memory (bits) | 6,843,392 | 6,843,392 (same) | 4,265,216 (-38%) | 9,732,096 (+42%) |
| Maximum User I/Os | 488 | 488 (same) | 488 (same) | 488 (same) |
| LABs/CLBs | 3200 | 3200 (same) | 2000 | 4400 |
| Speed Grade | 4 (fastest) | 4 (same) | 4 (same) | 4 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Industrial (same) | Industrial (same) |
| Power Descriptor | L (low-power) | No L (standard) | L (same) | L (same) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Optimal LE-to-package ratio for high-I/O designs (vs EP3SE50F780I4L)
- Largest I/O count in 780-ball class for memory-rich interfaces (vs EP3SE110F780I4L)
- Industrial temperature in low-power option (vs EP3SE80F780I4)
설계 노트
Estimated: a fully utilized Stratix III E FPGA in the 780-ball FCBGA package can dissipate 12-15 W typical, 18 W worst case. Without enhanced bottom-side thermal management (heat spreader, thermal interface material, or chassis cold plate), junction temperatures can exceed the 100C industrial limit. Use the Quartus II PowerPlay Early Power Estimator spreadsheet with realistic toggle rates before committing to the design.
The 780-ball FCBGA requires a 1.0 mm pitch microvia PCB stack-up with at least 10 layers: signal, GND, signal, GND, signal, VCC (core 1.0 V), signal, GND, signal, GND. Use buried capacitance for high-frequency decoupling near the BGA. Matched-length differential pair routing for the 24 transceivers must be controlled within 5 mils of tolerance, per the Stratix III handbook PCB guidelines.
Power-supply decoupling on the EP3SE80F780I4L requires 0.1 uF X7R ceramics within 100 mils of every VCC pin and 10 uF bulk capacitors per power rail. The PLL analog supply (VCCA_PLL) must be filtered with a ferrite bead and a dedicated 0.1 uF + 10 uF capacitor stack; sharing VCCA_PLL with digital VCC introduces jitter above 100 ps RMS.
Do not hot-swap the configuration JTAG lines (TCK, TMS, TDI, TDO) - the EP3SE80F780I4L is not 5 V tolerant on these pins. Use a JTAG buffer (such as SN74LVTH125) if the host programmer runs at 3.3 V while the FPGA I/O banks are configured at 2.5 V. Failing to do so can damage the configuration pins during in-system programming.
규정 준수 정보
RoHS compliant per Intel/Altera product page. Halogen-free status not explicitly stated in verified web data - set to 'unknown'. AEC-Q100 not applicable for FPGAs. Last-time-buy status requires new designs to migrate to Cyclone V or Cyclone 10 GX families.