EP3SE80F780I3 - 80K Logic Elements FPGA | Altera | Digital Systems
부품 번호: EP3SE80F780I3 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SE80F780I3 개요
A field-programmable gate array is a programmable semiconductor containing configurable logic, memory resources, interconnect, and input/output blocks. FPGA devices sit within the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing designers to implement changing digital functions, interfaces, and data-processing pipelines without fabricating a new silicon device.
The headline capacity of EP3SE80F780I3 is its 80,000 logic elements, supported by 6,843,392 memory bits and 488 user I/O pins. The large I/O count is significant for parallel data acquisition, communications equipment, industrial controllers, and test systems that need many external connections. The 780-ball FCBGA package provides a high-density surface-mount solution, but it also requires controlled PCB assembly, exact land-pattern compliance, and careful signal-integrity planning.
The reported 800 MHz internal frequency indicates substantial digital processing capability, although the achievable system clock depends on the selected configuration, logic implementation, routing, and timing constraints. The 0.9 V supply voltage is consistent with a low-voltage, high-performance FPGA architecture. Designers must use the manufacturer power guidelines and perform board-level decoupling, distribution, and thermal analysis rather than assuming that the stated internal frequency can be sustained in every design.
Typical applications include high-performance digital signal processing, communications infrastructure, industrial automation, video and imaging interfaces, test and measurement equipment, and reconfigurable computing. Its 488 user I/Os make it particularly relevant when a design must bridge many buses, converters, memories, or control interfaces. The 80,000 logic elements and reported 6,843,392 memory bits provide a useful resource baseline for partitioning datapaths, control logic, packet processing, and protocol bridges.
A key design trade-off is package and power complexity. The 780-ball FCBGA footprint may create routing constraints, assembly yield concerns, and demanding power-delivery requirements. Engineers should validate pin assignments, configuration circuitry, clock distribution, decoupling, and thermal performance against the manufacturer documentation before beginning PCB layout. Secondary sources report an FBGA-1152 designation for the same search result, which conflicts with the primary distributor listing of 780-BBGA/FCBGA; the package designation must therefore be resolved from the official ordering information and package drawing.
This page combines verified distributor identification, package and capacity details, application context, and explicit uncertainty markers. It does not infer missing timing, transceiver, voltage, or compliance specifications. Engineers can use the comparison and design sections to organize validation work, while the official manufacturer datasheet remains the controlling source for pinout, electrical limits, timing, configuration, and assembly requirements.
드롭인 대체품: EP3SE80F780I3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE80F780I3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Logic Elements, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE50F780I3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1245.75 / 개
데이터시트 보기 →EP3SE110F780I3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE80F780C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP3SE80F780I2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3SE80F780I4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP3SE80F780I3 최대 정격 & 전기적 특성
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Memory Bits | 6,843,392 bit |
| User I/O | 488 |
| 패키지 | 780-BBGA, FCBGA |
| Terminal Count | 780 ball |
| Package Code | BGA |
| Package Shape | Square |
| Pitch Of Terminal | 1 mm |
| Internal Frequency | 800 MHz |
| 공급 전압 | 0.9 V |
| 동작 온도 | 0 °C to 85 °C |
| 실장 유형 | Surface Mount |
| Configuration Technology | Field programmable logic |
EP3SE80F780I3 square 핀 구성 가이드
EP3SE80F780I3(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE80F780I3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE80F780I3 적합 용도: 6 애플리케이션s: High-Performance Digital Signal Processing, Communications Infrastructure Equipment, Industrial Automation and Control, Video and Imaging Interfaces, Test and Measurement Equipment, Reconfigurable Computing and Protocol Bridging.
High-Performance Digital Signal Processing
EP3SE80F780I3 fits high-performance digital signal processing where configurable parallel logic and substantial memory resources are required. The verified device listing reports 80,000 logic elements and 6,843,392 memory bits, giving designers a resource baseline for filters, FFT stages, encoders, decoders, and real-time control logic. Its reported 800 MHz internal frequency may support demanding datapaths, but it is not a guaranteed system-clock target. Implementations should be timed with the selected configuration and the manufacturer timing model. The 780-BBGA FCBGA package also supports dense interconnect between processing blocks, memory interfaces, and high-speed I/O. Use careful pipelining and resource sharing to meet timing and power goals.
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Communications Infrastructure Equipment
EP3SE80F780I3 can be used in communications infrastructure equipment that needs programmable packet processing, protocol conversion, traffic management, and multiple external interfaces. The reported 488 user I/Os are useful for aggregating data from network processors, memory devices, optical modules, clocks, and management controllers. The 80,000 logic elements and 6,843,392 memory bits can support parallel queues, framing logic, error handling, and adaptive datapaths. Because the supplied data does not verify transceiver count, lane rate, or I/O standards, designers must consult the official device handbook before selecting this FPGA for a communications interface. Validate signal integrity, reference clocks, and I/O-bank constraints during board planning.
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Industrial Automation and Control
EP3SE80F780I3 is potentially suitable for industrial automation controllers, motion systems, and high-channel-count data acquisition platforms. The verified 488 user I/Os allow the device to connect many sensors, encoders, motor-control peripherals, digital I/O modules, and communication interfaces. Its programmable architecture enables custom control algorithms, protocol bridges, and deterministic processing without a fixed-function controller. The reported 0°C to 85°C operating range is relevant for many controlled industrial environments, but the supplied data does not establish environmental qualification or compliance. Confirm the exact temperature grade, I/O voltage support, package drawing, and lifecycle status. Use isolated interfaces and robust power sequencing where factory electrical transients are possible.
추천
Video and Imaging Interfaces
EP3SE80F780I3 can support video and imaging systems that require pixel processing, frame buffering, format conversion, timing generation, and multiple camera or display interfaces. The reported 80,000 logic elements and 6,843,392 memory bits provide resources for line buffers, color-space conversion, filtering, and synchronization logic. The 488 user I/Os may accommodate parallel image sensors, serializers, memory buses, and control channels. The 800 MHz internal-frequency value is a secondary specification and should not be treated as a guaranteed pixel-clock rate. Confirm supported I/O standards, memory interfaces, clock networks, and electrical timing in the manufacturer documentation. PCB design should control impedance, clock jitter, and simultaneous-switching noise.
추천
Test and Measurement Equipment
EP3SE80F780I3 is a plausible programmable platform for test and measurement equipment requiring parallel acquisition, waveform analysis, protocol emulation, and flexible trigger logic. The reported 488 user I/Os can connect analog-to-digital converters, digital-to-analog converters, memories, clocks, and instrument buses. The 80,000 logic elements and 6,843,392 memory bits can hold capture pipelines, statistical processing, and real-time measurement functions. The reported 800 MHz internal frequency should be validated through timing analysis and the specific instrument clocking scheme. High-density 780-ball FCBGA construction requires controlled impedance, low-noise power distribution, and a verified footprint. Include calibration, reference-clock, and deterministic-latency planning in the architecture review.
추천
Reconfigurable Computing and Protocol Bridging
EP3SE80F780I3 can serve as a reconfigurable computing engine or protocol bridge when a design must connect mismatched buses, processing units, memory systems, or custom peripherals. The reported 80,000 logic elements and 6,843,392 memory bits support adaptable datapaths, buffering, arbitration, and control functions. Its 488 user I/Os are useful when many independent interfaces must coexist. The programmable architecture can also reduce hardware revision risk by allowing late-stage logic changes. The supplied data does not specify the number or performance of transceivers, PLLs, memory controllers, or supported I/O standards, so these capabilities must be confirmed from the official datasheet. Use versioned configuration management and board-level bring-up procedures for production deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE80F780I3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE50F780I3 | EP3SE110F780I3 | EP3SE80F780C3 | EP3SE80F780I2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA | 780-BBGA, FCBGA | 780-BBGA, FCBGA | 780-BBGA, FCBGA |
| Reported Logic Elements | 80,000 | 50,000 | 110,000 | 80,000 | 80,000 |
| Temperature or Speed Suffix | I3 | I3 | I3 | C3 | I2 |
| Verified Drop-in Status | Target MPN | Not validated; capacity differs | Not validated; capacity differs | Not validated; speed suffix differs | Not validated; speed suffix differs |
주요 차별점
- Higher reported logic capacity than EP3SE50F780I3 (vs EP3SE50F780I3)
- Lower reported capacity than EP3SE110F780I3 (vs EP3SE110F780I3)
- I3 temperature and speed suffix (vs EP3SE80F780C3)
- Large reported user-I/O count (vs EP3SE80F1152I3)
설계 노트
Use the official Altera power-estimation flow for EP3SE80F780I3 because the verified data reports only a 0.9 V supply and does not provide complete rail, current, sequencing, or tolerance specifications. Place local decoupling close to the package supply balls, use a low-impedance power plane, and separate noisy interfaces from sensitive reference-clock and configuration networks. The 800 MHz internal-frequency value is a secondary specification, so do not size the power supply from that number alone. Include configuration, PLL, I/O, and memory-interface loads in the worst-case estimate. Review startup sequencing and inrush behavior with the manufacturer reference design before PCB fabrication.
The supplied data reports a 0°C to 85°C operating range but does not provide junction-to-ambient thermal resistance, power dissipation, or derating curves. Estimate total FPGA power from the synthesized design, including logic, memory, clock, I/O, and static losses, then compare the resulting junction temperature with the applicable manufacturer limit. Use a conservative thermal model for the 780-ball FCBGA package and account for board copper, airflow, nearby heat sources, and assembly conditions. Avoid relying on the package name or the 80,000 logic elements as a thermal proxy. Thermal analysis should be repeated after place-and-route and after the final clock and I/O configuration is known.
Resolve the package conflict before layout: the primary DigiKey result identifies 780-BBGA FCBGA, while a secondary result labels the part FBGA-1152. Obtain the official package drawing, ball map, land pattern, and assembly recommendations for the exact ordering code. Preserve continuous reference and ground planes where allowed, keep high-speed routes short, provide controlled impedance for critical interfaces, and place bypass components adjacent to the associated supply balls. Do not derive a 780-ball pinout from the conflicting secondary text. Record the approved package revision and footprint source in the design documentation to prevent an unreviewed land-pattern change.
The reported 800 MHz internal frequency makes signal integrity a first-order concern for clocks, memory interfaces, and high-speed parallel I/O. Confirm supported I/O standards, slew rates, termination, and bank constraints from the official datasheet rather than assuming that every package pin supports every interface. Simulate or measure critical nets with the final stack-up, connector, via, and load configuration. Keep reference-clock routing away from fast switching outputs, maintain return-path continuity, and budget jitter and skew at the receiving device. Use the FPGA timing analyzer with the selected configuration and I/O assignments to establish the actual operating margin.
Do not treat the secondary 800 MHz, 0.9 V, 0°C to 85°C, and FBGA-1152 values as a complete or internally consistent electrical specification. Confirm all values against the official Altera/Intel documentation and the exact MPN ordering table. Before schematic release, verify the pinout, configuration connections, clock inputs, I/O-bank voltage rules, decoupling, programming interface, reset behavior, and power-up sequence. Keep the configuration bitstream under revision control and plan a board bring-up procedure covering JTAG, clock, configuration, memory, and external I/O. Any substitute must demonstrate package and pin compatibility, not merely similar logic capacity.
규정 준수 정보
The supplied web data does not verify RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. The I3 temperature suffix is reported as an ordering designation, not proof of automotive qualification.